IN2014DN04651A - - Google Patents
Info
- Publication number
- IN2014DN04651A IN2014DN04651A IN4651DEN2014A IN2014DN04651A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A IN 4651DEN2014 A IN4651DEN2014 A IN 4651DEN2014A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A
- Authority
- IN
- India
- Prior art keywords
- epoxy
- component
- adduct
- core
- disclosed
- Prior art date
Links
- 239000004593 Epoxy Substances 0.000 abstract 6
- 239000002245 particle Substances 0.000 abstract 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- 229910052799 carbon Inorganic materials 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000000539 dimer Substances 0.000 abstract 1
- 229920005862 polyol Polymers 0.000 abstract 1
- 150000003077 polyols Chemical class 0.000 abstract 1
- 239000000376 reactant Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
- C08G59/4276—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/315,518 US20120129980A1 (en) | 2010-11-19 | 2011-12-09 | Structural adhesive compositions |
| PCT/US2012/068378 WO2013086277A2 (en) | 2011-12-09 | 2012-12-07 | Structural adhesive compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014DN04651A true IN2014DN04651A (OSRAM) | 2015-04-03 |
Family
ID=47501441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN4651DEN2014 IN2014DN04651A (OSRAM) | 2011-12-09 | 2012-12-07 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20120129980A1 (OSRAM) |
| EP (1) | EP2788397A2 (OSRAM) |
| KR (1) | KR101684752B1 (OSRAM) |
| CN (1) | CN104053694B (OSRAM) |
| AU (1) | AU2012347650B2 (OSRAM) |
| BR (1) | BR112014013594B1 (OSRAM) |
| CA (1) | CA2858186C (OSRAM) |
| IN (1) | IN2014DN04651A (OSRAM) |
| MX (1) | MX380981B (OSRAM) |
| RU (1) | RU2595040C2 (OSRAM) |
| SG (1) | SG11201403003SA (OSRAM) |
| WO (1) | WO2013086277A2 (OSRAM) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010118580A (ja) | 2008-11-14 | 2010-05-27 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US8796361B2 (en) | 2010-11-19 | 2014-08-05 | Ppg Industries Ohio, Inc. | Adhesive compositions containing graphenic carbon particles |
| US20140150970A1 (en) * | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US20120128499A1 (en) * | 2010-11-19 | 2012-05-24 | Desai Umesh C | Structural adhesive compositions |
| US10294375B2 (en) * | 2011-09-30 | 2019-05-21 | Ppg Industries Ohio, Inc. | Electrically conductive coatings containing graphenic carbon particles |
| US12421118B2 (en) | 2011-09-30 | 2025-09-23 | Ppg Industries Ohio, Inc. | Graphenic carbon particles |
| CN104812696B (zh) * | 2012-08-03 | 2019-11-29 | Ocv智识资本有限责任公司 | 改进的玻璃纤维增强的复合材料 |
| US20160010713A1 (en) * | 2013-03-04 | 2016-01-14 | Nippon Steel & Sumitomo Metal Corporation | Impact-absorbing component |
| SG11201510248YA (en) * | 2013-06-14 | 2016-01-28 | Ppg Ind Ohio Inc | Structural adhesive compositions |
| CN105378019A (zh) * | 2013-07-24 | 2016-03-02 | 陶氏环球技术有限责任公司 | 可固化组合物 |
| CN104004482A (zh) * | 2014-06-13 | 2014-08-27 | 江苏悦达新材料科技有限公司 | 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法 |
| GB201411586D0 (en) * | 2014-06-30 | 2014-08-13 | Hexcel Composites Ltd | Adhesive composition |
| DE102014226826A1 (de) * | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| US11242427B2 (en) | 2015-10-20 | 2022-02-08 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
| CN106118571A (zh) * | 2016-06-28 | 2016-11-16 | 四川东树新材料有限公司 | 风电叶片用含石墨烯结构胶黏剂及其制备方法 |
| BR112019008520A2 (pt) * | 2016-10-28 | 2019-07-09 | Dow Global Technologies Llc | adesivo de epóxi durável em quebra que tem resistência ao impacto em baixa temperatura aprimorada |
| EP3642292B2 (en) | 2017-06-23 | 2025-07-02 | DDP Specialty Electronic Materials US, LLC | High temperature epoxy adhesive formulations |
| KR20200057030A (ko) | 2017-09-20 | 2020-05-25 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 2-성분 구조 접착제 |
| EP3749703B1 (en) | 2018-02-09 | 2025-09-03 | PPG Industries Ohio Inc. | Coating compositions |
| MX2021003324A (es) | 2018-09-20 | 2021-05-14 | Ppg Ind Ohio Inc | Composicion que contiene tiol. |
| KR102579195B1 (ko) | 2018-10-12 | 2023-09-14 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 열 전도성 충전제를 함유하는 조성물 |
| CN112969738B (zh) * | 2018-10-29 | 2025-03-28 | 泽菲罗斯有限公司 | 改进的结构粘结粘合剂 |
| FR3098817A1 (fr) | 2019-07-16 | 2021-01-22 | Ppg Industries Ohio, Inc. | Compositions contenant des charges thermiquement conductrices |
| US20220275240A1 (en) * | 2019-08-23 | 2022-09-01 | Ppg Industries Ohio, Inc. | Systems and methods for improved lap shear strength and displacement of two-component structural adhesives |
| BR112022003302A2 (pt) | 2019-08-23 | 2022-06-21 | Ppg Ind Ohio Inc | Composições de revestimento |
| CN114585701B (zh) | 2019-08-23 | 2024-04-09 | Ppg工业俄亥俄公司 | 用于改进双组分结构粘合剂的搭接剪切强度和位移的体系和方法 |
| AU2020336147B2 (en) * | 2019-08-23 | 2024-02-29 | Prc-Desoto International, Inc. | Coating compositions |
| WO2021061263A1 (en) | 2019-09-23 | 2021-04-01 | Ppg Industries Ohio, Inc. | Curable compositions |
| CN114829476B (zh) | 2019-12-11 | 2024-04-12 | Ppg工业俄亥俄公司 | 含有导热填料的组合物 |
| WO2021173991A1 (en) | 2020-02-26 | 2021-09-02 | Ppg Industries Ohio, Inc. | Two-layer dielectric coating |
| EP4110873A1 (en) | 2020-02-26 | 2023-01-04 | PPG Industries Ohio Inc. | Thermally conductive and electrically insulating powder coating compositions |
| US12559635B2 (en) | 2020-02-26 | 2026-02-24 | Ppg Industries Ohio, Inc. | Coated substrates and methods of preparing the same |
| WO2021211185A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| WO2021211182A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| KR102841959B1 (ko) | 2020-04-15 | 2025-08-01 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 열전도성 충전제를 함유하는 조성물 |
| ES3040286T3 (en) | 2020-04-15 | 2025-10-29 | Ppg Ind Ohio Inc | Use of a coating formed from a composition containing thermally conductive fillers to provide a substrate with thermal and fire protection |
| EP4136162A1 (en) | 2020-04-15 | 2023-02-22 | PPG Industries Ohio Inc. | Compositions containing thermally conductive fillers |
| AU2021257418B2 (en) | 2020-04-15 | 2024-04-04 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| WO2022133202A1 (en) | 2020-12-18 | 2022-06-23 | Ppg Industries Ohio, Inc. | Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions |
| WO2022204686A1 (en) | 2021-03-26 | 2022-09-29 | Ppg Industries Ohio, Inc. | Coating compositions |
| DE102021113089B4 (de) * | 2021-05-20 | 2023-05-11 | Jomoo Kitchen & Bath Deutschland Gmbh | Sanitär-Einrichtung |
| CA3237740A1 (en) | 2021-12-02 | 2023-06-08 | Ppg Industries Ohio, Inc. | Coating compositions |
| CN114752334B (zh) * | 2022-04-11 | 2023-10-20 | 中国航发北京航空材料研究院 | 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法 |
| EP4536725A1 (en) | 2022-06-06 | 2025-04-16 | PPG Industries Ohio, Inc. | Coating compositions |
| CA3263255A1 (en) * | 2022-08-19 | 2024-02-22 | Ppg Industries Ohio, Inc. | COATING COMPOSITIONS |
| CN119968411A (zh) | 2022-08-22 | 2025-05-09 | Ppg工业俄亥俄公司 | 涂层组合物 |
| CN116042150A (zh) * | 2022-12-30 | 2023-05-02 | 浙江抟原复合材料有限公司 | 一种lng船围护系统用低温环氧树脂及其制备方法 |
| DE112024002400T5 (de) | 2023-06-01 | 2026-03-12 | Ppg Industries Ohio, Inc. | Zusammensetzungen, die thermisch leitfähige füllstoffe und thermisch expandierbare materialien enthalten |
| WO2025188361A2 (en) | 2023-11-19 | 2025-09-12 | Ppg Industries Ohio, Inc. | Curable compositions |
| WO2025183772A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing a thermally conductive filler and a thermally expandable material |
| WO2025183771A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing a thermally conductive filler and a thermally expandable material |
| WO2025183769A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Furan-functional and isocyanate-functional compounds and reversibly curable compositions |
| WO2025183770A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing furan-functional and isocyanate-functional compounds and expandable material |
| WO2026059637A2 (en) | 2024-09-03 | 2026-03-19 | Ppg Industries Ohio, Inc. | Coating compositions and solvent-assisted degradable coatings formed therefrom |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3816365A (en) * | 1968-09-12 | 1974-06-11 | Ciba Geigy Ag | Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use |
| US4668736A (en) * | 1984-07-18 | 1987-05-26 | Minnesota Mining And Manufacturing Company | Fast curing epoxy resin compositions |
| EP0305331A3 (de) * | 1987-08-25 | 1991-05-08 | Ciba-Geigy Ag | Epoxidflexibilisatoren |
| US5070119A (en) * | 1990-09-28 | 1991-12-03 | Ppg Industries, Inc. | Flexible intumescent coating composition |
| DE4317470C2 (de) * | 1993-05-26 | 2001-06-07 | Henkel Kgaa | Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung |
| JPH07309929A (ja) * | 1994-05-16 | 1995-11-28 | Dainippon Ink & Chem Inc | エポキシ樹脂及びその製造方法 |
| US7071258B1 (en) * | 2002-10-21 | 2006-07-04 | Nanotek Instruments, Inc. | Nano-scaled graphene plates |
| KR20040061909A (ko) * | 2002-12-31 | 2004-07-07 | 주식회사 금강고려화학 | 내후성 및 기계적 물성이 우수한 에폭시-폴리에스테르수지 조성과 분체 도료 조성물 |
| JP2006008730A (ja) * | 2004-06-22 | 2006-01-12 | Kyoeisha Chem Co Ltd | 油膜被覆鋼材と発泡した硬化エポキシ樹脂充填材との接着性の増強剤 |
| ES2691528T3 (es) * | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Composiciones adhesivas basadas en resina epoxi curable |
| WO2008127923A2 (en) * | 2007-04-11 | 2008-10-23 | Dow Global Technologies, Inc. | Heat-resistant structural epoxy resins |
| EP2173810A4 (en) * | 2007-07-26 | 2012-07-25 | Henkel Corp | CURABLE ADHESIVE COMPOSITIONS BASED ON EPOXY RESIN |
| CN102102001B (zh) * | 2010-12-03 | 2013-04-17 | 烟台德邦科技有限公司 | 一种高导热石墨烯基环氧树脂胶粘剂及其制备方法 |
-
2011
- 2011-12-09 US US13/315,518 patent/US20120129980A1/en not_active Abandoned
-
2012
- 2012-12-07 AU AU2012347650A patent/AU2012347650B2/en not_active Ceased
- 2012-12-07 RU RU2014127905/04A patent/RU2595040C2/ru active
- 2012-12-07 SG SG11201403003SA patent/SG11201403003SA/en unknown
- 2012-12-07 BR BR112014013594-0A patent/BR112014013594B1/pt active IP Right Grant
- 2012-12-07 CN CN201280067282.6A patent/CN104053694B/zh active Active
- 2012-12-07 MX MX2014006899A patent/MX380981B/es unknown
- 2012-12-07 CA CA2858186A patent/CA2858186C/en active Active
- 2012-12-07 EP EP12809911.6A patent/EP2788397A2/en active Pending
- 2012-12-07 WO PCT/US2012/068378 patent/WO2013086277A2/en not_active Ceased
- 2012-12-07 KR KR1020147018721A patent/KR101684752B1/ko active Active
- 2012-12-07 IN IN4651DEN2014 patent/IN2014DN04651A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MX380981B (es) | 2025-03-12 |
| BR112014013594B1 (pt) | 2021-01-05 |
| EP2788397A2 (en) | 2014-10-15 |
| WO2013086277A2 (en) | 2013-06-13 |
| RU2014127905A (ru) | 2016-02-10 |
| US20120129980A1 (en) | 2012-05-24 |
| WO2013086277A3 (en) | 2013-08-15 |
| BR112014013594A8 (pt) | 2017-06-13 |
| KR20140101838A (ko) | 2014-08-20 |
| MX2014006899A (es) | 2015-05-15 |
| CA2858186A1 (en) | 2013-06-13 |
| BR112014013594A2 (pt) | 2017-06-13 |
| KR101684752B1 (ko) | 2016-12-08 |
| CN104053694A (zh) | 2014-09-17 |
| SG11201403003SA (en) | 2014-07-30 |
| AU2012347650A1 (en) | 2014-06-26 |
| AU2012347650B2 (en) | 2015-09-17 |
| RU2595040C2 (ru) | 2016-08-20 |
| CN104053694B (zh) | 2016-08-17 |
| CA2858186C (en) | 2016-06-07 |
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