JPS5039065A - - Google Patents
Info
- Publication number
- JPS5039065A JPS5039065A JP8845573A JP8845573A JPS5039065A JP S5039065 A JPS5039065 A JP S5039065A JP 8845573 A JP8845573 A JP 8845573A JP 8845573 A JP8845573 A JP 8845573A JP S5039065 A JPS5039065 A JP S5039065A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8845573A JPS5039065A (fr) | 1973-08-08 | 1973-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8845573A JPS5039065A (fr) | 1973-08-08 | 1973-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5039065A true JPS5039065A (fr) | 1975-04-10 |
Family
ID=13943261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8845573A Pending JPS5039065A (fr) | 1973-08-08 | 1973-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5039065A (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145269A (en) * | 1975-06-10 | 1976-12-14 | Nec Corp | Semiconductor device |
| JPS546066U (fr) * | 1977-06-15 | 1979-01-16 | ||
| JPS5412569A (en) * | 1977-06-29 | 1979-01-30 | Semi Alloys Inc | Heat transfer prefabrication composite metal plate unit |
| JPS59187091A (ja) * | 1983-04-08 | 1984-10-24 | Nippon Parkerizing Co Ltd | 鋼板用冷間圧延油 |
-
1973
- 1973-08-08 JP JP8845573A patent/JPS5039065A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145269A (en) * | 1975-06-10 | 1976-12-14 | Nec Corp | Semiconductor device |
| JPS546066U (fr) * | 1977-06-15 | 1979-01-16 | ||
| JPS5412569A (en) * | 1977-06-29 | 1979-01-30 | Semi Alloys Inc | Heat transfer prefabrication composite metal plate unit |
| JPS59187091A (ja) * | 1983-04-08 | 1984-10-24 | Nippon Parkerizing Co Ltd | 鋼板用冷間圧延油 |
| JPS6049679B2 (ja) * | 1983-04-08 | 1985-11-02 | 日本パ−カライジング株式会社 | 鋼板用冷間圧延油 |