FR2510307B1 - - Google Patents

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Publication number
FR2510307B1
FR2510307B1 FR8211728A FR8211728A FR2510307B1 FR 2510307 B1 FR2510307 B1 FR 2510307B1 FR 8211728 A FR8211728 A FR 8211728A FR 8211728 A FR8211728 A FR 8211728A FR 2510307 B1 FR2510307 B1 FR 2510307B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8211728A
Other languages
French (fr)
Other versions
FR2510307A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56115081A external-priority patent/JPS5817628A/en
Priority claimed from JP56115082A external-priority patent/JPS5817629A/en
Priority claimed from JP56115080A external-priority patent/JPS5817627A/en
Priority claimed from JP56122994A external-priority patent/JPS5825241A/en
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2510307A1 publication Critical patent/FR2510307A1/en
Application granted granted Critical
Publication of FR2510307B1 publication Critical patent/FR2510307B1/fr
Granted legal-status Critical Current

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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/181—Encapsulation
FR8211728A 1981-07-24 1982-07-05 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE Granted FR2510307A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56115081A JPS5817628A (en) 1981-07-24 1981-07-24 Semiconductor integrated circuit device and manufacture thereof
JP56115082A JPS5817629A (en) 1981-07-24 1981-07-24 Manufacture of semiconductor integrated circuit device
JP56115080A JPS5817627A (en) 1981-07-24 1981-07-24 Semiconductor integrated circuit device and manufacture thereof
JP56122994A JPS5825241A (en) 1981-08-07 1981-08-07 Manufacture of semiconductor i.c. device

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Publication Number Publication Date
FR2510307A1 FR2510307A1 (en) 1983-01-28
FR2510307B1 true FR2510307B1 (en) 1984-11-30

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FR8211728A Granted FR2510307A1 (en) 1981-07-24 1982-07-05 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

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DE (1) DE3227606A1 (en)
FR (1) FR2510307A1 (en)
GB (3) GB2105107B (en)
HK (3) HK46786A (en)
IT (1) IT1152455B (en)
MY (2) MY8600558A (en)

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US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
JP2598328B2 (en) * 1989-10-17 1997-04-09 三菱電機株式会社 Semiconductor device and manufacturing method thereof
DE19736090B4 (en) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Protective layer device and method for producing a protective layer for a device
EP1188182B1 (en) * 1999-05-31 2012-08-22 Infineon Technologies AG A method of assembling a semiconductor device package
GB0018643D0 (en) * 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
EP2092561B1 (en) 2006-11-13 2013-04-10 Nxp B.V. Bond pad structure and method for producing same
CN110911353A (en) * 2019-12-05 2020-03-24 上海华虹宏力半导体制造有限公司 Method for forming conductive interconnection line

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Publication number Priority date Publication date Assignee Title
US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit
DE2243011C3 (en) * 1972-09-01 1982-04-01 Deutsche Itt Industries Gmbh, 7800 Freiburg Method for producing a thermocompression contact
DE2403149A1 (en) * 1974-01-23 1975-07-24 Siemens Ag Semiconductor device with protective silica-based film - including mixture or cpd. of silica and alumina
JPS5851425B2 (en) * 1975-08-22 1983-11-16 株式会社日立製作所 Hand tie souchi
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

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GB2105107A (en) 1983-03-16
IT1152455B (en) 1986-12-31
FR2510307A1 (en) 1983-01-28
DE3227606A1 (en) 1983-03-03
IT8222563A0 (en) 1982-07-23
GB2105107B (en) 1985-07-31
GB2134709B (en) 1985-07-31
HK46786A (en) 1986-06-27
MY8700228A (en) 1987-12-31
GB8402099D0 (en) 1984-02-29
HK46686A (en) 1986-06-27
GB2134709A (en) 1984-08-15
MY8600558A (en) 1986-12-31
GB2135121B (en) 1985-08-07
HK45886A (en) 1986-06-27
GB8402057D0 (en) 1984-02-29
GB2135121A (en) 1984-08-22

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