FR2396263A1 - Plaque de transmission de la chaleur, metallique, composite et prefabriquee - Google Patents
Plaque de transmission de la chaleur, metallique, composite et prefabriqueeInfo
- Publication number
- FR2396263A1 FR2396263A1 FR7817339A FR7817339A FR2396263A1 FR 2396263 A1 FR2396263 A1 FR 2396263A1 FR 7817339 A FR7817339 A FR 7817339A FR 7817339 A FR7817339 A FR 7817339A FR 2396263 A1 FR2396263 A1 FR 2396263A1
- Authority
- FR
- France
- Prior art keywords
- plate
- heat
- composite
- metal
- prefabricated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 3
- 230000005540 biological transmission Effects 0.000 title abstract 2
- 239000002131 composite material Substances 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Plaque de transmission de la chaleur métallique, composite et préfabriquée. Cette plaque est utilisée pour transmettre la chaleur entre un milieu absorbant la chaleur et un corps soumis pendant son fonctionnement normal à de larges variations de température. La plaque comporte un élément métallique de résistance à la traction élevée dont le coefficient de dilatation thermique est essentiellement celui du corps, et qui est percé de nombreux trous remplis par un materiau métallique relativement mou ayant un coefficient de transfert de chaleur d'au moins 0,3 cal/cm**2/cm/s/ degrés C. Application à la transmission de chaleur entre un élément semi-conducteur et une plaque de refroidissement
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81108477A | 1977-06-29 | 1977-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2396263A1 true FR2396263A1 (fr) | 1979-01-26 |
FR2396263B1 FR2396263B1 (fr) | 1984-04-13 |
Family
ID=25205506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7817339A Granted FR2396263A1 (fr) | 1977-06-29 | 1978-06-09 | Plaque de transmission de la chaleur, metallique, composite et prefabriquee |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5412569A (fr) |
CA (1) | CA1083263A (fr) |
DE (1) | DE2826252A1 (fr) |
FR (1) | FR2396263A1 (fr) |
GB (1) | GB1588477A (fr) |
IT (1) | IT1105422B (fr) |
NL (1) | NL7806751A (fr) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2456298A1 (fr) * | 1979-05-08 | 1980-12-05 | Hascoe Norman | Plaque metallique composite prefabriquee de transmission de chaleur |
FR2479565A1 (fr) * | 1980-03-27 | 1981-10-02 | Asea Ab | Materiau composite a bas coefficient de dilatation thermique et a bonne conductivite thermique |
EP0055578A2 (fr) * | 1980-12-29 | 1982-07-07 | Honeywell Information Systems Inc. | Bloc fonctionnel pour circuit intégré |
FR2501415A1 (fr) * | 1980-11-21 | 1982-09-10 | Gen Electric | Base conductrice de la chaleur et de l'electricite destinee a recevoir un element semi-conducteur et son procede de fabrication |
FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
EP0365275A2 (fr) * | 1988-10-21 | 1990-04-25 | Texas Instruments Incorporated | Membre refroidisseur d'un matériau composé pour un élément semi-conducteur et procédé pour sa fabrication |
EP0392109A2 (fr) * | 1989-03-03 | 1990-10-17 | Sumitomo Special Metal Co., Ltd. | Matériau composé thermoconducteur |
EP0437656A1 (fr) * | 1988-12-23 | 1991-07-24 | Inco Limited | Structure composée comprenant un coéfficient de dilatation thermique spécifique |
EP0608621A1 (fr) * | 1993-01-29 | 1994-08-03 | Texas Instruments Incorporated | Système de circuit, un matériau composé pour être utilisé dedans et procédé de fabrication pour ce matériau |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960000706B1 (ko) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | 전력소자용 플라스틱 패키지 구조 및 그 제조방법 |
WO1998020549A1 (fr) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Utilisation d'une densite de perforation variable de la couche de cuivre pour commander le coefficient de dilatation thermique |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1114171A (fr) * | 1953-11-30 | 1956-04-09 | Philips Nv | Système d'électrodes comportant un corps semi-conducteur, en particulier une diode à cristal ou un transisteur |
US3928907A (en) * | 1971-11-18 | 1975-12-30 | John Chisholm | Method of making thermal attachment to porous metal surfaces |
FR2305025A1 (fr) * | 1975-03-21 | 1976-10-15 | Thomson Csf | Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3296501A (en) * | 1962-11-07 | 1967-01-03 | Westinghouse Electric Corp | Metallic ceramic composite contacts for semiconductor devices |
GB1004020A (en) * | 1964-04-24 | 1965-09-08 | Standard Telephones Cables Ltd | Improvements in or relating to the mounting of electrical components |
US3368112A (en) * | 1964-12-18 | 1968-02-06 | Navy Usa | Shielding of electrical circuits by metal deposition |
JPS5039065A (fr) * | 1973-08-08 | 1975-04-10 |
-
1978
- 1978-05-11 CA CA303,080A patent/CA1083263A/fr not_active Expired
- 1978-05-25 GB GB22253/78A patent/GB1588477A/en not_active Expired
- 1978-06-09 FR FR7817339A patent/FR2396263A1/fr active Granted
- 1978-06-13 DE DE19782826252 patent/DE2826252A1/de not_active Ceased
- 1978-06-14 JP JP7201878A patent/JPS5412569A/ja active Pending
- 1978-06-22 IT IT49996/78A patent/IT1105422B/it active
- 1978-06-22 NL NL7806751A patent/NL7806751A/xx active Search and Examination
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1114171A (fr) * | 1953-11-30 | 1956-04-09 | Philips Nv | Système d'électrodes comportant un corps semi-conducteur, en particulier une diode à cristal ou un transisteur |
US3928907A (en) * | 1971-11-18 | 1975-12-30 | John Chisholm | Method of making thermal attachment to porous metal surfaces |
FR2305025A1 (fr) * | 1975-03-21 | 1976-10-15 | Thomson Csf | Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2456298A1 (fr) * | 1979-05-08 | 1980-12-05 | Hascoe Norman | Plaque metallique composite prefabriquee de transmission de chaleur |
FR2479565A1 (fr) * | 1980-03-27 | 1981-10-02 | Asea Ab | Materiau composite a bas coefficient de dilatation thermique et a bonne conductivite thermique |
FR2501415A1 (fr) * | 1980-11-21 | 1982-09-10 | Gen Electric | Base conductrice de la chaleur et de l'electricite destinee a recevoir un element semi-conducteur et son procede de fabrication |
EP0055578A2 (fr) * | 1980-12-29 | 1982-07-07 | Honeywell Information Systems Inc. | Bloc fonctionnel pour circuit intégré |
EP0055578A3 (fr) * | 1980-12-29 | 1983-02-16 | Honeywell Information Systems Inc. | Bloc fonctionnel pour circuit intégré |
FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
EP0365275A2 (fr) * | 1988-10-21 | 1990-04-25 | Texas Instruments Incorporated | Membre refroidisseur d'un matériau composé pour un élément semi-conducteur et procédé pour sa fabrication |
EP0365275A3 (en) * | 1988-10-21 | 1990-11-22 | Texas Instruments Incorporated | A composite material, a heat-dissipating member using the material in a circuit system, the circuit system, and methods for making |
EP0437656A1 (fr) * | 1988-12-23 | 1991-07-24 | Inco Limited | Structure composée comprenant un coéfficient de dilatation thermique spécifique |
EP0392109A2 (fr) * | 1989-03-03 | 1990-10-17 | Sumitomo Special Metal Co., Ltd. | Matériau composé thermoconducteur |
EP0392109A3 (fr) * | 1989-03-03 | 1991-01-09 | Sumitomo Special Metal Co., Ltd. | Matériau composé thermoconducteur |
EP0608621A1 (fr) * | 1993-01-29 | 1994-08-03 | Texas Instruments Incorporated | Système de circuit, un matériau composé pour être utilisé dedans et procédé de fabrication pour ce matériau |
Also Published As
Publication number | Publication date |
---|---|
CA1083263A (fr) | 1980-08-05 |
IT7849996A0 (it) | 1978-06-22 |
FR2396263B1 (fr) | 1984-04-13 |
JPS5412569A (en) | 1979-01-30 |
IT1105422B (it) | 1985-11-04 |
DE2826252A1 (de) | 1979-01-04 |
NL7806751A (nl) | 1979-01-03 |
GB1588477A (en) | 1981-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2396263A1 (fr) | Plaque de transmission de la chaleur, metallique, composite et prefabriquee | |
FR2456298A1 (fr) | Plaque metallique composite prefabriquee de transmission de chaleur | |
FR2415444A1 (fr) | Recipient en acier inoxydable ayant un fond thermoconducteur, utilisable avec differentes sources de chaleur | |
DE68923698T2 (de) | Verbundmetallröhre mit vortrefflicher Beständigkeit gegen Korrosion, hohe Temperaturen und Drücke. | |
MY124335A (en) | Semiconductor body with solder material layer | |
FR2411896A1 (fr) | Alliage a faible dilatation resistant a la chaleur | |
FR2392708A1 (fr) | Appareil pour le sechage par le froid d'un gaz, en particulier d'air-comprime | |
FR2380422A1 (fr) | Element de construction soumis a des sollicitations thermiques, en partie d'un tel element | |
SE8008171L (sv) | Sammansatt elektrisk kontakt | |
SE9202623D0 (sv) | Vaermelagrande kropp av metall och vaermelagrande anordning | |
FR2428217A1 (fr) | Installation de refroidissement d'objets chauffes | |
FR2395797A1 (fr) | Coquille pour coulee continue | |
GB1283141A (en) | Method of hardsoldering or brazing | |
JPS5494415A (en) | Heat treatment method of pipes | |
JPS5550621A (en) | Method of bonding refractory metal contact member to semiconductor | |
JPS6477843A (en) | Shadow mask composition | |
GB998204A (en) | Thermoelements used for producing a thermoelectric cooling or heating effect | |
ZHELDUBOVSKII et al. | Fatigue resistance of refractory alloy EI 698 VD at elevated temperatures | |
Fukumoto et al. | Thermal stress analysis in ceramics-metal solid state bonding process. | |
JPS5399796A (en) | Thermoelectric converter | |
Dutta et al. | Thermoelectric measurements in oxide films of erbium and ytterbium. | |
FR2354627A1 (fr) | Procede de fabrication d'elements de contact pour disjoncteurs a gaz sous pression | |
JPS56128982A (en) | Fixing device | |
Erofeev | Crystal-Chemical Analysis of Behavior of In in PbTe | |
GAMULIA et al. | Surface secondary structure formation and wear resistance of alloys under low temperatures and in vacuum |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |