IT1158954B - Processo di fabbricazione di un contatto di tantalio su un substrato semiconduttore di silicio - Google Patents

Processo di fabbricazione di un contatto di tantalio su un substrato semiconduttore di silicio

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Publication number
IT1158954B
IT1158954B IT26099/78A IT2609978A IT1158954B IT 1158954 B IT1158954 B IT 1158954B IT 26099/78 A IT26099/78 A IT 26099/78A IT 2609978 A IT2609978 A IT 2609978A IT 1158954 B IT1158954 B IT 1158954B
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IT
Italy
Prior art keywords
tantalium
contact
manufacturing process
semiconductive substrate
silicon semiconductive
Prior art date
Application number
IT26099/78A
Other languages
English (en)
Other versions
IT7826099A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7826099A0 publication Critical patent/IT7826099A0/it
Application granted granted Critical
Publication of IT1158954B publication Critical patent/IT1158954B/it

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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT26099/78A 1977-08-26 1978-07-26 Processo di fabbricazione di un contatto di tantalio su un substrato semiconduttore di silicio IT1158954B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/827,912 US4215156A (en) 1977-08-26 1977-08-26 Method for fabricating tantalum semiconductor contacts

Publications (2)

Publication Number Publication Date
IT7826099A0 IT7826099A0 (it) 1978-07-26
IT1158954B true IT1158954B (it) 1987-02-25

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IT26099/78A IT1158954B (it) 1977-08-26 1978-07-26 Processo di fabbricazione di un contatto di tantalio su un substrato semiconduttore di silicio

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US (1) US4215156A (it)
EP (1) EP0000743B1 (it)
JP (1) JPS5932069B2 (it)
CA (1) CA1111570A (it)
DE (1) DE2860169D1 (it)
IT (1) IT1158954B (it)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4307132A (en) * 1977-12-27 1981-12-22 International Business Machines Corp. Method for fabricating a contact on a semiconductor substrate by depositing an aluminum oxide diffusion barrier layer
JPS55132068A (en) * 1979-03-30 1980-10-14 Ibm Pnp bipolar transistor
US4412376A (en) * 1979-03-30 1983-11-01 Ibm Corporation Fabrication method for vertical PNP structure with Schottky barrier diode emitter utilizing ion implantation
CA1138795A (en) * 1980-02-19 1983-01-04 Goodrich (B.F.) Company (The) Escape slide and life raft
US4379832A (en) * 1981-08-31 1983-04-12 International Business Machines Corporation Method for making low barrier Schottky devices of the electron beam evaporation of reactive metals
DE3230050A1 (de) * 1982-08-12 1984-02-16 Siemens AG, 1000 Berlin und 8000 München Integrierte halbleiterschaltung mit bipolaren bauelementen und verfahren zur herstellung derselben
JPS59175763A (ja) * 1983-03-25 1984-10-04 Fujitsu Ltd 半導体装置
JPS6113779U (ja) * 1984-06-29 1986-01-27 有限会社 東京巧作所 扉開閉用マグネツトキヤツチヤ−
JPS6143360U (ja) * 1984-08-24 1986-03-20 有限会社 東京巧作所 扉開閉用マグネツトキヤツチヤ−
JPH0315737Y2 (it) * 1984-10-30 1991-04-05
JPS6116568A (ja) * 1984-07-03 1986-01-24 Matsushita Electronics Corp シヨツトキ障壁形半導体装置
EP0194569B1 (de) * 1985-03-13 1989-07-26 Siemens Aktiengesellschaft Dünnfilmschichtaufbau mit einer reaktiven Zwischenschicht für integrierte Halbleiterschaltungen
EP0252667B1 (en) * 1986-06-30 1996-03-27 Nihon Sinku Gijutsu Kabushiki Kaisha Chemical vapour deposition methods
US4994301A (en) * 1986-06-30 1991-02-19 Nihon Sinku Gijutsu Kabusiki Kaisha ACVD (chemical vapor deposition) method for selectively depositing metal on a substrate
JP2620240B2 (ja) * 1987-06-10 1997-06-11 株式会社日立製作所 液晶表示装置
US5155565A (en) * 1988-02-05 1992-10-13 Minnesota Mining And Manufacturing Company Method for manufacturing an amorphous silicon thin film solar cell and Schottky diode on a common substrate
US5116464A (en) * 1989-06-02 1992-05-26 Massachusetts Institute Of Technology Cesium hydroxide etch of a semiconductor crystal
US6183685B1 (en) 1990-06-26 2001-02-06 Littlefuse Inc. Varistor manufacturing method
US5402254B1 (en) * 1990-10-17 1998-09-22 Hitachi Ltd Liquid crystal display device with tfts in which pixel electrodes are formed in the same plane as the gate electrodes with anodized oxide films before the deposition of silicon
US5221638A (en) * 1991-09-10 1993-06-22 Sanken Electric Co., Ltd. Method of manufacturing a Schottky barrier semiconductor device
JP3562588B2 (ja) 1993-02-15 2004-09-08 株式会社半導体エネルギー研究所 半導体装置の製造方法
US6997985B1 (en) 1993-02-15 2006-02-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor, semiconductor device, and method for fabricating the same
US6326601B1 (en) * 1999-07-19 2001-12-04 Agilent Technologies, Inc. Optical barrier
US7554829B2 (en) 1999-07-30 2009-06-30 Micron Technology, Inc. Transmission lines for CMOS integrated circuits
DE10011886A1 (de) * 2000-03-07 2001-09-20 Infineon Technologies Ag Verfahren zur Herstellung einer Leiterstruktur für einen integrierten Schaltkreis
US6271068B1 (en) * 2001-01-08 2001-08-07 Taiwan Semiconductor Manufacturing Company Method for making improved polysilicon emitters for bipolar transistors on BiCMOS integrated circuits
US6852167B2 (en) 2001-03-01 2005-02-08 Micron Technology, Inc. Methods, systems, and apparatus for uniform chemical-vapor depositions
US8026161B2 (en) 2001-08-30 2011-09-27 Micron Technology, Inc. Highly reliable amorphous high-K gate oxide ZrO2
US6844203B2 (en) 2001-08-30 2005-01-18 Micron Technology, Inc. Gate oxides, and methods of forming
US6953730B2 (en) 2001-12-20 2005-10-11 Micron Technology, Inc. Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics
US6900122B2 (en) 2001-12-20 2005-05-31 Micron Technology, Inc. Low-temperature grown high-quality ultra-thin praseodymium gate dielectrics
US6767795B2 (en) * 2002-01-17 2004-07-27 Micron Technology, Inc. Highly reliable amorphous high-k gate dielectric ZrOXNY
US6812100B2 (en) * 2002-03-13 2004-11-02 Micron Technology, Inc. Evaporation of Y-Si-O films for medium-k dielectrics
US7160577B2 (en) 2002-05-02 2007-01-09 Micron Technology, Inc. Methods for atomic-layer deposition of aluminum oxides in integrated circuits
US7045430B2 (en) 2002-05-02 2006-05-16 Micron Technology Inc. Atomic layer-deposited LaAlO3 films for gate dielectrics
US7589029B2 (en) 2002-05-02 2009-09-15 Micron Technology, Inc. Atomic layer deposition and conversion
US7135421B2 (en) 2002-06-05 2006-11-14 Micron Technology, Inc. Atomic layer-deposited hafnium aluminum oxide
US7205218B2 (en) * 2002-06-05 2007-04-17 Micron Technology, Inc. Method including forming gate dielectrics having multiple lanthanide oxide layers
US7193893B2 (en) 2002-06-21 2007-03-20 Micron Technology, Inc. Write once read only memory employing floating gates
US6804136B2 (en) 2002-06-21 2004-10-12 Micron Technology, Inc. Write once read only memory employing charge trapping in insulators
US7221017B2 (en) 2002-07-08 2007-05-22 Micron Technology, Inc. Memory utilizing oxide-conductor nanolaminates
US7221586B2 (en) 2002-07-08 2007-05-22 Micron Technology, Inc. Memory utilizing oxide nanolaminates
US6921702B2 (en) 2002-07-30 2005-07-26 Micron Technology Inc. Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics
US6790791B2 (en) 2002-08-15 2004-09-14 Micron Technology, Inc. Lanthanide doped TiOx dielectric films
US6884739B2 (en) 2002-08-15 2005-04-26 Micron Technology Inc. Lanthanide doped TiOx dielectric films by plasma oxidation
US20040036129A1 (en) * 2002-08-22 2004-02-26 Micron Technology, Inc. Atomic layer deposition of CMOS gates with variable work functions
US6967154B2 (en) * 2002-08-26 2005-11-22 Micron Technology, Inc. Enhanced atomic layer deposition
US7199023B2 (en) 2002-08-28 2007-04-03 Micron Technology, Inc. Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed
US7101813B2 (en) 2002-12-04 2006-09-05 Micron Technology Inc. Atomic layer deposited Zr-Sn-Ti-O films
US6958302B2 (en) 2002-12-04 2005-10-25 Micron Technology, Inc. Atomic layer deposited Zr-Sn-Ti-O films using TiI4
US7192892B2 (en) 2003-03-04 2007-03-20 Micron Technology, Inc. Atomic layer deposited dielectric layers
US7220665B2 (en) * 2003-08-05 2007-05-22 Micron Technology, Inc. H2 plasma treatment
US6955932B2 (en) * 2003-10-29 2005-10-18 International Business Machines Corporation Single and double-gate pseudo-FET devices for semiconductor materials evaluation
US20050233477A1 (en) * 2004-03-05 2005-10-20 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and program for implementing the method
US7498247B2 (en) 2005-02-23 2009-03-03 Micron Technology, Inc. Atomic layer deposition of Hf3N4/HfO2 films as gate dielectrics
US7687409B2 (en) 2005-03-29 2010-03-30 Micron Technology, Inc. Atomic layer deposited titanium silicon oxide films
US7662729B2 (en) 2005-04-28 2010-02-16 Micron Technology, Inc. Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer
US20070013014A1 (en) * 2005-05-03 2007-01-18 Shuwen Guo High temperature resistant solid state pressure sensor
US7628309B1 (en) * 2005-05-03 2009-12-08 Rosemount Aerospace Inc. Transient liquid phase eutectic bonding
US7400042B2 (en) * 2005-05-03 2008-07-15 Rosemount Aerospace Inc. Substrate with adhesive bonding metallization with diffusion barrier
US7538401B2 (en) * 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
EP1949437B2 (en) * 2005-11-02 2021-08-04 Second Sight Medical Products, Inc. Implantable microelectronic device and method of manufacture
US7709402B2 (en) 2006-02-16 2010-05-04 Micron Technology, Inc. Conductive layers for hafnium silicon oxynitride films
US7563730B2 (en) 2006-08-31 2009-07-21 Micron Technology, Inc. Hafnium lanthanide oxynitride films

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3442012A (en) * 1967-08-03 1969-05-06 Teledyne Inc Method of forming a flip-chip integrated circuit
US3567508A (en) * 1968-10-31 1971-03-02 Gen Electric Low temperature-high vacuum contact formation process
US3662458A (en) * 1969-06-20 1972-05-16 Westinghouse Electric Corp Electrical contact for silicon carbide members
US3820236A (en) * 1969-06-20 1974-06-28 Texas Instruments Inc Method of making metal semiconductor diodes having plated heat sink members
GB1290926A (it) * 1969-06-20 1972-09-27
US3663279A (en) * 1969-11-19 1972-05-16 Bell Telephone Labor Inc Passivated semiconductor devices
US3641402A (en) * 1969-12-30 1972-02-08 Ibm Semiconductor device with beta tantalum-gold composite conductor metallurgy
US3967371A (en) * 1970-01-06 1976-07-06 Sescosem- Societe Europeenne Des Semi-Conducteurs Et De Microelectronique Methods of manufacturing multilayer interconnections for integrated circuits and to integrated circuits utilizing said method
US3652905A (en) * 1970-05-26 1972-03-28 Westinghouse Electric Corp Schottky barrier power rectifier
DE2057204C3 (de) * 1970-11-20 1975-02-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von Metall-Halbleiterkontakten
US3939047A (en) * 1971-11-15 1976-02-17 Nippon Electric Co., Ltd. Method for fabricating electrode structure for a semiconductor device having a shallow junction
JPS557020B2 (it) * 1971-11-15 1980-02-21
NL163370C (nl) * 1972-04-28 1980-08-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
US3906540A (en) * 1973-04-02 1975-09-16 Nat Semiconductor Corp Metal-silicide Schottky diode employing an aluminum connector
US3923975A (en) * 1973-10-09 1975-12-02 Cutler Hammer Inc Tantalum-gallium arsenide schottky barrier semiconductor device
US3900944A (en) * 1973-12-19 1975-08-26 Texas Instruments Inc Method of contacting and connecting semiconductor devices in integrated circuits
US4035208A (en) * 1974-09-03 1977-07-12 Texas Instruments Incorporated Method of patterning Cr-Pt-Au metallization for silicon devices
JPS5136878A (en) * 1974-09-14 1976-03-27 Tokyo Shibaura Electric Co Handotaisochi no seizohoho
NL7510586A (nl) * 1975-09-09 1977-03-11 Philips Nv Werkwijze voor het vervaardigen van een la- dingsoverdrachtinrichting en ladingsoverdracht- inrichting vervaardigd met behulp van de werk- wijze.

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EP0000743A1 (de) 1979-02-21
DE2860169D1 (en) 1980-12-18
EP0000743B1 (de) 1980-09-17
US4215156A (en) 1980-07-29
JPS5932069B2 (ja) 1984-08-06
JPS5436178A (en) 1979-03-16
CA1111570A (en) 1981-10-27
IT7826099A0 (it) 1978-07-26

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