IT1202453B - Confezione per componenti di potenza - Google Patents

Confezione per componenti di potenza

Info

Publication number
IT1202453B
IT1202453B IT19214/87A IT1921487A IT1202453B IT 1202453 B IT1202453 B IT 1202453B IT 19214/87 A IT19214/87 A IT 19214/87A IT 1921487 A IT1921487 A IT 1921487A IT 1202453 B IT1202453 B IT 1202453B
Authority
IT
Italy
Prior art keywords
backing material
power component
packaging
power components
cover
Prior art date
Application number
IT19214/87A
Other languages
English (en)
Italian (it)
Other versions
IT8719214A0 (it
Inventor
Dieter Seipler
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IT8719214A0 publication Critical patent/IT8719214A0/it
Application granted granted Critical
Publication of IT1202453B publication Critical patent/IT1202453B/it

Links

Classifications

    • H10W74/114—
    • H10W70/479—
    • H10W70/481—
    • H10W70/692—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H10W72/50—
    • H10W72/5363—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT19214/87A 1986-02-08 1987-01-30 Confezione per componenti di potenza IT1202453B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863604075 DE3604075A1 (de) 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen

Publications (2)

Publication Number Publication Date
IT8719214A0 IT8719214A0 (it) 1987-01-30
IT1202453B true IT1202453B (it) 1989-02-09

Family

ID=6293754

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19214/87A IT1202453B (it) 1986-02-08 1987-01-30 Confezione per componenti di potenza

Country Status (3)

Country Link
JP (1) JPS62193157A (show.php)
DE (1) DE3604075A1 (show.php)
IT (1) IT1202453B (show.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218233A (ja) * 1992-02-06 1993-08-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
RU2118585C1 (ru) * 1997-09-11 1998-09-10 Воеводин Григорий Леонидович Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
RU2641601C2 (ru) * 2016-02-24 2018-01-18 Акционерное Общество "Новосибирский Завод Полупроводниковых Приборов С Окб" (Ао "Нзпп С Окб") Способ пайки силовых полупроводниковых приборов

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
JPS6038867B2 (ja) * 1981-06-05 1985-09-03 株式会社日立製作所 絶縁型半導体装置
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
JPH0810710B2 (ja) * 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置
JPS6135539A (ja) * 1984-07-27 1986-02-20 Nec Corp 半導体装置
JPS61150351A (ja) * 1984-12-25 1986-07-09 Toshiba Corp Ｉｃパツケ−ジ

Also Published As

Publication number Publication date
JPS62193157A (ja) 1987-08-25
JPH0519984B2 (show.php) 1993-03-18
IT8719214A0 (it) 1987-01-30
DE3604075A1 (de) 1987-08-13

Similar Documents

Publication Publication Date Title
IT1294758B1 (it) Contenitore per semiconduttori ad alta potenza a montaggio superficiale perfezionato,e metodo per la sua fabbricazione
EP0114917A3 (en) Semiconductor packages
EP0794572A3 (en) Electronic component, method for making the same, and lead frame and mold assembly for use therein
EP0684645A3 (en) EMF shielding of an integrated circuit package
EP0403992A3 (en) Chip carrier package and method of manufacture
EP0987758A3 (en) Semiconducter device and method of producing the same
KR910007118A (ko) 핀과 반도체 칩사이에 개선된 연결을 갖는 집적 장치 및 그의 제조 방법
EP0944298A3 (de) Gehäuse zur Aufnahme von elektrischen und/oder elektronischen Bauteilen
GB2009504A (en) Protected integrated electrical circuits
IT1202453B (it) Confezione per componenti di potenza
KR100201679B1 (en) Direct thermocompression bonding for thin electronic power chips
JPS56122156A (en) Lead frame for semiconductor device
GB2103420B (en) Gold-plated package for semiconductor devices
GB1273175A (en) Semi-conductor devices
EP0288776A3 (en) Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
CA2017080A1 (en) Semiconductor device package structure
IT1213140B (it) Componente elettronico integrato per assemblaggio di superficie.
JPS647628A (en) Semiconductor device and manufacture thereof
JPS54102971A (en) Semiconductor device
JPS54158171A (en) Resin-sealed type semiconductor device
GB2013027A (en) Integrated circuit packages
KR940005200A (ko) 배선기판상의 배선표면 처리방법
JPH07107921B2 (ja) プラスチツク・パツケ−ジ型半導体装置
JPS5394885A (en) Mount structure for semiconductor laser element
JPS55128837A (en) Base for mounting semiconductor chip