JPS5412569A - Heat transfer prefabrication composite metal plate unit - Google Patents

Heat transfer prefabrication composite metal plate unit

Info

Publication number
JPS5412569A
JPS5412569A JP7201878A JP7201878A JPS5412569A JP S5412569 A JPS5412569 A JP S5412569A JP 7201878 A JP7201878 A JP 7201878A JP 7201878 A JP7201878 A JP 7201878A JP S5412569 A JPS5412569 A JP S5412569A
Authority
JP
Japan
Prior art keywords
prefabrication
heat transfer
metal plate
plate unit
composite metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7201878A
Other languages
English (en)
Japanese (ja)
Inventor
Hasukoo Nooman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semi-Alloys Inc
Original Assignee
Semi-Alloys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi-Alloys Inc filed Critical Semi-Alloys Inc
Publication of JPS5412569A publication Critical patent/JPS5412569A/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP7201878A 1977-06-29 1978-06-14 Heat transfer prefabrication composite metal plate unit Pending JPS5412569A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81108477A 1977-06-29 1977-06-29

Publications (1)

Publication Number Publication Date
JPS5412569A true JPS5412569A (en) 1979-01-30

Family

ID=25205506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7201878A Pending JPS5412569A (en) 1977-06-29 1978-06-14 Heat transfer prefabrication composite metal plate unit

Country Status (7)

Country Link
JP (1) JPS5412569A (fr)
CA (1) CA1083263A (fr)
DE (1) DE2826252A1 (fr)
FR (1) FR2396263A1 (fr)
GB (1) GB1588477A (fr)
IT (1) IT1105422B (fr)
NL (1) NL7806751A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
CA1316303C (fr) * 1988-12-23 1993-04-20 Thijs Eerkes Structure composite
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
WO1998020549A1 (fr) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Utilisation d'une densite de perforation variable de la couche de cuivre pour commander le coefficient de dilatation thermique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039065A (fr) * 1973-08-08 1975-04-10

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL183243C (nl) * 1953-11-30 Metallgesellschaft Ag Werkwijze voor het op metaaloppervlakken aanbrengen van fosfaatbekledingen.
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3368112A (en) * 1964-12-18 1968-02-06 Navy Usa Shielding of electrical circuits by metal deposition
US3928907A (en) * 1971-11-18 1975-12-30 John Chisholm Method of making thermal attachment to porous metal surfaces
FR2305025A1 (fr) * 1975-03-21 1976-10-15 Thomson Csf Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039065A (fr) * 1973-08-08 1975-04-10

Also Published As

Publication number Publication date
FR2396263A1 (fr) 1979-01-26
CA1083263A (fr) 1980-08-05
IT7849996A0 (it) 1978-06-22
GB1588477A (en) 1981-04-23
FR2396263B1 (fr) 1984-04-13
DE2826252A1 (de) 1979-01-04
IT1105422B (it) 1985-11-04
NL7806751A (nl) 1979-01-03

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