PT2877615T - Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica - Google Patents

Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica

Info

Publication number
PT2877615T
PT2877615T PT137562146T PT13756214T PT2877615T PT 2877615 T PT2877615 T PT 2877615T PT 137562146 T PT137562146 T PT 137562146T PT 13756214 T PT13756214 T PT 13756214T PT 2877615 T PT2877615 T PT 2877615T
Authority
PT
Portugal
Prior art keywords
nickel
dendritic structure
electrodeposition process
cobalt coatings
cobalt
Prior art date
Application number
PT137562146T
Other languages
English (en)
Inventor
De Fátima Grilo Da Costa Montemor Maria
João Pedroso Carmezim Maria
Pedro Tavares Da Silva Rui
Teresa Oliveira De Moura E Silva Maria
C Da Conceição De Matos Eugenio Sónia
Original Assignee
Inst Superior De Engenharia De Lisboa
Inst Superior Tecnico
Inst Politecnico De Setúbal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Superior De Engenharia De Lisboa, Inst Superior Tecnico, Inst Politecnico De Setúbal filed Critical Inst Superior De Engenharia De Lisboa
Publication of PT2877615T publication Critical patent/PT2877615T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/001—Magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/04—Hybrid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/30—Electrodes characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/30—Electrodes characterised by their material
    • H01G11/46—Metal oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/66—Current collectors
    • H01G11/68—Current collectors characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H01G11/86—Processes for the manufacture of hybrid or EDL capacitors, or components thereof specially adapted for electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/26—Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
    • H01G11/28—Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features arranged or disposed on a current collector; Layers or phases between electrodes and current collectors, e.g. adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Automation & Control Theory (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
PT137562146T 2012-07-27 2013-07-26 Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica PT2877615T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PT106470A PT106470A (pt) 2012-07-27 2012-07-27 Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica

Publications (1)

Publication Number Publication Date
PT2877615T true PT2877615T (pt) 2018-01-03

Family

ID=49085188

Family Applications (2)

Application Number Title Priority Date Filing Date
PT106470A PT106470A (pt) 2012-07-27 2012-07-27 Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica
PT137562146T PT2877615T (pt) 2012-07-27 2013-07-26 Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PT106470A PT106470A (pt) 2012-07-27 2012-07-27 Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica

Country Status (6)

Country Link
US (1) US9476136B2 (pt)
EP (1) EP2877615B1 (pt)
JP (1) JP6250663B2 (pt)
KR (1) KR102134297B1 (pt)
PT (2) PT106470A (pt)
WO (1) WO2014017937A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10810731B2 (en) 2014-11-07 2020-10-20 Arizona Board Of Regents On Behalf Of Arizona State University Information coding in dendritic structures and tags
US11430233B2 (en) 2017-06-16 2022-08-30 Arizona Board Of Regents On Behalf Of Arizona State University Polarized scanning of dendritic identifiers
US11598015B2 (en) 2018-04-26 2023-03-07 Arizona Board Of Regents On Behalf Of Arizona State University Fabrication of dendritic structures and tags
CN111074308B (zh) * 2019-12-30 2021-03-12 福建南平南孚电池有限公司 在钢壳的表面上电镀镍钴合金镀层的方法和装置
EP4281600A1 (en) * 2021-01-19 2023-11-29 Totalenergies Onetech An oxygen evolution reaction electrode catalyst assembly, its use and a method to produce said assembly

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US4038158A (en) * 1975-10-22 1977-07-26 E. I. Du Pont De Nemours And Company Electrochemical generation of field desorption emitters
US4412892A (en) * 1981-07-13 1983-11-01 The United States Of America As Represented By The Secretary Of The Army Pretreatment of superalloys and stainless steels for electroplating
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US5326454A (en) * 1987-08-26 1994-07-05 Martin Marietta Corporation Method of forming electrodeposited anti-reflective surface coatings
US5213907A (en) * 1990-10-09 1993-05-25 Diamond Technologies Company Nickel-cobalt-boron-alloy deposited on a substrate
US5385660A (en) * 1993-12-20 1995-01-31 Xerox Corporation Dendritic growth assisted electroform separation
US6478943B1 (en) * 2000-06-01 2002-11-12 Roll Surface Technologies, Inc. Method of manufacture of electrochemically textured surface having controlled peak characteristics
DE10312999A1 (de) * 2003-03-24 2004-10-07 Daimlerchrysler Ag Verfahren zur Herstellung von Elektroden für Superkondensatoren
KR100624665B1 (ko) * 2005-01-20 2006-09-19 한국기계연구원 자기이력 손실이 적은 이축 배향성 금속 테이프 및 그제조방법
KR20080101342A (ko) * 2007-05-17 2008-11-21 주식회사 엘막 고주파 펄스를 이용한 내열경도 및 전기전도성이 우수한니켈-코발트-보론 합금도금 방법
US8062496B2 (en) * 2008-04-18 2011-11-22 Integran Technologies Inc. Electroplating method and apparatus
KR101733134B1 (ko) * 2009-02-04 2017-05-08 어플라이드 머티어리얼스, 인코포레이티드 배터리 및 울트라 캐패시터용의 다공성 삼차원 구리, 주석, 구리―주석, 구리―주석―코발트 및 구리―주석―코발트―티타늄 전극
US20110253545A1 (en) * 2010-04-19 2011-10-20 International Business Machines Corporation Method of direct electrodeposition on semiconductors
US20120080317A1 (en) * 2010-09-30 2012-04-05 Seagate Technology Llc ELECTRODEPOSITION OF CoNiP FILMS
WO2012082717A2 (en) * 2010-12-13 2012-06-21 The Trustees Of Columbia University In The City Of New York Porous metal dendrites for high efficiency aqueous reduction of co2 to hydrocarbons
US20130065069A1 (en) * 2011-09-09 2013-03-14 Yun Li Liu Electrodeposition of Hard Magnetic Coatings

Also Published As

Publication number Publication date
JP6250663B2 (ja) 2017-12-20
US20150247252A1 (en) 2015-09-03
KR20150118080A (ko) 2015-10-21
PT106470A (pt) 2014-01-27
WO2014017937A1 (en) 2014-01-30
US9476136B2 (en) 2016-10-25
EP2877615A1 (en) 2015-06-03
JP2015529746A (ja) 2015-10-08
EP2877615B1 (en) 2017-10-04
KR102134297B1 (ko) 2020-07-16

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