IT1128314B - Gruppo prefabbricato di piatre metalliche composte termotrasmittenti - Google Patents
Gruppo prefabbricato di piatre metalliche composte termotrasmittentiInfo
- Publication number
- IT1128314B IT1128314B IT48589/80A IT4858980A IT1128314B IT 1128314 B IT1128314 B IT 1128314B IT 48589/80 A IT48589/80 A IT 48589/80A IT 4858980 A IT4858980 A IT 4858980A IT 1128314 B IT1128314 B IT 1128314B
- Authority
- IT
- Italy
- Prior art keywords
- metal plates
- compound metal
- thermal transmitter
- prefabricated group
- transmitter compound
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/087—Heat exchange elements made from metals or metal alloys from nickel or nickel alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/037,236 US4283464A (en) | 1979-05-08 | 1979-05-08 | Prefabricated composite metallic heat-transmitting plate unit |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8048589A0 IT8048589A0 (it) | 1980-05-05 |
IT1128314B true IT1128314B (it) | 1986-05-28 |
Family
ID=21893218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT48589/80A IT1128314B (it) | 1979-05-08 | 1980-05-05 | Gruppo prefabbricato di piatre metalliche composte termotrasmittenti |
Country Status (8)
Country | Link |
---|---|
US (1) | US4283464A (it) |
JP (1) | JPS55159967A (it) |
CA (1) | CA1136289A (it) |
DE (1) | DE3017514A1 (it) |
FR (1) | FR2456298B1 (it) |
GB (1) | GB2048567B (it) |
IT (1) | IT1128314B (it) |
NL (1) | NL8002585A (it) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4320412A (en) * | 1977-06-23 | 1982-03-16 | Western Electric Co., Inc. | Composite material for mounting electronic devices |
SE420964B (sv) * | 1980-03-27 | 1981-11-09 | Asea Ab | Kompositmaterial och sett for dess framstellning |
US4427993A (en) * | 1980-11-21 | 1984-01-24 | General Electric Company | Thermal stress relieving bimetallic plate |
GB8308751D0 (en) * | 1983-03-30 | 1983-05-11 | Era Patents Ltd | Mounting of semiconductor devices |
JPS6053037A (ja) * | 1983-09-01 | 1985-03-26 | Sumitomo Electric Ind Ltd | 半導体素子臀載用多層複合金属条 |
JPH061787B2 (ja) * | 1983-09-20 | 1994-01-05 | 住友電気工業株式会社 | 半導体装置用基板 |
US4650922A (en) * | 1985-03-11 | 1987-03-17 | Texas Instruments Incorporated | Thermally matched mounting substrate |
US4894293A (en) * | 1988-03-10 | 1990-01-16 | Texas Instruments Incorporated | Circuit system, a composite metal material for use therein, and a method for making the material |
US4885214A (en) * | 1988-03-10 | 1989-12-05 | Texas Instruments Incorporated | Composite material and methods for making |
US5015533A (en) * | 1988-03-10 | 1991-05-14 | Texas Instruments Incorporated | Member of a refractory metal material of selected shape and method of making |
US4836979A (en) * | 1988-06-14 | 1989-06-06 | Inco Limited | Manufacture of composite structures |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US5039335A (en) * | 1988-10-21 | 1991-08-13 | Texas Instruments Incorporated | Composite material for a circuit system and method of making |
CA1316303C (en) * | 1988-12-23 | 1993-04-20 | Thijs Eerkes | Composite structure |
JPH02231751A (ja) * | 1989-03-03 | 1990-09-13 | Sumitomo Special Metals Co Ltd | リードフレーム用材料 |
US5151777A (en) * | 1989-03-03 | 1992-09-29 | Delco Electronics Corporation | Interface device for thermally coupling an integrated circuit to a heat sink |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
JPH03136338A (ja) * | 1989-10-23 | 1991-06-11 | Mitsubishi Electric Corp | 半導体装置およびその製造のためのロウ付け方法 |
US5300809A (en) * | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
ATE182720T1 (de) * | 1989-12-12 | 1999-08-15 | Sumitomo Spec Metals | Wärmeleitendes mischmaterial |
US4994903A (en) * | 1989-12-18 | 1991-02-19 | Texas Instruments Incorporated | Circuit substrate and circuit using the substrate |
US5011655A (en) * | 1989-12-22 | 1991-04-30 | Inco Alloys International, Inc. | Process of forming a composite structure |
DE69211216T2 (de) * | 1991-03-27 | 1996-11-07 | Seb Sa | Formteil hergestellt aus einer verhältnismässig weichen Metallplatte und Kochgefäss mit einem solchen Formteil |
EP0537965B1 (en) * | 1991-10-12 | 1997-03-05 | Sumitomo Special Metals Company Limited | Process of manufacturing a heat-conductive material |
US5156923A (en) * | 1992-01-06 | 1992-10-20 | Texas Instruments Incorporated | Heat-transferring circuit substrate with limited thermal expansion and method for making |
DE4217531C1 (de) * | 1992-05-27 | 1993-12-16 | Wieland Werke Ag | Verfahren zur Herstellung schlickergegossener isotroper Verbundwerkstoffe auf Kupferbasis mit geringem thermischem Ausdehnungskoeffizienten und hoher elektrischer Leitfähigkeit sowie deren Verwendung |
US5310520A (en) * | 1993-01-29 | 1994-05-10 | Texas Instruments Incorporated | Circuit system, a composite material for use therein, and a method of making the material |
US5975201A (en) * | 1994-10-31 | 1999-11-02 | The Johns Hopkins University | Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures |
US5681663A (en) * | 1995-06-09 | 1997-10-28 | Ford Motor Company | Heatspreader carrier strip |
KR19990028818A (ko) * | 1995-07-14 | 1999-04-15 | 와인스타인 폴 | 금속 볼 그리드 전자 패키지 |
JPH10513611A (ja) * | 1995-09-27 | 1998-12-22 | テキサス インスツルメンツ インコーポレイテッド | Z軸電導フィルムを含むマイクロ電子組立体 |
JPH09312361A (ja) * | 1996-05-22 | 1997-12-02 | Hitachi Metals Ltd | 電子部品用複合材料およびその製造方法 |
JP2000503489A (ja) * | 1996-11-08 | 2000-03-21 | ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティド | 熱膨張率をコントロールするための銅層に形成された可変的穿孔密度の使用 |
US6129993A (en) * | 1998-02-13 | 2000-10-10 | Hitachi Metals, Ltd. | Heat spreader and method of making the same |
US6207294B1 (en) * | 1999-04-30 | 2001-03-27 | Philip A. Rutter | Self-sharpening, laminated cutting tool and method for making the tool |
DE10137652C1 (de) * | 2001-08-03 | 2003-03-20 | Schleicher Walter | Wärmeableitmittel zum Ableiten von Wärme einer Wärmequelle |
JP4062994B2 (ja) * | 2001-08-28 | 2008-03-19 | 株式会社豊田自動織機 | 放熱用基板材、複合材及びその製造方法 |
US20030131476A1 (en) * | 2001-09-28 | 2003-07-17 | Vlad Ocher | Heat conduits and terminal radiator for microcircuit packaging and manufacturing process |
JP4471646B2 (ja) * | 2003-01-15 | 2010-06-02 | 株式会社豊田自動織機 | 複合材及びその製造方法 |
US6898084B2 (en) * | 2003-07-17 | 2005-05-24 | The Bergquist Company | Thermal diffusion apparatus |
DE502004005077D1 (de) * | 2004-04-30 | 2007-11-08 | Ligrufa Ag | Wärmetauscher und Installation zur Entnahme von Wärme aus Abwasser |
US7228887B2 (en) * | 2005-02-23 | 2007-06-12 | Asia Vital Component Co., Ltd. | Radiator structure |
US20060286358A1 (en) * | 2005-03-14 | 2006-12-21 | Tower Steven A | Heat spreader for use with light emitting diode |
US7328508B2 (en) * | 2005-07-05 | 2008-02-12 | International Business Machines Corporation | Anisotropic heat spreading apparatus and method for semiconductor devices |
US20080008217A1 (en) * | 2006-07-07 | 2008-01-10 | Newport Corporation | Laser device including heat sink with a tailored coefficient of thermal expansion |
US20080008216A1 (en) * | 2006-07-07 | 2008-01-10 | Newport Corporation | Laser device including heat sink with insert to provide a tailored coefficient of thermal expansion |
US7760507B2 (en) * | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
TW201135429A (en) * | 2010-04-07 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Heat sink |
CN201854534U (zh) * | 2010-06-24 | 2011-06-01 | 景德镇正宇奈米科技有限公司 | 陶瓷辐射散热结构 |
US20140174329A1 (en) * | 2012-12-26 | 2014-06-26 | King Fahd University Of Petroleum And Minerals | Controlled temperature ion transport membrane reactor |
ES2732492T3 (es) * | 2014-03-04 | 2019-11-22 | Conocophillips Co | Intercambiador de calor para una instalación de gas natural licuado |
US10183358B2 (en) * | 2014-12-27 | 2019-01-22 | Cooler Master Co., Ltd. | Bonded functionally graded material structure for heat transfer |
US10611124B2 (en) | 2015-10-06 | 2020-04-07 | Fourté International SDN. BHD | Multiple layered alloy/non alloy clad materials and methods of manufacture |
WO2017221105A1 (en) | 2016-06-23 | 2017-12-28 | Manoj Harilal Akkad | Method for enhancing resistance to delamination of a coating layer applied to a rigid, monolithic substrate |
US10723437B2 (en) | 2017-05-30 | 2020-07-28 | The Boeing Company | System for structurally integrated thermal management for thin wing aircraft control surface actuators |
US11032947B1 (en) * | 2020-02-17 | 2021-06-08 | Raytheon Company | Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2501164A (en) * | 1943-09-27 | 1950-03-21 | Metals & Controls Corp | Method of making electrical contacts |
US2391457A (en) * | 1944-02-01 | 1945-12-25 | Mallory & Co Inc P R | Spark plug electrode construction |
US2794458A (en) * | 1952-12-18 | 1957-06-04 | Cornelius D Dosker | High speed saw |
US3175893A (en) * | 1959-02-02 | 1965-03-30 | Clevite Corp | Laminate composite material and method of fabrication |
DE1141029B (de) * | 1960-06-23 | 1962-12-13 | Siemens Ag | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
US3351700A (en) * | 1963-08-19 | 1967-11-07 | Texas Instruments Inc | Header for a capsule for a semiconductor element or the like |
US3399332A (en) * | 1965-12-29 | 1968-08-27 | Texas Instruments Inc | Heat-dissipating support for semiconductor device |
US3769179A (en) * | 1972-01-19 | 1973-10-30 | Kewanee Oil Co | Copper plating process for printed circuits |
US4025997A (en) * | 1975-12-23 | 1977-05-31 | International Telephone & Telegraph Corporation | Ceramic mounting and heat sink device |
CA1083263A (en) * | 1977-06-29 | 1980-08-05 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
-
1979
- 1979-05-08 US US06/037,236 patent/US4283464A/en not_active Expired - Lifetime
-
1980
- 1980-04-08 CA CA000349287A patent/CA1136289A/en not_active Expired
- 1980-04-14 GB GB8012198A patent/GB2048567B/en not_active Expired
- 1980-05-05 IT IT48589/80A patent/IT1128314B/it active
- 1980-05-06 FR FR8010091A patent/FR2456298B1/fr not_active Expired
- 1980-05-06 NL NL8002585A patent/NL8002585A/nl not_active Application Discontinuation
- 1980-05-07 DE DE19803017514 patent/DE3017514A1/de not_active Withdrawn
- 1980-05-08 JP JP6006480A patent/JPS55159967A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
US4283464A (en) | 1981-08-11 |
IT8048589A0 (it) | 1980-05-05 |
JPS633741B2 (it) | 1988-01-26 |
FR2456298A1 (fr) | 1980-12-05 |
GB2048567A (en) | 1980-12-10 |
JPS55159967A (en) | 1980-12-12 |
DE3017514A1 (de) | 1980-11-13 |
GB2048567B (en) | 1983-03-09 |
NL8002585A (nl) | 1980-11-11 |
CA1136289A (en) | 1982-11-23 |
FR2456298B1 (fr) | 1986-11-21 |
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