IT1070009B - Transistore ad effetto di campo perfezionato - Google Patents

Transistore ad effetto di campo perfezionato

Info

Publication number
IT1070009B
IT1070009B IT7630276A IT3027676A IT1070009B IT 1070009 B IT1070009 B IT 1070009B IT 7630276 A IT7630276 A IT 7630276A IT 3027676 A IT3027676 A IT 3027676A IT 1070009 B IT1070009 B IT 1070009B
Authority
IT
Italy
Prior art keywords
perfected
field effect
effect transistor
transistor
field
Prior art date
Application number
IT7630276A
Other languages
English (en)
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1070009B publication Critical patent/IT1070009B/it

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/299Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
    • H10D62/307Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
IT7630276A 1975-12-31 1976-12-10 Transistore ad effetto di campo perfezionato IT1070009B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64577175A 1975-12-31 1975-12-31

Publications (1)

Publication Number Publication Date
IT1070009B true IT1070009B (it) 1985-03-25

Family

ID=24590420

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7630276A IT1070009B (it) 1975-12-31 1976-12-10 Transistore ad effetto di campo perfezionato

Country Status (7)

Country Link
US (1) US4070687A (enExample)
JP (1) JPS5283181A (enExample)
CA (1) CA1057418A (enExample)
DE (1) DE2655998C2 (enExample)
FR (1) FR2337428A1 (enExample)
GB (1) GB1569897A (enExample)
IT (1) IT1070009B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173791A (en) * 1977-09-16 1979-11-06 Fairchild Camera And Instrument Corporation Insulated gate field-effect transistor read-only memory array
US4212683A (en) * 1978-03-27 1980-07-15 Ncr Corporation Method for making narrow channel FET
US4485390A (en) * 1978-03-27 1984-11-27 Ncr Corporation Narrow channel FET
JPS54144183A (en) * 1978-05-01 1979-11-10 Handotai Kenkyu Shinkokai Insulated gate type electrostatic induction transistor and semiconductor integrated circuit
JPS5561069A (en) * 1978-10-31 1980-05-08 Fujitsu Ltd Manufacture of semiconductor device
US4282646A (en) * 1979-08-20 1981-08-11 International Business Machines Corporation Method of making a transistor array
US4329186A (en) * 1979-12-20 1982-05-11 Ibm Corporation Simultaneously forming fully implanted DMOS together with enhancement and depletion mode MOSFET devices
US4369072A (en) * 1981-01-22 1983-01-18 International Business Machines Corp. Method for forming IGFET devices having improved drain voltage characteristics
EP0069649B1 (en) * 1981-07-10 1989-04-19 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Self-aligned antiblooming structure for charge-coupled devices and method of fabrication thereof
US5118631A (en) * 1981-07-10 1992-06-02 Loral Fairchild Corporation Self-aligned antiblooming structure for charge-coupled devices and method of fabrication thereof
JPS5833870A (ja) * 1981-08-24 1983-02-28 Hitachi Ltd 半導体装置
FR2529715A1 (fr) * 1982-07-01 1984-01-06 Commissariat Energie Atomique Procede d'optimisation du dopage dans un transistor mos
JPS59126674A (ja) * 1983-01-10 1984-07-21 Toshiba Corp 情報記憶用半導体装置
JPS62283667A (ja) * 1986-05-31 1987-12-09 Toshiba Corp 半導体装置の製造方法
JPS63119574A (ja) * 1986-11-07 1988-05-24 Toshiba Corp 半導体装置の製造方法
US4906588A (en) * 1988-06-23 1990-03-06 Dallas Semiconductor Corporation Enclosed buried channel transistor
US5122474A (en) * 1988-06-23 1992-06-16 Dallas Semiconductor Corporation Method of fabricating a CMOS IC with reduced susceptibility to PMOS punchthrough
US4943537A (en) * 1988-06-23 1990-07-24 Dallas Semiconductor Corporation CMOS integrated circuit with reduced susceptibility to PMOS punchthrough
EP0513415A1 (en) * 1991-05-16 1992-11-19 Kabushiki Kaisha Toshiba Insulated gate FET having double-layered wells of low and high impurity concentrations and method of manufacturing the same
JP3212150B2 (ja) * 1992-08-07 2001-09-25 株式会社日立製作所 半導体装置
JPH10214964A (ja) * 1997-01-30 1998-08-11 Oki Electric Ind Co Ltd Mosfet及びその製造方法
US11552169B2 (en) * 2019-03-27 2023-01-10 Intel Corporation Source or drain structures with phosphorous and arsenic co-dopants
US11804523B2 (en) * 2019-09-24 2023-10-31 Intel Corporation High aspect ratio source or drain structures with abrupt dopant profile

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1153428A (en) * 1965-06-18 1969-05-29 Philips Nv Improvements in Semiconductor Devices.
GB1316555A (enExample) * 1969-08-12 1973-05-09
US3806773A (en) * 1971-07-17 1974-04-23 Sony Corp Field effect transistor having back-to-back diodes connected to the gate electrode and having a protective layer between the source and the diodes to prevent thyristor action
US3877055A (en) * 1972-11-13 1975-04-08 Motorola Inc Semiconductor memory device
US3883372A (en) * 1973-07-11 1975-05-13 Westinghouse Electric Corp Method of making a planar graded channel MOS transistor
JPS571904B2 (enExample) * 1973-07-12 1982-01-13
JPS5036087A (enExample) * 1973-07-13 1975-04-04
US3996655A (en) * 1973-12-14 1976-12-14 Texas Instruments Incorporated Processes of forming insulated gate field effect transistors with channel lengths of one micron in integrated circuits with component isolated and product
US3909320A (en) * 1973-12-26 1975-09-30 Signetics Corp Method for forming MOS structure using double diffusion

Also Published As

Publication number Publication date
DE2655998C2 (de) 1986-01-30
US4070687A (en) 1978-01-24
FR2337428B1 (enExample) 1980-10-24
DE2655998A1 (de) 1977-07-14
JPS5283181A (en) 1977-07-11
FR2337428A1 (fr) 1977-07-29
CA1057418A (en) 1979-06-26
GB1569897A (en) 1980-06-25

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