PL3030698T3 - Elektrolit do elektrolitycznego osadzania stopów srebra i palladu oraz sposób ich osadzania - Google Patents

Elektrolit do elektrolitycznego osadzania stopów srebra i palladu oraz sposób ich osadzania

Info

Publication number
PL3030698T3
PL3030698T3 PL14747884T PL14747884T PL3030698T3 PL 3030698 T3 PL3030698 T3 PL 3030698T3 PL 14747884 T PL14747884 T PL 14747884T PL 14747884 T PL14747884 T PL 14747884T PL 3030698 T3 PL3030698 T3 PL 3030698T3
Authority
PL
Poland
Prior art keywords
deposition
electrolyte
silver
palladium alloys
electrolytic
Prior art date
Application number
PL14747884T
Other languages
English (en)
Inventor
Bernd Weyhmueller
Uwe Manz
Sascha Berger
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL3030698T3 publication Critical patent/PL3030698T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PL14747884T 2013-08-06 2014-07-24 Elektrolit do elektrolitycznego osadzania stopów srebra i palladu oraz sposób ich osadzania PL3030698T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013215476.3A DE102013215476B3 (de) 2013-08-06 2013-08-06 Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
EP14747884.6A EP3030698B1 (en) 2013-08-06 2014-07-24 Electrolyte for the electrolytic deposition of silver-palladium alloys and method for deposition thereof
PCT/EP2014/065958 WO2015018654A1 (en) 2013-08-06 2014-07-24 Electrolyte for the electrolytic deposition of silver-palladium alloys and method for deposition thereof

Publications (1)

Publication Number Publication Date
PL3030698T3 true PL3030698T3 (pl) 2020-06-15

Family

ID=51292931

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14747884T PL3030698T3 (pl) 2013-08-06 2014-07-24 Elektrolit do elektrolitycznego osadzania stopów srebra i palladu oraz sposób ich osadzania

Country Status (8)

Country Link
US (1) US9797056B2 (pl)
EP (1) EP3030698B1 (pl)
JP (1) JP6370380B2 (pl)
KR (1) KR102259480B1 (pl)
CN (1) CN105473768B (pl)
DE (1) DE102013215476B3 (pl)
PL (1) PL3030698T3 (pl)
WO (1) WO2015018654A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3159435T3 (pl) 2015-10-21 2018-10-31 Umicore Galvanotechnik Gmbh Dodatek do elektrolitów do stopu srebro-palladowego
WO2018215057A1 (en) 2017-05-23 2018-11-29 Saxonia Edelmetalle Gmbh Noble metal salt preparation, a method for production thereof and use for electroplating
JP7405827B2 (ja) 2018-08-21 2023-12-26 ウミコレ・ガルファノテフニック・ゲーエムベーハー 銀の非シアン系析出用電解質
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
DE102018126174B3 (de) 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung
CN109735891A (zh) * 2018-12-13 2019-05-10 江苏师范大学 一种用于提高微粒射流电沉积复合镀层力学性能的方法
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
CN111893526B (zh) * 2020-08-06 2022-05-13 中国科学技术大学 一种纳米银合金修饰基底及其制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2914880A1 (de) * 1979-04-12 1980-10-30 Degussa Verfahren zur elektrolytischen abscheidung von silber- und silberlegierungsschichten
US4465563A (en) * 1982-12-22 1984-08-14 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
JPH08193290A (ja) * 1995-01-18 1996-07-30 Sumitomo Metal Ind Ltd 光沢パラジウム系めっき浴およびめっき方法
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP2008081765A (ja) * 2006-09-26 2008-04-10 Tanaka Kikinzoku Kogyo Kk パラジウム合金めっき液及びそのめっき液を用いためっき方法。
US20110147225A1 (en) * 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
US20090283411A1 (en) * 2008-05-15 2009-11-19 Serdar Aksu Selenium electroplating chemistries and methods

Also Published As

Publication number Publication date
WO2015018654A1 (en) 2015-02-12
EP3030698A1 (en) 2016-06-15
KR20160040573A (ko) 2016-04-14
JP2016529400A (ja) 2016-09-23
US20160177462A1 (en) 2016-06-23
EP3030698B1 (en) 2020-01-15
JP6370380B2 (ja) 2018-08-08
CN105473768A (zh) 2016-04-06
US9797056B2 (en) 2017-10-24
CN105473768B (zh) 2017-12-12
DE102013215476B3 (de) 2015-01-08
KR102259480B1 (ko) 2021-06-03

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