IN2014CN03459A - - Google Patents

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Publication number
IN2014CN03459A
IN2014CN03459A IN3459CHN2014A IN2014CN03459A IN 2014CN03459 A IN2014CN03459 A IN 2014CN03459A IN 3459CHN2014 A IN3459CHN2014 A IN 3459CHN2014A IN 2014CN03459 A IN2014CN03459 A IN 2014CN03459A
Authority
IN
India
Prior art keywords
part system
adhesive composition
resinous
structural adhesive
rheology
Prior art date
Application number
Other languages
English (en)
Inventor
Junjie Jeffrey Sang
Dalip Kumar Kohli
Kunal Gaurang Shah
Original Assignee
Cytec Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Tech Corp filed Critical Cytec Tech Corp
Publication of IN2014CN03459A publication Critical patent/IN2014CN03459A/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253Rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/208Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02Synthetic macromolecular particles
    • B32B2264/0207Particles made of materials belonging to B32B25/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00Resin or rubber layer containing a blend of at least two different polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06Polysulfones; Polyethersulfones
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • Y10T428/249951Including a free metal or alloy constituent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • Y10T428/249952At least one thermosetting synthetic polymeric material layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254Polymeric or resinous material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31522Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
IN3459CHN2014 2011-11-09 2012-10-19 IN2014CN03459A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161557538P 2011-11-09 2011-11-09
PCT/US2012/060975 WO2013070415A1 (fr) 2011-11-09 2012-10-19 Adhésif structural et application de collage de celui-ci

Publications (1)

Publication Number Publication Date
IN2014CN03459A true IN2014CN03459A (fr) 2015-10-09

Family

ID=47178308

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3459CHN2014 IN2014CN03459A (fr) 2011-11-09 2012-10-19

Country Status (14)

Country Link
US (2) US8895148B2 (fr)
EP (1) EP2776487A1 (fr)
JP (1) JP5964980B2 (fr)
KR (1) KR102052389B1 (fr)
CN (1) CN103797043B (fr)
AU (1) AU2012336202B2 (fr)
BR (1) BR112014010798B1 (fr)
CA (2) CA3052816C (fr)
IN (1) IN2014CN03459A (fr)
MX (1) MX362835B (fr)
MY (2) MY187410A (fr)
RU (1) RU2592274C2 (fr)
TW (1) TWI576404B (fr)
WO (1) WO2013070415A1 (fr)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
US9254622B2 (en) * 2012-04-23 2016-02-09 University Of Washington Bond ply for adhesive bonding of composites and associated systems and methods
EP3024871B1 (fr) * 2013-07-26 2022-12-07 Zephyros Inc. Films adhésifs thermodurcissables comprenant un support fibreux
ES2778199T3 (es) 2013-10-11 2020-08-10 Kaneka Corp Composición de resina epoxi que contiene polímero de núcleo-cubierta, producto curado de la misma y método para preparación de la misma
JP6061837B2 (ja) * 2013-12-05 2017-01-18 アイシン化工株式会社 構造用接着剤組成物
US9890306B2 (en) * 2014-05-28 2018-02-13 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
CN106715577A (zh) 2014-07-08 2017-05-24 陶氏环球技术有限责任公司 延迟固化的高Tg碰撞耐用粘合剂
AU2015362688B2 (en) 2014-12-18 2021-01-21 Cytec Industries Inc. Modified resin systems suitable for liquid resin infusion
GB2533776B (en) * 2014-12-23 2020-11-04 Hexcel Composites Ltd Resin Composition
FR3031109B1 (fr) * 2014-12-24 2018-08-17 Arkema France Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant
CN104559064A (zh) * 2015-01-28 2015-04-29 江苏恒神纤维材料有限公司 一种高韧性高Tg环氧树脂及其制备方法
US20170342225A1 (en) * 2015-02-27 2017-11-30 Toray Industries, Inc. Epoxy resin composition, cured epoxy resin product, prepreg, and fiber-reinforced composite material
WO2016149700A1 (fr) * 2015-03-19 2016-09-22 Zephyros, Inc. Acides estérifiés utiles dans des matériaux polymères
DE102015105553A1 (de) * 2015-04-12 2016-10-13 ATN Hölzel GmbH Verfahren zur Herstellung einer lastoptimierten Klebeverbindung
CN107532056A (zh) * 2015-04-30 2018-01-02 汉高股份有限及两合公司 单组分可固化粘合剂组合物及其用途
US10005935B2 (en) 2015-05-01 2018-06-26 Lord Corporation Adhesive for rubber bonding
CN204994154U (zh) * 2015-09-08 2016-01-20 中兴通讯股份有限公司 一种通讯设备结构
WO2017044401A1 (fr) * 2015-09-10 2017-03-16 Dow Global Technologies Llc Adhésifs époxy renforcés à un composant présentant une adhérence améliorée aux surfaces huileuses et une résistance élevée au lavage
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP3170860B1 (fr) 2015-11-19 2020-07-29 3M Innovative Properties Company Adhésif structurel présentant une résistance améliorée à la corrosion
EP3170877B1 (fr) 2015-11-19 2020-11-18 3M Innovative Properties Company Adhésif structurel avec amélioration de mode de défaillance
US10377928B2 (en) * 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
DE102015224997A1 (de) * 2015-12-11 2017-06-14 Henkel Ag & Co. Kgaa Verfahren zur Konfektionierung und Auftragung von Klebstoffen
CN108603958B (zh) 2016-01-21 2022-03-04 3M创新有限公司 光学掩蔽滤光器
CN105647124A (zh) * 2016-04-12 2016-06-08 苏州甫众塑胶有限公司 一种电子封装塑胶材料及其制备方法
TW201816024A (zh) * 2016-05-09 2018-05-01 漢高智慧財產控股公司 含有反應性倍半矽氧烷的黏著組合物
JP2018016672A (ja) * 2016-07-25 2018-02-01 アイカ工業株式会社 グリース状エポキシ樹脂組成物
KR101806739B1 (ko) * 2016-09-28 2017-12-07 현대자동차주식회사 테이프형 구조용 접착제 조성물
RU2627419C1 (ru) * 2016-10-12 2017-08-08 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Эпоксидное клеевое связующее и пленочный клей на его основе
JP2020521839A (ja) 2017-05-25 2020-07-27 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 硬化性組成物
EP3645599A1 (fr) 2017-06-29 2020-05-06 3M Innovative Properties Company Composition durcissable
WO2019087258A1 (fr) * 2017-10-30 2019-05-09 日立化成株式会社 Composition de résine, objet durci, corps moulé ainsi que procédé de fabrication de celui-ci, et condensateur à film ainsi que procédé de fabrication de celui-ci
CN107828360A (zh) * 2017-11-16 2018-03-23 西安长峰机电研究所 一种常温固化固体火箭发动机喷管结构粘接剂
FR3074178B1 (fr) * 2017-11-29 2020-05-22 Adhex Technologies Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication
KR101880003B1 (ko) * 2017-12-29 2018-07-18 국방과학연구소 저온경화가 가능한 고온구조용 혼합 페이스트 접착제
CN108192550A (zh) * 2018-02-02 2018-06-22 东莞市精滤电子科技有限公司 高导热绝缘胶及其制备方法与应用
US11732125B2 (en) 2018-02-09 2023-08-22 Ppg Industries Ohio, Inc. Coating compositions
WO2019168064A1 (fr) 2018-02-28 2019-09-06 日本製鉄株式会社 Corps composite de matériau de résine renforcé par des fibres métalliques et procédé de production d'un corps composite de matériau de résine renforcé par des fibres métalliques
WO2019189238A1 (fr) * 2018-03-28 2019-10-03 株式会社カネカ Composition adhésive
WO2020003122A1 (fr) * 2018-06-27 2020-01-02 3M Innovative Properties Company Compositions durcissables et procédés associés
RU2686917C1 (ru) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное клеевое связующее и пленочный клей на его основе
RU2686919C1 (ru) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное клеевое связующее, пленочный клей и клеевой препрег на его основе
WO2020019278A1 (fr) * 2018-07-27 2020-01-30 Henkel Ag & Co. Kgaa Composition à base d'époxy en deux parties
WO2020082006A1 (fr) * 2018-10-18 2020-04-23 Illinois Tool Works Inc. Adhésif époxy durci à deux composants et à faible teneur en halogène
CA3117241A1 (fr) * 2018-10-29 2020-05-07 Henkel Ag & Co. Kgaa Composition d'enrobage thermoconductrice
US20220081551A1 (en) * 2018-12-18 2022-03-17 Cytec Industries Inc. Flame-retardant epoxy composition and method of using the same
WO2020191579A1 (fr) * 2019-03-25 2020-10-01 3M Innovative Properties Company Compositions durcissables, articles fabriqués à partir de celles-ci, et leurs procédés de fabrication et d'utilisation
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
WO2020196119A1 (fr) * 2019-03-28 2020-10-01 日東電工株式会社 Feuille adhésive durcissable et procédé de production de feuille adhésive durcissable
MX2021012761A (es) * 2019-04-18 2022-01-19 Dow Global Technologies Llc Catalizador latente.
WO2020217918A1 (fr) * 2019-04-23 2020-10-29 Dic株式会社 Composition durcissable, produit durci, matériau composite renforcé par des fibres et article moulé et son procédé de production
RU2706661C1 (ru) * 2019-05-13 2019-11-19 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное связующее, препрег на его основе и изделие, выполненное из него
KR102197044B1 (ko) * 2019-06-18 2020-12-30 (주)유니테크 자동차용 접착 조성물
US20220372207A1 (en) * 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
RU2718831C1 (ru) * 2019-10-10 2020-04-14 Акционерное общество "Препрег-Современные Композиционные Материалы" Эпоксидное связующее, препрег на его основе и изделие, выполненное из него
CN110903661B (zh) * 2019-11-20 2021-12-14 中路交科科技股份有限公司 一种U-pave专用改性沥青及其制备方法和应用方法
EP3825355A1 (fr) * 2019-11-22 2021-05-26 Henkel AG & Co. KGaA Formulations à températures de transition vitreuse élevées pour stratifiés
CN111303816B (zh) * 2020-04-07 2021-08-20 山东送变电工程有限公司 一种电力放线滑车轮片用环氧树脂胶粘剂
WO2021220090A1 (fr) * 2020-04-28 2021-11-04 3M Innovative Properties Company Composition durcissable
CN111574938B (zh) * 2020-06-02 2021-09-07 黑龙江省科学院石油化学研究院 一种自吸热核壳增韧材料、含有自吸热核壳增韧材料的热破结构胶膜及其制备方法与应用
US20220002578A1 (en) * 2020-07-02 2022-01-06 Carboline International Corporation Epoxy compositions
WO2022133880A1 (fr) * 2020-12-24 2022-06-30 Sika Technology Ag Adhésif époxy thermodurcissable monocomposant présentant une adhérence améliorée à hautes températures
KR20240055820A (ko) * 2021-09-09 2024-04-29 피피지 인더스트리즈 오하이오 인코포레이티드 경량 충전제를 갖는 접착제 조성물
WO2023076650A1 (fr) * 2021-10-29 2023-05-04 Zephyros, Inc. Composition de changement de couleur induite par réaction
CN115975346B (zh) * 2023-03-13 2023-07-28 北京天仁道和新材料有限公司 一种ooa固化预浸料用环氧树脂预混物及其制备方法
CN116879110B (zh) * 2023-09-06 2023-12-01 道生天合材料科技(上海)股份有限公司 结构胶施胶后发生滑落行为的风险评估方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5877229A (en) 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
DE10228649A1 (de) * 2002-06-26 2004-01-22 Bakelite Ag Verfahren zur Herstellung eines faserverstärkten Produktes auf Epoxidharzbasis
US20050137357A1 (en) * 2003-12-18 2005-06-23 Skoglund Michael J. Epoxy adhesive composition method of preparing and using
US20070251419A1 (en) * 2004-08-18 2007-11-01 Kaneka Corporation Epoxy Resin Composition For Semiconductor Sealing Agents and Epoxy Resin Molding Material
ATE534703T1 (de) * 2005-08-24 2011-12-15 Henkel Kgaa Epoxidzusammensetzungen mit verbesserter schlagzähigkeit
RU2432367C2 (ru) * 2006-06-07 2011-10-27 Зефирос, Инк. Способ уплотнения, экранирования и упрочнения части самоходного транспортного средства
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
WO2008087467A1 (fr) 2007-01-17 2008-07-24 Hexcel Composites, Ltd. Durcissement a basse temperature d'adhesifs epoxydes renforces
WO2008127925A2 (fr) 2007-04-11 2008-10-23 Dow Global Technologies, Inc. Résines époxy structurelles contenant des caoutchoucs à noyau-enveloppe
CN101412896B (zh) * 2007-10-17 2012-07-25 比亚迪股份有限公司 一种双组分环氧树脂粘合剂及其制备方法
GB0806434D0 (en) * 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
ES2662646T3 (es) 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación
US8309633B2 (en) 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
JP4416046B1 (ja) * 2008-08-08 2010-02-17 横浜ゴム株式会社 エポキシ樹脂組成物および構造用接着剤
EP2223966B1 (fr) * 2009-02-25 2017-08-16 3M Innovative Properties Company Compositions d'époxy adhésives dotées d'une grande résistance mécanique sur une large plage de températures
CN102333647B (zh) * 2009-02-27 2015-02-18 迈图专业化学股份有限公司 可用于非纤维素类纤维上胶剂、涂层剂或粘结组合物的组合物以及含有该组合物的复合材料
US8518208B2 (en) * 2009-08-31 2013-08-27 Cytec Technology Corp. High performance adhesive compositions
WO2011075128A1 (fr) 2009-12-17 2011-06-23 Essilor International (Compagnie Generale D'optique) Composition époxy-fonctionnelle thermodurcissable et revêtements durs résistants aux caustiques thermodurcis transparents préparés à partir de celle-ci
IN2014CN03362A (fr) * 2011-11-08 2015-07-03 Dow Global Technologies Llc
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof

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US8895148B2 (en) 2014-11-25
US20150030844A1 (en) 2015-01-29
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CN103797043B (zh) 2016-09-07
US8974905B2 (en) 2015-03-10
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MY187410A (en) 2021-09-22
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WO2013070415A1 (fr) 2013-05-16
BR112014010798A2 (pt) 2017-04-25
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