IN2014CN03459A - - Google Patents

Download PDF

Info

Publication number
IN2014CN03459A
IN2014CN03459A IN3459CHN2014A IN2014CN03459A IN 2014CN03459 A IN2014CN03459 A IN 2014CN03459A IN 3459CHN2014 A IN3459CHN2014 A IN 3459CHN2014A IN 2014CN03459 A IN2014CN03459 A IN 2014CN03459A
Authority
IN
India
Prior art keywords
part system
adhesive composition
resinous
structural adhesive
rheology
Prior art date
Application number
Inventor
Junjie Jeffrey Sang
Dalip Kumar Kohli
Kunal Gaurang Shah
Original Assignee
Cytec Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Tech Corp filed Critical Cytec Tech Corp
Publication of IN2014CN03459A publication Critical patent/IN2014CN03459A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253Rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/208Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02Synthetic macromolecular particles
    • B32B2264/0207Particles made of materials belonging to B32B25/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00Resin or rubber layer containing a blend of at least two different polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06Polysulfones; Polyethersulfones
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • Y10T428/249951Including a free metal or alloy constituent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • Y10T428/249952At least one thermosetting synthetic polymeric material layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254Polymeric or resinous material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31522Next to metal

Abstract

A structural adhesive composition that is suitable for high strength bonding of metals and aerospace structural materials. In one embodiment the structural adhesive composition based on a two part system which is curable at or below 200°F (93 °C). The two part system is composed of a resinous part (A) and a catalyst part (B) which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional trifunctional and tetrafunctional epoxy resins certain toughening components and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment the structural adhesive composition is based on a one part system which includes the components of the resinous part (A) in the two part system mixed with a latent amine curing agent. The one part system may further include an imidazole and/or an aliphatic amine. The one part system is curable within the temperature range of 140 300°F (60 150°C). The paste adhesive disclosed herein has film like properties and is particularly useful in rapid assembly aerospace structure bonding applications.
IN3459CHN2014 2011-11-09 2012-10-19 IN2014CN03459A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161557538P 2011-11-09 2011-11-09
PCT/US2012/060975 WO2013070415A1 (en) 2011-11-09 2012-10-19 Structural adhesive and bonding application thereof

Publications (1)

Publication Number Publication Date
IN2014CN03459A true IN2014CN03459A (en) 2015-10-09

Family

ID=47178308

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3459CHN2014 IN2014CN03459A (en) 2011-11-09 2012-10-19

Country Status (14)

Country Link
US (2) US8895148B2 (en)
EP (1) EP2776487A1 (en)
JP (1) JP5964980B2 (en)
KR (1) KR102052389B1 (en)
CN (1) CN103797043B (en)
AU (1) AU2012336202B2 (en)
BR (1) BR112014010798B1 (en)
CA (2) CA3052816C (en)
IN (1) IN2014CN03459A (en)
MX (1) MX362835B (en)
MY (2) MY168074A (en)
RU (1) RU2592274C2 (en)
TW (1) TWI576404B (en)
WO (1) WO2013070415A1 (en)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
US9254622B2 (en) * 2012-04-23 2016-02-09 University Of Washington Bond ply for adhesive bonding of composites and associated systems and methods
CN105637007A (en) * 2013-07-26 2016-06-01 泽费罗斯股份有限公司 Thermosetting adhesive films including a fibrous carrier
WO2015053289A1 (en) * 2013-10-11 2015-04-16 株式会社カネカ Core-shell polymer-containing epoxy resin composition, cured product of same and method for producing same
JP6061837B2 (en) * 2013-12-05 2017-01-18 アイシン化工株式会社 Structural adhesive composition
US9890306B2 (en) * 2014-05-28 2018-02-13 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
WO2016007324A1 (en) * 2014-07-08 2016-01-14 Dow Global Technologies Llc DELAYED CURING HIGH Tg CRASH DURABLE ADHESIVE
BR112017012644B1 (en) 2014-12-18 2022-04-19 Cytec Industries Inc Manufacturing process for producing a liquid resin infusion molded article, curable composition, cured molded article, and use of a curable composition
GB2533776B (en) * 2014-12-23 2020-11-04 Hexcel Composites Ltd Resin Composition
FR3031109B1 (en) * 2014-12-24 2018-08-17 Arkema France POLYMER COMPOSITION, PROCESS FOR PREPARING THE SAME, USE THEREOF, AND COMPOSITION COMPRISING THE SAME
CN104559064A (en) * 2015-01-28 2015-04-29 江苏恒神纤维材料有限公司 High-toughness high-Tg-value epoxy resin and preparation method
EP3263647A4 (en) * 2015-02-27 2018-10-10 Toray Industries, Inc. Epoxy resin composition, cured epoxy resin product, prepreg, and fiber-reinforced composite material
ES2964815T3 (en) * 2015-03-19 2024-04-09 Zephyros Inc Esterified acids for use in polymeric materials
DE102015105553A1 (en) * 2015-04-12 2016-10-13 ATN Hölzel GmbH Method for producing a load-optimized adhesive bond
KR20170141744A (en) * 2015-04-30 2017-12-26 헨켈 아게 운트 코. 카게아아 A one-part curable adhesive composition and the use thereof
EP3289033A1 (en) 2015-05-01 2018-03-07 LORD Corporation Adhesive for rubber bonding
CN204994154U (en) * 2015-09-08 2016-01-20 中兴通讯股份有限公司 Communications facilities structure
US20180334596A1 (en) * 2015-09-10 2018-11-22 Dow Global Technologies Llc One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
US10377928B2 (en) * 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
DE102015224997A1 (en) * 2015-12-11 2017-06-14 Henkel Ag & Co. Kgaa Process for the preparation and application of adhesives
KR102626262B1 (en) 2016-01-21 2024-01-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 optical camouflage filters
CN105647124A (en) * 2016-04-12 2016-06-08 苏州甫众塑胶有限公司 Electronic packaging plastic material and preparation method thereof
TW201816024A (en) * 2016-05-09 2018-05-01 漢高智慧財產控股公司 Adhesive compositions containing reactive silsesquioxanes
JP2018016672A (en) * 2016-07-25 2018-02-01 アイカ工業株式会社 Grease-like epoxy resin composition
KR101806739B1 (en) * 2016-09-28 2017-12-07 현대자동차주식회사 Composition for Tape Type Structural Adhesive
RU2627419C1 (en) * 2016-10-12 2017-08-08 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Epoxy adhesive binder and film glue on its basis
CN110997789B (en) * 2017-05-25 2022-10-04 汉高股份有限及两合公司 Curable composition
EP3645599A1 (en) * 2017-06-29 2020-05-06 3M Innovative Properties Company Curable composition
WO2019087258A1 (en) * 2017-10-30 2019-05-09 日立化成株式会社 Resin composition, cured product, molding and method for producing same, film capacitor and method or producing same
CN107828360A (en) * 2017-11-16 2018-03-23 西安长峰机电研究所 A kind of normal temperature cure solid rocket motor nozzle structural adhesive
FR3074178B1 (en) * 2017-11-29 2020-05-22 Adhex Technologies LATENT HEAT-ACTIVABLE STRUCTURAL ADHESIVE COMPOSITION AND MANUFACTURING METHOD THEREOF
KR101880003B1 (en) * 2017-12-29 2018-07-18 국방과학연구소 High-temperature structure paste adhesive capable of low temperature curing
CN108192550A (en) * 2018-02-02 2018-06-22 东莞市精滤电子科技有限公司 High heat conductive insulating glue and preparation method and application
MX2020008332A (en) 2018-02-09 2020-09-21 Ppg Ind Ohio Inc Coating compositions.
WO2019168064A1 (en) 2018-02-28 2019-09-06 日本製鉄株式会社 Metal-fiber reinforced resin material composite body and method for producing metal-fiber reinforced resin material composite body
JP7184874B2 (en) * 2018-03-28 2022-12-06 株式会社カネカ adhesive composition
US11370908B2 (en) * 2018-06-27 2022-06-28 3M Innovative Properties Company Curable compositions and related methods
RU2686919C1 (en) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Epoxide adhesive binder, film adhesive and adhesive prepreg on its basis
RU2686917C1 (en) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Epoxy adhesive binding and filming adhesive based thereon
JP7252314B2 (en) * 2018-07-27 2023-04-04 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Two-component epoxy composition
WO2020082006A1 (en) * 2018-10-18 2020-04-23 Illinois Tool Works Inc. Low halogen two component toughened epoxy adhesive
CA3117241A1 (en) * 2018-10-29 2020-05-07 Henkel Ag & Co. Kgaa Thermal conductive potting composition
JP2022514530A (en) * 2018-12-18 2022-02-14 サイテック インダストリーズ インコーポレイテッド Flame-retardant epoxy-based composition and method of using it
DE102019107633A1 (en) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Multi-component system and method for producing a multi-component system
EP3947560A1 (en) * 2019-03-25 2022-02-09 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
KR20210144717A (en) * 2019-03-28 2021-11-30 닛토덴코 가부시키가이샤 Curable adhesive sheet, and method of manufacturing the curable adhesive sheet
MX2021012761A (en) * 2019-04-18 2022-01-19 Dow Global Technologies Llc Latent catalyst.
JP6923090B2 (en) * 2019-04-23 2021-08-18 Dic株式会社 Curable composition, cured product, fiber reinforced composite material, molded product and its manufacturing method
RU2706661C1 (en) * 2019-05-13 2019-11-19 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Epoxy binder, prepreg based thereon and article made therefrom
KR102197044B1 (en) * 2019-06-18 2020-12-30 (주)유니테크 Adhesive composition for automobility
MX2022003390A (en) * 2019-09-23 2022-04-19 Ppg Ind Ohio Inc Curable compositions.
RU2718831C1 (en) * 2019-10-10 2020-04-14 Акционерное общество "Препрег-Современные Композиционные Материалы" Epoxy binder, prepreg based thereon and article made therefrom
CN110903661B (en) * 2019-11-20 2021-12-14 中路交科科技股份有限公司 U-pave special modified asphalt and preparation method and application method thereof
EP3825355A1 (en) * 2019-11-22 2021-05-26 Henkel AG & Co. KGaA High glass transition temperature formulations for laminates
CN111303816B (en) * 2020-04-07 2021-08-20 山东送变电工程有限公司 Epoxy resin adhesive for electric paying-off pulley wheel sheet
WO2021220090A1 (en) * 2020-04-28 2021-11-04 3M Innovative Properties Company Curable composition
CN111574938B (en) * 2020-06-02 2021-09-07 黑龙江省科学院石油化学研究院 Self-heat-absorption core-shell toughening material, heat-breaking structure adhesive film containing self-heat-absorption core-shell toughening material, and preparation method and application of heat-breaking structure adhesive film
US20220002578A1 (en) * 2020-07-02 2022-01-06 Carboline International Corporation Epoxy compositions
US20240010889A1 (en) * 2020-12-24 2024-01-11 Sika Technology Ag One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
WO2023039504A1 (en) * 2021-09-09 2023-03-16 Ppg Industries Ohio, Inc. Adhesive composition with lightweight filler
WO2023076650A1 (en) * 2021-10-29 2023-05-04 Zephyros, Inc. Reaction induced color-change composition
CN115975346B (en) * 2023-03-13 2023-07-28 北京天仁道和新材料有限公司 Epoxy resin premix for OOA cured prepreg and preparation method thereof
CN116879110B (en) * 2023-09-06 2023-12-01 道生天合材料科技(上海)股份有限公司 Risk assessment method for sliding behavior after structural adhesive sizing

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5877229A (en) 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
DE10228649A1 (en) * 2002-06-26 2004-01-22 Bakelite Ag Process for the production of a fiber-reinforced product based on epoxy resin
US20050137357A1 (en) * 2003-12-18 2005-06-23 Skoglund Michael J. Epoxy adhesive composition method of preparing and using
WO2006019041A1 (en) * 2004-08-18 2006-02-23 Kaneka Corporation Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
CA2620028C (en) * 2005-08-24 2014-01-28 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance
RU2432367C2 (en) * 2006-06-07 2011-10-27 Зефирос, Инк. Method of sealing, shielding and hardening self-propelled vehicle section
JP5307714B2 (en) * 2006-07-31 2013-10-02 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Curable epoxy resin adhesive composition
DE602007007992D1 (en) 2007-01-17 2010-09-02 Hexcel Composites Ltd LOW TEMPERATURE CALCULATION OF IMPACT TOOL MODIFIED EPOXY ADHESIVES
US8088245B2 (en) 2007-04-11 2012-01-03 Dow Global Technologies Llc Structural epoxy resins containing core-shell rubbers
CN101412896B (en) * 2007-10-17 2012-07-25 比亚迪股份有限公司 Bicomponent epoxy adhesive and preparation thereof
GB0806434D0 (en) * 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
ES2662646T3 (en) 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Highly reinforced, new generation two-part structural epoxy adhesive compositions
US8309633B2 (en) 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
JP4416046B1 (en) * 2008-08-08 2010-02-17 横浜ゴム株式会社 Epoxy resin composition and structural adhesive
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
KR101296986B1 (en) * 2009-02-27 2013-08-14 모멘티브 스페셜티 케미칼즈 인코포레이티드 Compositions useful for non-cellulose fiber sizing, coating or binding compositions, and composites incorporating same
WO2011025873A1 (en) 2009-08-31 2011-03-03 Cytec Technology Corp. High performance adhesive compositions
BR112012014924B1 (en) 2009-12-17 2019-12-10 Essilor Int thermosetting functional epoxy composition and thermosetting corrosion resistant hard coatings prepared therefrom
WO2013070478A1 (en) * 2011-11-08 2013-05-16 Dow Global Technologies Llc Bimodal toughening agents for thermosettable epoxy resin compositions
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof

Also Published As

Publication number Publication date
CA2854825C (en) 2019-11-12
CA3052816A1 (en) 2013-05-16
TWI576404B (en) 2017-04-01
US20130115442A1 (en) 2013-05-09
CA3052816C (en) 2020-07-07
US8895148B2 (en) 2014-11-25
RU2592274C2 (en) 2016-07-20
KR20140100463A (en) 2014-08-14
BR112014010798B1 (en) 2021-05-04
RU2014123295A (en) 2015-12-20
BR112014010798A2 (en) 2017-04-25
JP2015501853A (en) 2015-01-19
EP2776487A1 (en) 2014-09-17
AU2012336202A1 (en) 2014-02-06
US8974905B2 (en) 2015-03-10
MX362835B (en) 2019-02-19
JP5964980B2 (en) 2016-08-03
MY187410A (en) 2021-09-22
CN103797043B (en) 2016-09-07
US20150030844A1 (en) 2015-01-29
CA2854825A1 (en) 2013-05-16
TW201323556A (en) 2013-06-16
KR102052389B1 (en) 2019-12-05
CN103797043A (en) 2014-05-14
WO2013070415A1 (en) 2013-05-16
MY168074A (en) 2018-10-11
MX2014005116A (en) 2014-05-28
AU2012336202B2 (en) 2015-12-03

Similar Documents

Publication Publication Date Title
IN2014CN03459A (en)
BRPI0915938A2 (en) mixing, process for preparing the mixture, use of the mixture, structural adhesive, and cured epoxy resin
MX2018006138A (en) Structural adhesive with improved failure mode.
MY156295A (en) High performance adhesive compositions
WO2014004900A3 (en) Benzoxazine resin composition, prepreg, and fiber-reinforced composite material
JP2016522278A5 (en)
BR112016029780A2 (en) fast curing epoxy adhesive compositions
TW201708482A (en) Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board
MY173397A (en) Liquid hardeners for hardening epoxide resins (i)
BR112014032019A2 (en) adhesive, method for making an epoxy adhesive and kit
BR112017013230A2 (en) epoxy resin composition
DE602007005661D1 (en) HARDENABLE SILICONE COMPOSITION AND ELECTRONIC COMPONENT
BR112015008662B8 (en) resin system, composite material, and, method to retain the morphology of the ilt thermoplastic polyamide particles and / or reduce or eliminate micro-cracks and / or compression performance in a cured resin
PH12014502374A1 (en) Composition for film adhesives, method for producing same, film adhesive, semiconductor package using film adhesive and method for manufacturing semiconductor package using film adhesive
WO2012087602A3 (en) Epoxy resin system containing insoluble and partially soluble or swellable toughening particles for use in prepreg and structural component applications
BR112015007956A2 (en) composition, process for preparing a composition, prepreg, coating, composite, electrical laminate and electronic adhesive
TW201129666A (en) Adhesive composition for semiconductor device and die attach film
RU2016100977A (en) COMPOSITIONS OF STRUCTURAL ADHESIVES
BR112015032696A2 (en) epoxy resin-based composition as a filler for beehive cells
WO2013081895A3 (en) Liquid accelerator composition for hardeners
WO2018073652A3 (en) Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom
CN106519571A (en) Epoxy resin system
WO2011048022A3 (en) Impact resistant two-component epoxy-based substance curing at room temperature
WO2016117579A9 (en) Thermosetting resin composition, cured film, substrate provided with cured film, and electronic component
CN106893540A (en) A kind of high-temperature Resistance Adhesives