FR3074178B1 - Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication - Google Patents

Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication Download PDF

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Publication number
FR3074178B1
FR3074178B1 FR1761340A FR1761340A FR3074178B1 FR 3074178 B1 FR3074178 B1 FR 3074178B1 FR 1761340 A FR1761340 A FR 1761340A FR 1761340 A FR1761340 A FR 1761340A FR 3074178 B1 FR3074178 B1 FR 3074178B1
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France
Prior art keywords
adhesive composition
add
manufacturing
composition obtained
activable
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Active
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FR1761340A
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English (en)
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FR3074178A1 (fr
Inventor
Herve Durand
Gwenael Lusseau
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Adhex Technologies SAS
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Adhex Technologies SAS
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Publication date
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Priority to FR1761340A priority Critical patent/FR3074178B1/fr
Publication of FR3074178A1 publication Critical patent/FR3074178A1/fr
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Publication of FR3074178B1 publication Critical patent/FR3074178B1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/54—Amino amides>

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une composition adhésive latente susceptible d'être permanente comprenant au moins les étapes suivantes: i) Dissoudre dans un solvant une résine solide ; ii) Ajouter à la résine solide solubilisée un agent flexibilisant ; iii) Ajouter à la composition obtenue à l'étape ii) un agent de réticulation ; iv) Chauffer la composition obtenue à l'étape iii) pendant une durée de 30 min à 1 heure à une température située entre 23 à 60°C, préférablement 40 à 50°C ; v) Ajouter à la composition obtenue à l'étape iv) un agent tackifiant et mélanger le tout durant 5 à 20 min ; vi) Ajouter un agent durcisseur latent activable thermiquement et mélanger la composition résultante ; dans lequel les étapes v) et vi) dudit procédé sont interchangeables. Un autre objet de l'invention concerne une composition adhésive obtenue suivant ledit procédé.
FR1761340A 2017-11-29 2017-11-29 Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication Active FR3074178B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1761340A FR3074178B1 (fr) 2017-11-29 2017-11-29 Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1761340 2017-11-29
FR1761340A FR3074178B1 (fr) 2017-11-29 2017-11-29 Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR3074178A1 FR3074178A1 (fr) 2019-05-31
FR3074178B1 true FR3074178B1 (fr) 2020-05-22

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ID=61750262

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FR1761340A Active FR3074178B1 (fr) 2017-11-29 2017-11-29 Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication

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FR (1) FR3074178B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110452647A (zh) * 2019-07-25 2019-11-15 张家港爱科思汽车配件有限公司 一种汽车耐冲击固态结构胶
CN112266569B (zh) * 2020-10-20 2023-08-22 上海金发科技发展有限公司 一种永久抗静电、低光泽、耐刮擦abs树脂组合物及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070225A (en) * 1976-11-17 1978-01-24 H. B. Fuller Company Method of using structural adhesive
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
CN103484048A (zh) * 2013-05-03 2014-01-01 九江福莱克斯有限公司 一种环氧树脂胶黏剂及使用该胶黏剂制作的电子标签rfid基材

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Publication number Publication date
FR3074178A1 (fr) 2019-05-31

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