NL7806751A - Voorgefabriceerde samengestelde metallische warmte- overdragende plaateenheid. - Google Patents
Voorgefabriceerde samengestelde metallische warmte- overdragende plaateenheid.Info
- Publication number
- NL7806751A NL7806751A NL7806751A NL7806751A NL7806751A NL 7806751 A NL7806751 A NL 7806751A NL 7806751 A NL7806751 A NL 7806751A NL 7806751 A NL7806751 A NL 7806751A NL 7806751 A NL7806751 A NL 7806751A
- Authority
- NL
- Netherlands
- Prior art keywords
- heat transfer
- plate unit
- transfer plate
- metallic heat
- composite metallic
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81108477A | 1977-06-29 | 1977-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7806751A true NL7806751A (nl) | 1979-01-03 |
Family
ID=25205506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7806751A NL7806751A (nl) | 1977-06-29 | 1978-06-22 | Voorgefabriceerde samengestelde metallische warmte- overdragende plaateenheid. |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5412569A (fr) |
| CA (1) | CA1083263A (fr) |
| DE (1) | DE2826252A1 (fr) |
| FR (1) | FR2396263A1 (fr) |
| GB (1) | GB1588477A (fr) |
| IT (1) | IT1105422B (fr) |
| NL (1) | NL7806751A (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283464A (en) * | 1979-05-08 | 1981-08-11 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
| SE420964B (sv) * | 1980-03-27 | 1981-11-09 | Asea Ab | Kompositmaterial och sett for dess framstellning |
| US4427993A (en) * | 1980-11-21 | 1984-01-24 | General Electric Company | Thermal stress relieving bimetallic plate |
| US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
| FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
| US5039335A (en) * | 1988-10-21 | 1991-08-13 | Texas Instruments Incorporated | Composite material for a circuit system and method of making |
| CA1316303C (fr) * | 1988-12-23 | 1993-04-20 | Thijs Eerkes | Structure composite |
| JPH02231751A (ja) * | 1989-03-03 | 1990-09-13 | Sumitomo Special Metals Co Ltd | リードフレーム用材料 |
| US5310520A (en) * | 1993-01-29 | 1994-05-10 | Texas Instruments Incorporated | Circuit system, a composite material for use therein, and a method of making the material |
| KR960000706B1 (ko) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | 전력소자용 플라스틱 패키지 구조 및 그 제조방법 |
| WO1998020549A1 (fr) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Utilisation d'une densite de perforation variable de la couche de cuivre pour commander le coefficient de dilatation thermique |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL183243C (nl) * | 1953-11-30 | Metallgesellschaft Ag | Werkwijze voor het op metaaloppervlakken aanbrengen van fosfaatbekledingen. | |
| US3296501A (en) * | 1962-11-07 | 1967-01-03 | Westinghouse Electric Corp | Metallic ceramic composite contacts for semiconductor devices |
| GB1004020A (en) * | 1964-04-24 | 1965-09-08 | Standard Telephones Cables Ltd | Improvements in or relating to the mounting of electrical components |
| US3368112A (en) * | 1964-12-18 | 1968-02-06 | Navy Usa | Shielding of electrical circuits by metal deposition |
| US3928907A (en) * | 1971-11-18 | 1975-12-30 | John Chisholm | Method of making thermal attachment to porous metal surfaces |
| JPS5039065A (fr) * | 1973-08-08 | 1975-04-10 | ||
| FR2305025A1 (fr) * | 1975-03-21 | 1976-10-15 | Thomson Csf | Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element |
-
1978
- 1978-05-11 CA CA303,080A patent/CA1083263A/fr not_active Expired
- 1978-05-25 GB GB22253/78A patent/GB1588477A/en not_active Expired
- 1978-06-09 FR FR7817339A patent/FR2396263A1/fr active Granted
- 1978-06-13 DE DE19782826252 patent/DE2826252A1/de not_active Ceased
- 1978-06-14 JP JP7201878A patent/JPS5412569A/ja active Pending
- 1978-06-22 IT IT49996/78A patent/IT1105422B/it active
- 1978-06-22 NL NL7806751A patent/NL7806751A/xx active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| IT7849996A0 (it) | 1978-06-22 |
| CA1083263A (fr) | 1980-08-05 |
| FR2396263A1 (fr) | 1979-01-26 |
| FR2396263B1 (fr) | 1984-04-13 |
| JPS5412569A (en) | 1979-01-30 |
| GB1588477A (en) | 1981-04-23 |
| DE2826252A1 (de) | 1979-01-04 |
| IT1105422B (it) | 1985-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| A85 | Still pending on 85-01-01 | ||
| BC | A request for examination has been filed | ||
| CNR | Transfer of rights (patent application after its laying open for public inspection) |
Free format text: ALLIED CORPORATION TE MORRISTOWN |
|
| BN | A decision not to publish the application has become irrevocable |