IN2014KN01179A - - Google Patents

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Publication number
IN2014KN01179A
IN2014KN01179A IN1179KON2014A IN2014KN01179A IN 2014KN01179 A IN2014KN01179 A IN 2014KN01179A IN 1179KON2014 A IN1179KON2014 A IN 1179KON2014A IN 2014KN01179 A IN2014KN01179 A IN 2014KN01179A
Authority
IN
India
Prior art keywords
substrates
producing
structures
relates
metals
Prior art date
Application number
Other languages
English (en)
Inventor
Michael Berkei
Tobias Tinthoff
Original Assignee
Byk Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Byk Chemie Gmbh filed Critical Byk Chemie Gmbh
Publication of IN2014KN01179A publication Critical patent/IN2014KN01179A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)
IN1179KON2014 2011-12-02 2012-11-30 IN2014KN01179A (enrdf_load_html_response)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11009542 2011-12-02
PCT/EP2012/004965 WO2013079219A1 (de) 2011-12-02 2012-11-30 Verfahren zur herstellung elektrisch leitfähiger strukturen auf nichtleitenden substraten und auf diese weise erzeugte strukturen

Publications (1)

Publication Number Publication Date
IN2014KN01179A true IN2014KN01179A (enrdf_load_html_response) 2015-10-16

Family

ID=47326051

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1179KON2014 IN2014KN01179A (enrdf_load_html_response) 2011-12-02 2012-11-30

Country Status (7)

Country Link
US (1) US20140339092A1 (enrdf_load_html_response)
EP (1) EP2785896B1 (enrdf_load_html_response)
JP (1) JP2014533780A (enrdf_load_html_response)
KR (1) KR20140098229A (enrdf_load_html_response)
CN (1) CN104080956A (enrdf_load_html_response)
IN (1) IN2014KN01179A (enrdf_load_html_response)
WO (1) WO2013079219A1 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116216701A (zh) * 2023-03-06 2023-06-06 大连交通大学 一种原位制备高还原率氧化石墨烯薄膜的方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103849904B (zh) * 2014-04-01 2016-05-04 山东理工大学 直接由薄脆型生物表面反向电铸出仿生复型表面的方法
WO2017034292A1 (ko) * 2015-08-26 2017-03-02 김형락 비전도성 기판상의 전기장을 이용한 분산입자 패턴 제조방법
GB201604342D0 (en) * 2016-03-14 2016-04-27 Aurubis Belgium Nv Sa Substrate
DE102016124682A1 (de) 2016-12-16 2018-06-21 Technische Universität Chemnitz Verfahren zum Drucken auf einer Flüssigkeitsoberfläche
CN107187143B (zh) * 2017-05-11 2019-12-17 歌尔股份有限公司 一种金属和塑料的复合体及其制备方法
KR102036607B1 (ko) * 2017-07-06 2019-10-28 김혜연 비전도성 물체의 전기도금 방법에 의해 제조된 장식품
DE102017121228A1 (de) * 2017-09-13 2019-03-14 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh Verfahren zur Oberflächenbehandlung einer Probe die mindestens eine Oberfläche eines Metalloxids aufweist und Metalloxid mit behandelter Oberfläche
CN107620095A (zh) * 2017-09-29 2018-01-23 佛山市春暖花开科技有限公司 一种复合层金属电镀工艺方法
CN107620096A (zh) * 2017-09-29 2018-01-23 佛山市春暖花开科技有限公司 一种分层电镀工艺方法
KR102492733B1 (ko) 2017-09-29 2023-01-27 삼성디스플레이 주식회사 구리 플라즈마 식각 방법 및 디스플레이 패널 제조 방법
CN110158132A (zh) * 2018-02-13 2019-08-23 华瑞墨石丹阳有限公司 一种绝缘材料的电镀方法
CN109285635A (zh) * 2018-08-09 2019-01-29 苏州千层茧农业科技有限公司 一种单面导电膜辊压式及其制备方法
LU100919B1 (en) * 2018-08-27 2020-02-27 Luxembourg Inst Science & Tech List Metal-CNT composite, production method and materials therefor
CN108834309B (zh) * 2018-08-30 2020-07-31 陈伟元 一种石墨烯金属化溶液及其制备方法与应用
CN109440155A (zh) * 2018-10-30 2019-03-08 厦门建霖健康家居股份有限公司 一种对非金属基材表面金属化处理的方法
CN110596986A (zh) * 2019-09-03 2019-12-20 深圳市华星光电技术有限公司 彩膜基板的制备方法、彩膜基板及液晶显示面板
CN112791225A (zh) * 2019-11-14 2021-05-14 美国发现集团有限公司 用于肿瘤治疗的纳米机器人及其制备方法
CN112500741B (zh) * 2020-10-29 2024-04-19 宁波石墨烯创新中心有限公司 一种石墨烯复合导电油墨及其制备方法和应用
CN113179592A (zh) * 2021-04-27 2021-07-27 江门市德众泰工程塑胶科技有限公司 一种线路板及其制作方法
GR20230100358A (el) * 2023-04-28 2024-11-11 Παπαδοπουλος Νικολαος-Ξαφακης Σωτηριος Ο.Ε., Μεθοδος αναπτυξης ηλεκτρικα ανισοτροπων αντιρρυπαντικων επιστρωσεων για επιφανειες που ερχονται σε επαφη με το νερο

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619741A (en) 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
DE4141416A1 (de) 1991-12-11 1993-06-17 Schering Ag Verfahren zur beschichtung von oberflaechen mit feinteiligen feststoff-partikeln
US5389270A (en) 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5476580A (en) 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5667662A (en) * 1996-04-01 1997-09-16 Shipley Company, L.L.C. Electroplating process and composition
DE19806360A1 (de) 1997-03-13 1998-09-17 Juergen Otto Prof Dr Besenhard Verfahren zum elektrolytischen Abscheiden einer Metallschicht mit glatter Oberfläche auf einem Substrat unter Verwendung einer Graphitdispersion
JP2001267376A (ja) * 2000-03-14 2001-09-28 Seiko Instruments Inc Ｆｐｃの製造方法及び表示装置
US20100119789A1 (en) * 2005-04-06 2010-05-13 Grande William J Advanced conductive ink
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
JP4411289B2 (ja) * 2006-03-22 2010-02-10 三井金属鉱業株式会社 配線基板
RU2436266C2 (ru) * 2006-06-14 2011-12-10 Басф Се Способ изготовления электропроводящих поверхностей на носителе
RU2009107274A (ru) * 2006-08-03 2010-09-10 Басф Се (De) Способ нанесения металлического покрытия на основу
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
ATE549437T1 (de) * 2006-09-07 2012-03-15 Enthone Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats
DE102006055106C5 (de) 2006-11-14 2018-08-23 Byk-Chemie Gmbh Dispergierverfahren
US20100038251A1 (en) * 2008-08-14 2010-02-18 Snu R&Db Foundation Carbon nanotube network-based nano-composites
JP2010076110A (ja) * 2008-09-24 2010-04-08 Toshiba Corp 樹脂成形体及びその製造方法
JP2010174084A (ja) * 2009-01-28 2010-08-12 Panasonic Corp カーボンナノチューブを含有するインク

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116216701A (zh) * 2023-03-06 2023-06-06 大连交通大学 一种原位制备高还原率氧化石墨烯薄膜的方法

Also Published As

Publication number Publication date
KR20140098229A (ko) 2014-08-07
US20140339092A1 (en) 2014-11-20
CN104080956A (zh) 2014-10-01
EP2785896B1 (de) 2015-09-23
EP2785896A1 (de) 2014-10-08
JP2014533780A (ja) 2014-12-15
WO2013079219A1 (de) 2013-06-06

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