IT8221211A0 - SEMICONDUCTOR MEMORY DEVICE AND PROCEDURE FOR ITS MANUFACTURE. - Google Patents
SEMICONDUCTOR MEMORY DEVICE AND PROCEDURE FOR ITS MANUFACTURE.Info
- Publication number
- IT8221211A0 IT8221211A0 IT8221211A IT2121182A IT8221211A0 IT 8221211 A0 IT8221211 A0 IT 8221211A0 IT 8221211 A IT8221211 A IT 8221211A IT 2121182 A IT2121182 A IT 2121182A IT 8221211 A0 IT8221211 A0 IT 8221211A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacture
- memory device
- semiconductor memory
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28211—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a gaseous ambient using an oxygen or a water vapour, e.g. RTO, possibly through a layer
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56070732A JPS57186354A (en) | 1981-05-13 | 1981-05-13 | Semiconductor memory storage and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8221211A0 true IT8221211A0 (en) | 1982-05-12 |
| IT1152129B IT1152129B (en) | 1986-12-31 |
Family
ID=13439994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT21211/82A IT1152129B (en) | 1981-05-13 | 1982-05-12 | SEMICONDUCTOR MEMORY DEVICE AND PROCESS FOR ITS MANUFACTURE |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS57186354A (en) |
| KR (1) | KR840000082A (en) |
| DE (1) | DE3217896A1 (en) |
| FR (1) | FR2506058A1 (en) |
| GB (1) | GB2098397A (en) |
| IT (1) | IT1152129B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2519461A1 (en) * | 1982-01-06 | 1983-07-08 | Hitachi Ltd | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE |
| JPS58181319A (en) * | 1982-04-19 | 1983-10-24 | Hitachi Ltd | Timing generating circuit |
| JPH0612619B2 (en) * | 1982-09-22 | 1994-02-16 | 株式会社日立製作所 | Semiconductor memory device |
| JPS59172761A (en) * | 1983-03-23 | 1984-09-29 | Hitachi Ltd | Semiconductor device |
| US4617471A (en) * | 1983-12-27 | 1986-10-14 | Kabushiki Kaisha Toshiba | Image sensing device |
| JPS60206163A (en) * | 1984-03-30 | 1985-10-17 | Toshiba Corp | Semiconductor memory device |
| JPS6421788A (en) * | 1987-07-16 | 1989-01-25 | Nec Corp | Semiconductor memory device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2130908A1 (en) * | 1970-06-22 | 1971-12-30 | Cogar Corp | Storage cell with metal oxide semiconductor devices with different slopes |
| DE2646245A1 (en) * | 1975-10-28 | 1977-05-05 | Motorola Inc | MEMORY CIRCUIT |
| DE2633558C2 (en) * | 1976-07-26 | 1978-08-03 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Memory chip |
| JPS53112686A (en) * | 1977-03-14 | 1978-10-02 | Oki Electric Ind Co Ltd | Manufacture for semiconductor device |
| JPS5559759A (en) * | 1978-10-27 | 1980-05-06 | Hitachi Ltd | Semiconductor device |
-
1981
- 1981-05-13 JP JP56070732A patent/JPS57186354A/en active Pending
-
1982
- 1982-04-27 GB GB8212113A patent/GB2098397A/en not_active Withdrawn
- 1982-05-07 FR FR8207966A patent/FR2506058A1/en active Granted
- 1982-05-10 KR KR1019820002028A patent/KR840000082A/en not_active Withdrawn
- 1982-05-12 IT IT21211/82A patent/IT1152129B/en active
- 1982-05-12 DE DE19823217896 patent/DE3217896A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| IT1152129B (en) | 1986-12-31 |
| JPS57186354A (en) | 1982-11-16 |
| FR2506058B1 (en) | 1985-04-12 |
| KR840000082A (en) | 1984-01-30 |
| FR2506058A1 (en) | 1982-11-19 |
| GB2098397A (en) | 1982-11-17 |
| DE3217896A1 (en) | 1983-05-26 |
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