IN2015DN01724A - - Google Patents
Info
- Publication number
- IN2015DN01724A IN2015DN01724A IN1724DEN2015A IN2015DN01724A IN 2015DN01724 A IN2015DN01724 A IN 2015DN01724A IN 1724DEN2015 A IN1724DEN2015 A IN 1724DEN2015A IN 2015DN01724 A IN2015DN01724 A IN 2015DN01724A
- Authority
- IN
- India
- Prior art keywords
- pair
- lead frames
- section
- insulating film
- sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/04—Thermometers specially adapted for specific purposes for measuring temperature of moving solid bodies
- G01K13/08—Thermometers specially adapted for specific purposes for measuring temperature of moving solid bodies in rotary movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012195713A JP5896157B2 (ja) | 2012-09-06 | 2012-09-06 | 温度センサ |
PCT/JP2013/074441 WO2014038719A1 (ja) | 2012-09-06 | 2013-09-03 | 温度センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2015DN01724A true IN2015DN01724A (ko) | 2015-05-22 |
Family
ID=50237322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1724DEN2015 IN2015DN01724A (ko) | 2012-09-06 | 2015-03-02 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9851262B2 (ko) |
EP (1) | EP2894447B1 (ko) |
JP (1) | JP5896157B2 (ko) |
KR (1) | KR102027626B1 (ko) |
CN (1) | CN104508442B (ko) |
IN (1) | IN2015DN01724A (ko) |
TW (1) | TW201423071A (ko) |
WO (1) | WO2014038719A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5896160B2 (ja) * | 2012-09-28 | 2016-03-30 | 三菱マテリアル株式会社 | 温度センサ |
JP5928831B2 (ja) * | 2013-03-21 | 2016-06-01 | 三菱マテリアル株式会社 | 温度センサ |
CN104807554B (zh) * | 2015-03-03 | 2019-01-01 | 江苏多维科技有限公司 | 一种铜热电阻薄膜温度传感器芯片及其制备方法 |
JP6617909B2 (ja) * | 2015-07-30 | 2019-12-11 | 三菱マテリアル株式会社 | 温度センサ |
DE102015225584A1 (de) * | 2015-12-17 | 2017-06-22 | Robert Bosch Gmbh | Startvorrichtung für eine Brennkraftmaschine |
JP2017134024A (ja) | 2016-01-29 | 2017-08-03 | 三菱マテリアル株式会社 | 温度センサ |
JP2018146403A (ja) * | 2017-03-06 | 2018-09-20 | Koa株式会社 | 温度センサ素子 |
JP2018151227A (ja) * | 2017-03-13 | 2018-09-27 | 三菱マテリアル株式会社 | 温度センサ |
US11300458B2 (en) | 2017-09-05 | 2022-04-12 | Littelfuse, Inc. | Temperature sensing tape, assembly, and method of temperature control |
KR20190026630A (ko) * | 2017-09-05 | 2019-03-13 | 리텔퓨즈 인코퍼레이티드 | 온도 감지 테이프 |
DE102018105400B3 (de) | 2018-03-08 | 2019-07-04 | Tmc Sensortechnik Gmbh | Elektrischer Temperaturfühler |
US11525739B2 (en) * | 2018-05-08 | 2022-12-13 | Texas Instruments Incorporated | Thermistor die-based thermal probe |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314002Y2 (ko) * | 1985-04-17 | 1991-03-28 | ||
JPS63104302A (ja) * | 1986-10-21 | 1988-05-09 | 松下電器産業株式会社 | SiC薄膜サ−ミスタ |
JPH0629793B2 (ja) | 1987-02-20 | 1994-04-20 | 石塚電子株式会社 | 温度センサ |
JPH03156331A (ja) * | 1989-08-21 | 1991-07-04 | Nkk Corp | 温度センサ |
DE4206082C1 (ko) | 1992-02-27 | 1993-04-08 | Siemens Ag, 8000 Muenchen, De | |
JP3276196B2 (ja) | 1993-04-16 | 2002-04-22 | 石塚電子株式会社 | 温度センサ |
JPH07240302A (ja) * | 1994-02-25 | 1995-09-12 | Hokuriku Electric Ind Co Ltd | チップ状電子部品とその製造方法 |
AU721993B2 (en) * | 1995-06-02 | 2000-07-20 | A.H. Casting Services Limited | Ceramic material with high density and thermal shock resistance, and method of preparation |
JP3756607B2 (ja) * | 1997-02-27 | 2006-03-15 | 石塚電子株式会社 | 温度センサ |
JPH11121207A (ja) | 1997-10-13 | 1999-04-30 | Murata Mfg Co Ltd | 温度センサ |
JP4263274B2 (ja) * | 1998-09-01 | 2009-05-13 | 石塚電子株式会社 | 温度センサ |
JP4374632B2 (ja) | 1998-11-27 | 2009-12-02 | 株式会社大泉製作所 | 定着ローラ用温度センサ |
US20040224459A1 (en) * | 1999-07-07 | 2004-11-11 | Matsushita Electric Industrial Co., Ltd. | Layered structure, method for manufacturing the same, and semiconductor element |
US6989574B2 (en) * | 2000-08-24 | 2006-01-24 | Heetronix | High temperature circuit structures with thin film layer |
JP4436064B2 (ja) * | 2003-04-16 | 2010-03-24 | 大阪府 | サーミスタ用材料及びその製造方法 |
JP4838667B2 (ja) * | 2006-09-01 | 2011-12-14 | キヤノン株式会社 | 温度センサ及び定着装置 |
US20100104495A1 (en) * | 2006-10-16 | 2010-04-29 | Mitsubishi Chemical Corporation | Method for producing nitride semiconductor, crystal growth rate increasing agent, single crystal nitride, wafer and device |
JP2011044621A (ja) * | 2009-08-23 | 2011-03-03 | Mitsubishi Materials Corp | 温度センサ |
JP5494967B2 (ja) * | 2010-09-23 | 2014-05-21 | 三菱マテリアル株式会社 | 温度センサ付き電池 |
JP5494968B2 (ja) * | 2010-09-24 | 2014-05-21 | 三菱マテリアル株式会社 | 温度センサ |
JP5477670B2 (ja) * | 2012-02-28 | 2014-04-23 | 三菱マテリアル株式会社 | サーミスタ用金属窒化物材料及びその製造方法並びにフィルム型サーミスタセンサ |
CN103717332B (zh) * | 2012-06-29 | 2016-02-24 | 住友电工硬质合金株式会社 | 表面被覆切削工具 |
-
2012
- 2012-09-06 JP JP2012195713A patent/JP5896157B2/ja active Active
-
2013
- 2013-09-02 TW TW102131543A patent/TW201423071A/zh unknown
- 2013-09-03 EP EP13834457.7A patent/EP2894447B1/en active Active
- 2013-09-03 WO PCT/JP2013/074441 patent/WO2014038719A1/ja active Application Filing
- 2013-09-03 KR KR1020157005774A patent/KR102027626B1/ko active IP Right Grant
- 2013-09-03 CN CN201380040118.0A patent/CN104508442B/zh active Active
- 2013-09-03 US US14/425,605 patent/US9851262B2/en active Active
-
2015
- 2015-03-02 IN IN1724DEN2015 patent/IN2015DN01724A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014052228A (ja) | 2014-03-20 |
KR102027626B1 (ko) | 2019-10-01 |
US9851262B2 (en) | 2017-12-26 |
EP2894447A1 (en) | 2015-07-15 |
CN104508442A (zh) | 2015-04-08 |
WO2014038719A1 (ja) | 2014-03-13 |
TW201423071A (zh) | 2014-06-16 |
US20150226616A1 (en) | 2015-08-13 |
KR20150052067A (ko) | 2015-05-13 |
EP2894447A4 (en) | 2016-06-01 |
CN104508442B (zh) | 2017-08-29 |
EP2894447B1 (en) | 2019-10-30 |
JP5896157B2 (ja) | 2016-03-30 |
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