IT8222563A0 - SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS MANUFACTURE. - Google Patents

SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS MANUFACTURE.

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Publication number
IT8222563A0
IT8222563A0 IT8222563A IT2256382A IT8222563A0 IT 8222563 A0 IT8222563 A0 IT 8222563A0 IT 8222563 A IT8222563 A IT 8222563A IT 2256382 A IT2256382 A IT 2256382A IT 8222563 A0 IT8222563 A0 IT 8222563A0
Authority
IT
Italy
Prior art keywords
procedure
manufacture
semiconductor device
semiconductor
Prior art date
Application number
IT8222563A
Other languages
Italian (it)
Other versions
IT1152455B (en
Inventor
Tamotsu Usami
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56115082A external-priority patent/JPS5817629A/en
Priority claimed from JP56115081A external-priority patent/JPS5817628A/en
Priority claimed from JP56115080A external-priority patent/JPS5817627A/en
Priority claimed from JP56122994A external-priority patent/JPS5825241A/en
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8222563A0 publication Critical patent/IT8222563A0/en
Application granted granted Critical
Publication of IT1152455B publication Critical patent/IT1152455B/en

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT22563/82A 1981-07-24 1982-07-23 SEMICONDUCTOR DEVICE AND PROCEDURE FOR ITS MANUFACTURE IT1152455B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56115082A JPS5817629A (en) 1981-07-24 1981-07-24 Manufacture of semiconductor integrated circuit device
JP56115081A JPS5817628A (en) 1981-07-24 1981-07-24 Semiconductor integrated circuit device and manufacture thereof
JP56115080A JPS5817627A (en) 1981-07-24 1981-07-24 Semiconductor integrated circuit device and manufacture thereof
JP56122994A JPS5825241A (en) 1981-08-07 1981-08-07 Manufacture of semiconductor i.c. device

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IT8222563A0 true IT8222563A0 (en) 1982-07-23
IT1152455B IT1152455B (en) 1986-12-31

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FR (1) FR2510307A1 (en)
GB (3) GB2105107B (en)
HK (3) HK45886A (en)
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US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
JP2598328B2 (en) * 1989-10-17 1997-04-09 三菱電機株式会社 Semiconductor device and manufacturing method thereof
DE19736090B4 (en) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Protective layer device and method for producing a protective layer for a device
WO2000074131A1 (en) * 1999-05-31 2000-12-07 Infineon Technologies A.G. A method of assembling a semiconductor device package
GB0018643D0 (en) * 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
EP2092561B1 (en) 2006-11-13 2013-04-10 Nxp B.V. Bond pad structure and method for producing same
CN110911353A (en) * 2019-12-05 2020-03-24 上海华虹宏力半导体制造有限公司 Method for forming conductive interconnection line
JP7305587B2 (en) 2020-03-17 2023-07-10 株式会社東芝 Semiconductor equipment and inspection equipment

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US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit
DE2243011C3 (en) * 1972-09-01 1982-04-01 Deutsche Itt Industries Gmbh, 7800 Freiburg Method for producing a thermocompression contact
DE2403149A1 (en) * 1974-01-23 1975-07-24 Siemens Ag Semiconductor device with protective silica-based film - including mixture or cpd. of silica and alumina
JPS5851425B2 (en) * 1975-08-22 1983-11-16 株式会社日立製作所 Hand tie souchi
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

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GB8402099D0 (en) 1984-02-29
GB2135121A (en) 1984-08-22
DE3227606A1 (en) 1983-03-03
FR2510307A1 (en) 1983-01-28
GB2134709B (en) 1985-07-31
IT1152455B (en) 1986-12-31
GB2135121B (en) 1985-08-07
GB2105107A (en) 1983-03-16
MY8700228A (en) 1987-12-31
GB8402057D0 (en) 1984-02-29
HK46686A (en) 1986-06-27
GB2134709A (en) 1984-08-15
HK45886A (en) 1986-06-27
MY8600558A (en) 1986-12-31
FR2510307B1 (en) 1984-11-30
HK46786A (en) 1986-06-27
GB2105107B (en) 1985-07-31

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