FR2456298A1 - Plaque metallique composite prefabriquee de transmission de chaleur - Google Patents

Plaque metallique composite prefabriquee de transmission de chaleur

Info

Publication number
FR2456298A1
FR2456298A1 FR8010091A FR8010091A FR2456298A1 FR 2456298 A1 FR2456298 A1 FR 2456298A1 FR 8010091 A FR8010091 A FR 8010091A FR 8010091 A FR8010091 A FR 8010091A FR 2456298 A1 FR2456298 A1 FR 2456298A1
Authority
FR
France
Prior art keywords
heat
metal plate
composite metal
prefabricated composite
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8010091A
Other languages
English (en)
Other versions
FR2456298B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2456298A1 publication Critical patent/FR2456298A1/fr
Application granted granted Critical
Publication of FR2456298B1 publication Critical patent/FR2456298B1/fr
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/087—Heat exchange elements made from metals or metal alloys from nickel or nickel alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat Treatment Of Sheet Steel (AREA)

Abstract

PLAQUE METALLIQUE COMPOSITE PREFABRIQUEE DESTINEE A TRANSMETTRE LA CHALEUR D'UNE SOURCE DE CHALEUR A UN MILIEU ABSORBANT LA CHALEUR, CARACTERISEE EN CE QU'ELLE COMPREND: DEUX ELEMENTS EN PLAQUE 10, 11 METALLIQUES DE RESISTANCE A LA TRACTION ELEVEE, AYANT UN COEFFICIENT DE DILATATION THERMIQUE QUI EST A PEU PRES LE MEME QUE CELUI DE LADITE SOURCE DE CHALEUR; UNE SERIE DE TROUS 10A, 11A TRAVERSANT CHACUN DESDITS ELEMENTS; ET UNE COUCHE 12 DE MATERIAU METALLIQUE RELATIVEMENT MALLEABLE, PLACEE ENTRE LESDITS ELEMENTS, REMPLISSANT LESDITS TROUS ET AYANT UN COEFFICIENT DE TRANSFERT DE CHALEUR D'AU MOINS ENVIRON 1,25JCMCMSC. LA PLAQUE METALLIQUE RESULTANTE A UN COEFFICIENT DE TRANSFERT DE CHALEUR D'AU MOINS ENVIRON 1,25JCMCMSC, ET PEUT S'UTILISER DANS LE MONTAGE DES DISPOSITIFS SEMI-CONDUCTEURS EN SILICIUM MONOCRISTALLIN.
FR8010091A 1979-05-08 1980-05-06 Plaque metallique composite prefabriquee de transmission de chaleur Expired FR2456298B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/037,236 US4283464A (en) 1979-05-08 1979-05-08 Prefabricated composite metallic heat-transmitting plate unit

Publications (2)

Publication Number Publication Date
FR2456298A1 true FR2456298A1 (fr) 1980-12-05
FR2456298B1 FR2456298B1 (fr) 1986-11-21

Family

ID=21893218

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8010091A Expired FR2456298B1 (fr) 1979-05-08 1980-05-06 Plaque metallique composite prefabriquee de transmission de chaleur

Country Status (8)

Country Link
US (1) US4283464A (fr)
JP (1) JPS55159967A (fr)
CA (1) CA1136289A (fr)
DE (1) DE3017514A1 (fr)
FR (1) FR2456298B1 (fr)
GB (1) GB2048567B (fr)
IT (1) IT1128314B (fr)
NL (1) NL8002585A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479565A1 (fr) * 1980-03-27 1981-10-02 Asea Ab Materiau composite a bas coefficient de dilatation thermique et a bonne conductivite thermique

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US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
GB8308751D0 (en) * 1983-03-30 1983-05-11 Era Patents Ltd Mounting of semiconductor devices
JPS6053037A (ja) * 1983-09-01 1985-03-26 Sumitomo Electric Ind Ltd 半導体素子臀載用多層複合金属条
JPH061787B2 (ja) * 1983-09-20 1994-01-05 住友電気工業株式会社 半導体装置用基板
US4650922A (en) * 1985-03-11 1987-03-17 Texas Instruments Incorporated Thermally matched mounting substrate
US4894293A (en) * 1988-03-10 1990-01-16 Texas Instruments Incorporated Circuit system, a composite metal material for use therein, and a method for making the material
US4885214A (en) * 1988-03-10 1989-12-05 Texas Instruments Incorporated Composite material and methods for making
US5015533A (en) * 1988-03-10 1991-05-14 Texas Instruments Incorporated Member of a refractory metal material of selected shape and method of making
US4836979A (en) * 1988-06-14 1989-06-06 Inco Limited Manufacture of composite structures
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
CA1316303C (fr) * 1988-12-23 1993-04-20 Thijs Eerkes Structure composite
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
US5151777A (en) * 1989-03-03 1992-09-29 Delco Electronics Corporation Interface device for thermally coupling an integrated circuit to a heat sink
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
JPH03136338A (ja) * 1989-10-23 1991-06-11 Mitsubishi Electric Corp 半導体装置およびその製造のためのロウ付け方法
EP0432867B1 (fr) * 1989-12-12 1996-09-04 Sumitomo Special Metal Co., Ltd. Procédé de préparation d'un matériau composite thermoconducteur
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
US4994903A (en) * 1989-12-18 1991-02-19 Texas Instruments Incorporated Circuit substrate and circuit using the substrate
US5011655A (en) * 1989-12-22 1991-04-30 Inco Alloys International, Inc. Process of forming a composite structure
EP0509860B1 (fr) * 1991-03-27 1996-06-05 Seb S.A. Article constitué à partir d'une plaque réalisée en un métal relativement mou et récipient culinaire constituant un tel article
EP0537965B1 (fr) * 1991-10-12 1997-03-05 Sumitomo Special Metals Company Limited Méthode de fabrication d'un matériau conducteur de chaleur
US5156923A (en) * 1992-01-06 1992-10-20 Texas Instruments Incorporated Heat-transferring circuit substrate with limited thermal expansion and method for making
DE4217531C1 (de) * 1992-05-27 1993-12-16 Wieland Werke Ag Verfahren zur Herstellung schlickergegossener isotroper Verbundwerkstoffe auf Kupferbasis mit geringem thermischem Ausdehnungskoeffizienten und hoher elektrischer Leitfähigkeit sowie deren Verwendung
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
US5681663A (en) * 1995-06-09 1997-10-28 Ford Motor Company Heatspreader carrier strip
AU6450096A (en) * 1995-07-14 1997-02-18 Olin Corporation Metal ball grid electronic package
CA2205810A1 (fr) * 1995-09-27 1997-04-03 Texas Instruments Incorporated Assemblages microelectroniques comprenant des films conducteurs suivant l'axe des z
JPH09312361A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
WO1998020549A1 (fr) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Utilisation d'une densite de perforation variable de la couche de cuivre pour commander le coefficient de dilatation thermique
US6129993A (en) * 1998-02-13 2000-10-10 Hitachi Metals, Ltd. Heat spreader and method of making the same
US6207294B1 (en) * 1999-04-30 2001-03-27 Philip A. Rutter Self-sharpening, laminated cutting tool and method for making the tool
DE10137652C1 (de) * 2001-08-03 2003-03-20 Schleicher Walter Wärmeableitmittel zum Ableiten von Wärme einer Wärmequelle
JP4062994B2 (ja) * 2001-08-28 2008-03-19 株式会社豊田自動織機 放熱用基板材、複合材及びその製造方法
US20030131476A1 (en) * 2001-09-28 2003-07-17 Vlad Ocher Heat conduits and terminal radiator for microcircuit packaging and manufacturing process
JP4471646B2 (ja) * 2003-01-15 2010-06-02 株式会社豊田自動織機 複合材及びその製造方法
US6898084B2 (en) * 2003-07-17 2005-05-24 The Bergquist Company Thermal diffusion apparatus
DE502004005077D1 (de) * 2004-04-30 2007-11-08 Ligrufa Ag Wärmetauscher und Installation zur Entnahme von Wärme aus Abwasser
US7228887B2 (en) * 2005-02-23 2007-06-12 Asia Vital Component Co., Ltd. Radiator structure
US20060286358A1 (en) * 2005-03-14 2006-12-21 Tower Steven A Heat spreader for use with light emitting diode
US7328508B2 (en) * 2005-07-05 2008-02-12 International Business Machines Corporation Anisotropic heat spreading apparatus and method for semiconductor devices
US20080008216A1 (en) * 2006-07-07 2008-01-10 Newport Corporation Laser device including heat sink with insert to provide a tailored coefficient of thermal expansion
US20080008217A1 (en) * 2006-07-07 2008-01-10 Newport Corporation Laser device including heat sink with a tailored coefficient of thermal expansion
US7760507B2 (en) * 2007-12-26 2010-07-20 The Bergquist Company Thermally and electrically conductive interconnect structures
TW201135429A (en) * 2010-04-07 2011-10-16 Hon Hai Prec Ind Co Ltd Heat sink
CN201854534U (zh) * 2010-06-24 2011-06-01 景德镇正宇奈米科技有限公司 陶瓷辐射散热结构
US20140174329A1 (en) * 2012-12-26 2014-06-26 King Fahd University Of Petroleum And Minerals Controlled temperature ion transport membrane reactor
CA3154622A1 (fr) 2014-03-04 2015-09-11 Conocophillips Company Echangeur de chaleur pour une installation de gaz naturel liquefie
US10183358B2 (en) * 2014-12-27 2019-01-22 Cooler Master Co., Ltd. Bonded functionally graded material structure for heat transfer
US10611124B2 (en) 2015-10-06 2020-04-07 Fourté International SDN. BHD Multiple layered alloy/non alloy clad materials and methods of manufacture
WO2017221105A1 (fr) 2016-06-23 2017-12-28 Manoj Harilal Akkad Procédé pour améliorer la résistance au délaminage d'une couche de revêtement appliquée sur un substrat monolithique rigide
US10723437B2 (en) * 2017-05-30 2020-07-28 The Boeing Company System for structurally integrated thermal management for thin wing aircraft control surface actuators
US11032947B1 (en) * 2020-02-17 2021-06-08 Raytheon Company Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones

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US3175893A (en) * 1959-02-02 1965-03-30 Clevite Corp Laminate composite material and method of fabrication
US3351700A (en) * 1963-08-19 1967-11-07 Texas Instruments Inc Header for a capsule for a semiconductor element or the like
US3399332A (en) * 1965-12-29 1968-08-27 Texas Instruments Inc Heat-dissipating support for semiconductor device
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
FR2396263A1 (fr) * 1977-06-29 1979-01-26 Semi Alloys Inc Plaque de transmission de la chaleur, metallique, composite et prefabriquee

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Publication number Priority date Publication date Assignee Title
US3175893A (en) * 1959-02-02 1965-03-30 Clevite Corp Laminate composite material and method of fabrication
US3351700A (en) * 1963-08-19 1967-11-07 Texas Instruments Inc Header for a capsule for a semiconductor element or the like
US3399332A (en) * 1965-12-29 1968-08-27 Texas Instruments Inc Heat-dissipating support for semiconductor device
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
FR2396263A1 (fr) * 1977-06-29 1979-01-26 Semi Alloys Inc Plaque de transmission de la chaleur, metallique, composite et prefabriquee

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479565A1 (fr) * 1980-03-27 1981-10-02 Asea Ab Materiau composite a bas coefficient de dilatation thermique et a bonne conductivite thermique

Also Published As

Publication number Publication date
IT8048589A0 (it) 1980-05-05
IT1128314B (it) 1986-05-28
US4283464A (en) 1981-08-11
CA1136289A (fr) 1982-11-23
JPS55159967A (en) 1980-12-12
NL8002585A (nl) 1980-11-11
FR2456298B1 (fr) 1986-11-21
JPS633741B2 (fr) 1988-01-26
DE3017514A1 (de) 1980-11-13
GB2048567B (en) 1983-03-09
GB2048567A (en) 1980-12-10

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse