IT1140271B - SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS PRODUCTION - Google Patents

SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS PRODUCTION

Info

Publication number
IT1140271B
IT1140271B IT24891/81A IT2489181A IT1140271B IT 1140271 B IT1140271 B IT 1140271B IT 24891/81 A IT24891/81 A IT 24891/81A IT 2489181 A IT2489181 A IT 2489181A IT 1140271 B IT1140271 B IT 1140271B
Authority
IT
Italy
Prior art keywords
procedure
production
semiconductor device
semiconductor
Prior art date
Application number
IT24891/81A
Other languages
Italian (it)
Other versions
IT8124891A0 (en
Inventor
Kasahara Osamu
Shimizu Shinji
Miyazawa Hiroyuki
Nakata Kensuke
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8124891A0 publication Critical patent/IT8124891A0/en
Application granted granted Critical
Publication of IT1140271B publication Critical patent/IT1140271B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT24891/81A 1980-11-07 1981-11-05 SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS PRODUCTION IT1140271B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55155945A JPS5780739A (en) 1980-11-07 1980-11-07 Semiconductor integrated circuit device and manufacture thereof

Publications (2)

Publication Number Publication Date
IT8124891A0 IT8124891A0 (en) 1981-11-05
IT1140271B true IT1140271B (en) 1986-09-24

Family

ID=15616950

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24891/81A IT1140271B (en) 1980-11-07 1981-11-05 SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS PRODUCTION

Country Status (7)

Country Link
JP (1) JPS5780739A (en)
DE (1) DE3141195A1 (en)
FR (1) FR2494042B1 (en)
GB (2) GB2087148B (en)
HK (2) HK44686A (en)
IT (1) IT1140271B (en)
MY (1) MY8600583A (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194567A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Semiconductor memory device
FR2519461A1 (en) * 1982-01-06 1983-07-08 Hitachi Ltd SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE
DE3218309A1 (en) * 1982-05-14 1983-11-17 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING INTEGRATED MOS FIELD EFFECT TRANSISTORS WITH AN ADDITIONAL CIRCUIT LEVEL, MADE OF METAL SILICIDES
JPS593968A (en) * 1982-06-29 1984-01-10 Mitsubishi Electric Corp Semiconductor integrated circuit device
US5136361A (en) * 1982-09-30 1992-08-04 Advanced Micro Devices, Inc. Stratified interconnect structure for integrated circuits
JPS59501845A (en) * 1982-09-30 1984-11-01 アドバンスト・マイクロ・ディバイシズ・インコ−ポレ−テッド Aluminum-metal silicide interconnect structure for integrated circuits and method of manufacturing the same
DE3304651A1 (en) * 1983-02-10 1984-08-16 Siemens AG, 1000 Berlin und 8000 München DYNAMIC SEMICONDUCTOR MEMORY CELL WITH OPTIONAL ACCESS (DRAM) AND METHOD FOR THEIR PRODUCTION
GB2140203B (en) * 1983-03-15 1987-01-14 Canon Kk Thin film transistor with wiring layer continuous with the source and drain
GB2139419A (en) * 1983-05-05 1984-11-07 Standard Telephones Cables Ltd Semiconductor devices
FR2555364B1 (en) * 1983-11-18 1990-02-02 Hitachi Ltd METHOD FOR MANUFACTURING CONNECTIONS OF A DEVICE WITH INTEGRATED SEMICONDUCTOR CIRCUITS INCLUDING IN PARTICULAR A MITSET
JPS60134466A (en) * 1983-12-23 1985-07-17 Hitachi Ltd Semiconductor device and manufacture thereof
JPH067584B2 (en) * 1984-04-05 1994-01-26 日本電気株式会社 Semiconductor memory
DE3686490T2 (en) * 1985-01-22 1993-03-18 Fairchild Semiconductor SEMICONDUCTOR STRUCTURE.
US5045916A (en) * 1985-01-22 1991-09-03 Fairchild Semiconductor Corporation Extended silicide and external contact technology
US5227316A (en) * 1985-01-22 1993-07-13 National Semiconductor Corporation Method of forming self aligned extended base contact for a bipolar transistor having reduced cell size
US5061986A (en) * 1985-01-22 1991-10-29 National Semiconductor Corporation Self-aligned extended base contact for a bipolar transistor having reduced cell size and improved electrical characteristics
US5100824A (en) * 1985-04-01 1992-03-31 National Semiconductor Corporation Method of making small contactless RAM cell
US5072275A (en) * 1986-02-28 1991-12-10 Fairchild Semiconductor Corporation Small contactless RAM cell
US5340762A (en) * 1985-04-01 1994-08-23 Fairchild Semiconductor Corporation Method of making small contactless RAM cell
JPS61248446A (en) * 1985-04-25 1986-11-05 Fujitsu Ltd semiconductor equipment
JPS61248447A (en) * 1985-04-25 1986-11-05 Fujitsu Ltd Formation of wiring layer
CA1235824A (en) * 1985-06-28 1988-04-26 Vu Q. Ho Vlsi mosfet circuits using refractory metal and/or refractory metal silicide
SE8603963L (en) * 1985-09-27 1987-03-28 Rca Corp CONTACT WITH LAW RESISTANCE FOR A SEMICONDUCTOR ORGAN AND SETTING TO MAKE IT
US4638400A (en) * 1985-10-24 1987-01-20 General Electric Company Refractory metal capacitor structures, particularly for analog integrated circuit devices
US4774207A (en) * 1987-04-20 1988-09-27 General Electric Company Method for producing high yield electrical contacts to N+ amorphous silicon
US4990995A (en) * 1987-09-08 1991-02-05 General Electric Company Low reflectance conductor in an integrated circuit
DE19836736C1 (en) * 1998-08-13 1999-12-30 Siemens Ag Combination type precharging and equalising-circuit for semiconductor memory device
US6265297B1 (en) 1999-09-01 2001-07-24 Micron Technology, Inc. Ammonia passivation of metal gate electrodes to inhibit oxidation of metal
US6458714B1 (en) 2000-11-22 2002-10-01 Micron Technology, Inc. Method of selective oxidation in semiconductor manufacture

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813583B1 (en) * 1969-04-15 1973-04-27
JPS5295886A (en) * 1976-02-07 1977-08-11 Zaisui Ri Automatic treating movable scraps presser
JPS5380986A (en) * 1976-12-25 1978-07-17 Toshiba Corp Manufacture of semiconductor device
JPS583380B2 (en) * 1977-03-04 1983-01-21 株式会社日立製作所 Semiconductor device and its manufacturing method
US4141022A (en) * 1977-09-12 1979-02-20 Signetics Corporation Refractory metal contacts for IGFETS
JPS6032976B2 (en) * 1977-11-02 1985-07-31 日本電気株式会社 Integrated circuit manufacturing method
US4128670A (en) * 1977-11-11 1978-12-05 International Business Machines Corporation Fabrication method for integrated circuits with polysilicon lines having low sheet resistance
JPS5488783A (en) * 1977-12-26 1979-07-14 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor
IT1110843B (en) * 1978-02-27 1986-01-06 Rca Corp Sunken contact for complementary type MOS devices
US4218291A (en) * 1978-02-28 1980-08-19 Vlsi Technology Research Association Process for forming metal and metal silicide films
IT1111823B (en) * 1978-03-17 1986-01-13 Rca Corp LOW SURFACE RESISTANCE MOSFET DEVICE AND ITS MANUFACTURING METHOD
DE2815605C3 (en) * 1978-04-11 1981-04-16 Siemens AG, 1000 Berlin und 8000 München Semiconductor memory with control lines of high conductivity
DE2823855A1 (en) * 1978-05-31 1979-12-06 Fujitsu Ltd Contact prodn. in semiconductor device with multiple wiring layers - using reactive metal film in contact hole between two aluminium layers to prevent faults
GB2061615A (en) * 1979-10-25 1981-05-13 Gen Electric Composite conductors for integrated circuits
JPS5698873A (en) * 1980-01-07 1981-08-08 Nec Corp Integrated circuit

Also Published As

Publication number Publication date
FR2494042B1 (en) 1986-12-26
HK44686A (en) 1986-06-27
GB2087148A (en) 1982-05-19
GB2134706B (en) 1985-04-17
GB2087148B (en) 1985-04-11
GB2134706A (en) 1984-08-15
IT8124891A0 (en) 1981-11-05
DE3141195A1 (en) 1982-06-24
DE3141195C2 (en) 1993-04-22
FR2494042A1 (en) 1982-05-14
JPS5780739A (en) 1982-05-20
HK70586A (en) 1986-09-26
MY8600583A (en) 1986-12-31
GB8331916D0 (en) 1984-01-04

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951128