IN2014KN03028A - - Google Patents

Info

Publication number
IN2014KN03028A
IN2014KN03028A IN3028KON2014A IN2014KN03028A IN 2014KN03028 A IN2014KN03028 A IN 2014KN03028A IN 3028KON2014 A IN3028KON2014 A IN 3028KON2014A IN 2014KN03028 A IN2014KN03028 A IN 2014KN03028A
Authority
IN
India
Prior art keywords
component
pack
type curable
polyorganosiloxane composition
curable polyorganosiloxane
Prior art date
Application number
Other languages
English (en)
Inventor
Makoto Sakakibara
Kazuhisa Ono
Shigeki Matsushita
Koji Okawa
Original Assignee
Momentive Performance Mat Jp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012141306A external-priority patent/JP5308564B1/ja
Priority claimed from JP2013129880A external-priority patent/JP5502226B1/ja
Priority claimed from JP2013129879A external-priority patent/JP5414931B1/ja
Application filed by Momentive Performance Mat Jp filed Critical Momentive Performance Mat Jp
Publication of IN2014KN03028A publication Critical patent/IN2014KN03028A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/003—Presence of polysiloxane in the primer coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IN3028KON2014 2012-06-22 2013-06-21 IN2014KN03028A (enExample)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012141306A JP5308564B1 (ja) 2012-06-22 2012-06-22 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用
JP2013129880A JP5502226B1 (ja) 2013-06-20 2013-06-20 二つの基材を含む接着体の製造方法
JP2013129879A JP5414931B1 (ja) 2013-06-20 2013-06-20 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用
PCT/JP2013/067116 WO2013191279A1 (ja) 2012-06-22 2013-06-21 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用

Publications (1)

Publication Number Publication Date
IN2014KN03028A true IN2014KN03028A (enExample) 2015-05-08

Family

ID=49768870

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3028KON2014 IN2014KN03028A (enExample) 2012-06-22 2013-06-21

Country Status (7)

Country Link
US (1) US20150337188A1 (enExample)
EP (1) EP2865719A4 (enExample)
KR (1) KR20150021121A (enExample)
CN (1) CN104395406A (enExample)
IN (1) IN2014KN03028A (enExample)
TW (1) TW201410744A (enExample)
WO (1) WO2013191279A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011107592A1 (en) * 2010-03-05 2011-09-09 Momentive Performance Materials Gmbh Curable polyorganosiloxane composition for use as an encapsulant for a solar cell module
JP5824130B2 (ja) * 2013-10-04 2015-11-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物の硬化物、硬化性ポリオルガノシロキサン組成物を用いた接着体、硬化性ポリオルガノシロキサン組成物を用いた接着体の製造方法、並びにその使用
US20180037013A1 (en) * 2015-03-05 2018-02-08 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, a use thereof, and a laminate prepared from the composition
WO2016141546A1 (en) * 2015-03-10 2016-09-15 Henkel IP & Holding GmbH A moisture and radiation curable adhesive composition and the use thereof
TWI767909B (zh) * 2016-05-16 2022-06-21 美商道康寧公司 包括至少一種非線型有機聚矽氧烷之黏著劑剝離層
EP3473677B1 (en) * 2016-06-15 2021-08-04 Momentive Performance Materials Japan LLC Curable polyorganosiloxane composition and use thereof
US10531949B2 (en) 2016-12-30 2020-01-14 Ethicon, Inc. Silicone foam compositions rapidly cross-linkable at ambient temperatures and methods of making and using same
US10533074B2 (en) 2016-12-30 2020-01-14 Ethicon, Inc. Silicone compositions rapidly cross-linkable at ambient temperatures and methods of making and using same
CN116284946B (zh) 2017-02-08 2025-11-04 埃肯有机硅美国公司 具有改进的热管理的二次电池组
US20200354615A1 (en) * 2017-04-03 2020-11-12 Dow Toray Co., Ltd. Curing-reactive organopolysiloxane resin, pressure-sensitive adhesive composition using same, and use thereof
JP7130316B2 (ja) * 2017-07-05 2022-09-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物
EP3645651B1 (en) 2017-10-19 2023-09-06 Dow Silicones Corporation A method for fabricating a flexible organic light emitting diode using a pressure sensitive adhesive composition
WO2019081387A1 (de) * 2017-10-27 2019-05-02 Tesa Se Dimensionsstabile klebebänder
KR102539232B1 (ko) 2018-08-10 2023-06-08 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 이의 사용
EP3835388B1 (en) 2018-08-10 2023-08-30 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
US12091591B2 (en) * 2018-12-25 2024-09-17 Momentive Performance Materials Japan Llc Adhesive polyorganosiloxane composition
EP4053236A4 (en) 2019-10-29 2023-12-13 Momentive Performance Materials Japan LLC Polyorganosiloxane composition for bonding poly(phenylene sulfide) resin
KR102873150B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
KR102873146B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
JPWO2023008204A1 (enExample) * 2021-07-26 2023-02-02
CN115646158B (zh) * 2022-10-09 2025-02-07 中国工程物理研究院总体工程研究所 一种具有高效吸氢效果的块体吸氢剂及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9219208D0 (en) * 1992-09-10 1992-10-28 Dow Corning Gmbh Elastomer-forming composition
JP3461404B2 (ja) * 1995-03-29 2003-10-27 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JPH09324152A (ja) * 1996-06-06 1997-12-16 Toray Dow Corning Silicone Co Ltd 同種もしくは異種の基材からなる接着構造体の製造方法
JP2004272059A (ja) 2003-03-11 2004-09-30 Ge Toshiba Silicones Co Ltd 液晶表示装置及びこれを備えた携帯型電子機器
JP2004292608A (ja) * 2003-03-26 2004-10-21 Sekisui Chem Co Ltd 硬化性組成物
JP2006056986A (ja) * 2004-08-19 2006-03-02 Shin Etsu Chem Co Ltd 二液硬化型シリコーン組成物
JP2006117823A (ja) * 2004-10-22 2006-05-11 Dow Corning Toray Co Ltd ２液型シリコーンゴム組成物
JP4678847B2 (ja) * 2004-10-28 2011-04-27 信越化学工業株式会社 シリコーン組成物から得られる粘着層を有する粘着性フィルム
JP4626759B2 (ja) * 2005-08-01 2011-02-09 信越化学工業株式会社 二液型シリコーン樹脂組成物の射出成形方法
US7695819B2 (en) * 2005-09-30 2010-04-13 Wacker Chemical Corporation Two piece curable HCR silicone elastomers
JP2008074882A (ja) * 2006-09-19 2008-04-03 Shin Etsu Chem Co Ltd シリコーンゴム用２液付加反応硬化型接着剤
JP5179302B2 (ja) * 2008-09-11 2013-04-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 自己接着性ポリオルガノシロキサン組成物
JP2010163478A (ja) * 2009-01-13 2010-07-29 Shin-Etsu Chemical Co Ltd シリコーンゴム用２液付加反応硬化型接着剤
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
JP5624280B2 (ja) 2009-04-14 2014-11-12 株式会社カネカ フラットパネルディスプレイ表示モジュール／透明カバーボード間充填用硬化性組成物およびそれを塗布硬化させて得られるフラットパネルディスプレイを搭載した電気・電子機器
JP5602385B2 (ja) * 2009-04-17 2014-10-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 接着性ポリオルガノシロキサン組成物
KR101259887B1 (ko) * 2009-08-04 2013-05-02 한국과학기술원 광학용 투명 실록산 수지 조성물
JP5587148B2 (ja) * 2010-03-09 2014-09-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 自己接着性ポリオルガノシロキサン組成物
PT2657300E (pt) * 2010-12-22 2016-01-20 Momentive Performance Mat Jp Composição de poliorganossiloxano termocurável e a sua utilização

Also Published As

Publication number Publication date
TW201410744A (zh) 2014-03-16
CN104395406A (zh) 2015-03-04
KR20150021121A (ko) 2015-02-27
WO2013191279A1 (ja) 2013-12-27
EP2865719A1 (en) 2015-04-29
US20150337188A1 (en) 2015-11-26
EP2865719A4 (en) 2016-01-20

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