CN106519571A - Epoxy resin system - Google Patents
Epoxy resin system Download PDFInfo
- Publication number
- CN106519571A CN106519571A CN201610982667.5A CN201610982667A CN106519571A CN 106519571 A CN106519571 A CN 106519571A CN 201610982667 A CN201610982667 A CN 201610982667A CN 106519571 A CN106519571 A CN 106519571A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- resin systems
- epoxy resin
- systems according
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an epoxy resin system. The epoxy resin system comprises 100 parts of epoxy resin, 30 to 45 parts of a flexibilizer, 60 to 70 parts of a curing agent, 8 to 16 parts of a curing accelerator, 4 to 9 parts of a modifying agent, 2 to 8 parts of a diluent, 6 to 11 parts of a filler, 3 to 6 parts of a hindered amine light stabilizer, and 0.5 to 1 part of an ultraviolet light absorber. The epoxy resin system is high in binding strength, toughness, and heat resistance; the epoxy resin curing accelerator is added, biphenol diglycidyl ether epoxy resin is taken as the epoxy resin curing accelerator, and excellent epoxy resin curing performance is achieved.
Description
Technical field
The present invention relates to anti-corrosion material field, and in particular to a kind of epoxy-resin systems.
Background technology
Epoxy resin has good adhesive property because of the special three-membered ring structures of its epoxy radicals, and epoxy resin adds
Work, design are all very prominent, so Jing is used frequently as the matrix of composite.In low temperature field, epoxy resin is most
One of main matrices of composite material because epoxy resin is used as a kind of universal thermosetting resin, its have high mechanical properties,
Adhesive force is strong, volume contraction is little, processing performance is good, electrical insulating property is excellent, it is corrosion-resistant many advantages, such as, and obtained widely should
With.
But the epoxy resin of epoxy resin, particularly low-molecular-weight, during its solidification, crosslink density is high, and film is very crisp, soft
Toughness is very poor, and impact resistance, peeling resistance are bad, affects adhesive force and the barrier propterty of epoxy resin, limits epoxy
Application of the resin in some fields.
The content of the invention
It is an object of the invention to overcome the problem above that prior art is present, there is provided a kind of epoxy-resin systems, this
The adhesive strength height of bright composition epoxy resin, good toughness, heat-resist, quick solidifying.
For realizing above-mentioned technical purpose, above-mentioned technique effect is reached, the present invention is achieved through the following technical solutions：
A kind of epoxy-resin systems, in parts by weight, epoxy-resin systems formula includes：
Further include, the toughener is the mixture of polyurethane and nano silicon, the polyurethane and nanometer
The mass ratio of silicon dioxide is 1.5:1, the particle diameter of the nano silicon is 20-160nm.
Further include, the firming agent includes：Fatty amine, aromatic amine, polyamide, the viscosity of the firming agent is at 25 DEG C
When, 3000-9000mPa.s.
Further include, the firming agent accelerator is '-biphenyl diphenol diglycidyl ether-type epoxy resin.
Further include, the modifying agent includes：Isocyanates, polyester resin, polyamide.
Further include, the diluent include it is following in one or more：Ethylene glycol diglycidyl ether, 1,6- oneself
Hexanediol diglycidyl ether, polyethyleneglycol diglycidylether, resorcinolformaldehyde resin.
Further include, described filler includes：Silica flour, aluminium powder, Pulvis Talci.
Further include, the hindered amine light stabilizer include it is following in one or more：SA two (2,2,6,
6- tetramethyl -4- piperidyls) ester, poly- (1- ethoxy -2,2,6,6- tetramethyl -4- hydroxy piperidines) succinate, phosphorous acid three
(1,2,2,6,6- pentamethvl bases) ester.
Further include, the UV absorbent includes：UV40、UV530、UV571.
The invention has the beneficial effects as follows:
It is the adhesive strength height of epoxy-resin systems of the present invention, good toughness, heat-resist, asphalt mixtures modified by epoxy resin is introduced in the system
Fat curing accelerator, '-biphenyl diphenol diglycidyl ether-type epoxy resin as curing accelerator, with preferable epoxy resin
Curing performance.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, the specific embodiment of the present invention is shown in detail in by following examples.
Specific embodiment
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, this area is common
The every other embodiment obtained under the premise of creative work is not made by technical staff, belongs to the model of present invention protection
Enclose.
Embodiment 1
The formula of 1 epoxy resin system of embodiment, as shown in table 1.
The formula table of 1 embodiment 1 of table
| Component | Content (weight portion) |
| Epoxy resin | 100 |
| Toughener | 30 |
| Toughener (polyurethane+nano silicon) | 60 |
| '-biphenyl diphenol diglycidyl ether-type epoxy resin | 8 |
| Modifying agent | 4 |
| Diluent | 2 |
| Filler | 6 |
| Hindered amine light stabilizer | 3 |
| UV absorbent | 0.5 |
Embodiment 2
The formula of 2 epoxy resin system of embodiment, as shown in table 2.
The formula table of 2 embodiment 2 of table
| Component | Content (weight portion) |
| Epoxy resin | 100 |
| Toughener | 37 |
| Toughener (polyurethane+nano silicon) | 65 |
| '-biphenyl diphenol diglycidyl ether-type epoxy resin | 12 |
| Modifying agent | 6 |
| Diluent | 5 |
| Filler | 9 |
| Hindered amine light stabilizer | 5 |
| UV absorbent | 0.8 |
Embodiment 3
The formula of 3 epoxy resin system of embodiment, as shown in table 3.
The formula table of 3 embodiment 3 of table
| Component | Content (weight portion) |
| Epoxy resin | 100 |
| Toughener | 45 |
| Toughener (polyurethane+nano silicon) | 70 |
| '-biphenyl diphenol diglycidyl ether-type epoxy resin | 16 |
| Modifying agent | 9 |
| Diluent | 8 |
| Filler | 11 |
| Hindered amine light stabilizer | 6 |
| UV absorbent | 1 |
Wherein, the mixture of the polyurethane and nano silicon in embodiment 1-3 be toughener, above-mentioned polyurethane with receive
The mass ratio of rice silicon dioxide is 1.5:1, the particle diameter of above-mentioned nano silicon is 20-160nm.
Above-mentioned firming agent includes：Fatty amine, aromatic amine, polyamide, the viscosity of above-mentioned firming agent at 25 DEG C, 3000-
9000mPa.s。
Above-mentioned firming agent accelerator is '-biphenyl diphenol diglycidyl ether-type epoxy resin.
Above-mentioned modifying agent includes：Isocyanates, polyester resin, polyamide.
Above-mentioned diluent includes：Ethylene glycol diglycidyl ether, 1,6- hexanediol diglycidyl ether, Polyethylene Glycol two contract
Water glycerin ether, resorcinolformaldehyde resin.
Above-mentioned filler includes：Silica flour, aluminium powder, Pulvis Talci.
Above-mentioned hindered amine light stabilizer include it is following in one or more：Two (2,2,6,6- tetramethyl -4- of SA
Piperidyl) ester, poly- (1- ethoxy -2,2,6,6- tetramethyl -4- hydroxy piperidines) succinate, phosphorous acid three (1,2,2,6,6-
Pentamethvl base) ester.
Above-mentioned UV absorbent includes：UV40、UV530、UV571.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope for causing.
Claims (9)
1. a kind of epoxy-resin systems, it is characterised in that in parts by weight, epoxy-resin systems formula includes：
2. epoxy-resin systems according to claim 1, it is characterised in that the toughener is polyurethane and nano-silica
The mixture of SiClx, the polyurethane are 1.5 with the mass ratio of nano silicon:1, the particle diameter of the nano silicon
For 20-160nm.
3. epoxy-resin systems according to claim 1, it is characterised in that the firming agent includes：Fatty amine, fragrance
Amine, polyamide, the viscosity of the firming agent at 25 DEG C, 3000-9000mPa.s.
4. epoxy-resin systems according to claim 1, it is characterised in that the firming agent accelerator is '-biphenyl diphenol two
Diglycidyl ether type epoxy resin.
5. epoxy-resin systems according to claim 1, it is characterised in that the modifying agent includes：Isocyanates, polyester
Resin, polyamide.
6. epoxy-resin systems according to claim 1, it is characterised in that the diluent include it is following in one kind or
It is several：Ethylene glycol diglycidyl ether, 1,6- hexanediol diglycidyl ether, polyethyleneglycol diglycidylether, resorcinol
Diglycidyl ether.
7. epoxy-resin systems according to claim 1, it is characterised in that described filler includes：Silica flour, aluminium powder, cunning
Stone powder.
8. epoxy-resin systems according to claim 1, it is characterised in that the hindered amine light stabilizer includes following
In one or more：SA two (2,2,6,6- tetramethyl -4- piperidyls) ester, poly- (1- ethoxy -2,2,6,6- tetramethyls
Base -4- hydroxy piperidines) succinate, phosphorous acid three (1,2,2,6,6- pentamethvl base) ester.
9. epoxy-resin systems according to claim 1, it is characterised in that the UV absorbent includes：UV40、
UV530、UV571。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982667.5A CN106519571A (en) | 2016-11-09 | 2016-11-09 | Epoxy resin system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982667.5A CN106519571A (en) | 2016-11-09 | 2016-11-09 | Epoxy resin system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106519571A true CN106519571A (en) | 2017-03-22 |
Family
ID=58350157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610982667.5A Pending CN106519571A (en) | 2016-11-09 | 2016-11-09 | Epoxy resin system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106519571A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108515143A (en) * | 2018-04-13 | 2018-09-11 | 运城市绛县开发区恒通铸造有限公司 | A kind of composite profile cast tube and production method |
| CN109021766A (en) * | 2018-05-31 | 2018-12-18 | 长春智享优创科技咨询有限公司 | Uvioresistant epoxy resin composite coating and preparation method thereof |
| CN109517126A (en) * | 2018-11-20 | 2019-03-26 | 中国人民解放军海军工程大学 | A kind of polyurethane modified epoxy resin diluent and the low viscosity high-toughness epoxy resin composition being made from it |
| CN110105545A (en) * | 2019-05-24 | 2019-08-09 | 陕西生益科技有限公司 | A kind of epoxy curing agent |
| CN111117158A (en) * | 2019-12-23 | 2020-05-08 | 科化新材料泰州有限公司 | Low-cost low-stress epoxy composition and preparation method thereof |
| CN113717350A (en) * | 2021-08-19 | 2021-11-30 | 浙江福斯特新材料研究院有限公司 | Photocuring composition, packaging structure and semiconductor device |
-
2016
- 2016-11-09 CN CN201610982667.5A patent/CN106519571A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108515143A (en) * | 2018-04-13 | 2018-09-11 | 运城市绛县开发区恒通铸造有限公司 | A kind of composite profile cast tube and production method |
| CN109021766A (en) * | 2018-05-31 | 2018-12-18 | 长春智享优创科技咨询有限公司 | Uvioresistant epoxy resin composite coating and preparation method thereof |
| CN109517126A (en) * | 2018-11-20 | 2019-03-26 | 中国人民解放军海军工程大学 | A kind of polyurethane modified epoxy resin diluent and the low viscosity high-toughness epoxy resin composition being made from it |
| CN109517126B (en) * | 2018-11-20 | 2021-05-18 | 中国人民解放军海军工程大学 | Polyurethane modified epoxy resin diluent and low-viscosity high-toughness epoxy resin composition composed of same |
| CN110105545A (en) * | 2019-05-24 | 2019-08-09 | 陕西生益科技有限公司 | A kind of epoxy curing agent |
| CN111117158A (en) * | 2019-12-23 | 2020-05-08 | 科化新材料泰州有限公司 | Low-cost low-stress epoxy composition and preparation method thereof |
| CN113717350A (en) * | 2021-08-19 | 2021-11-30 | 浙江福斯特新材料研究院有限公司 | Photocuring composition, packaging structure and semiconductor device |
| CN113717350B (en) * | 2021-08-19 | 2024-02-23 | 浙江福斯特新材料研究院有限公司 | Photocurable composition, package structure, and semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106519571A (en) | Epoxy resin system | |
| IN2014CN03459A (en) | ||
| CN105331044B (en) | Ageing-resistant composition epoxy resin of uvioresistant and preparation method thereof | |
| CN105670223B (en) | Epoxy resin composition for wind turbine blade and composite material | |
| KR20120089622A (en) | Oxygen barrier compositions and related methods | |
| CN104479607A (en) | Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature | |
| CN104277419A (en) | Tough epoxy resin curing system and preparation method thereof | |
| WO2018207387A1 (en) | Resin composition, heat storage material, heat control material, and heat control sheet | |
| CN107286579A (en) | A kind of novel Room Temperature fast curable epoxy polyester resin | |
| CN105255416A (en) | Room-temperature curing epoxy adhesive and preparation method thereof | |
| CN105385109B (en) | A kind of composition epoxy resin and its purposes in dipping coil is prepared | |
| CN106566195A (en) | Aging-resistant rapid-curing epoxy resin system | |
| CN107033823B (en) | Moisture-heat-resistant epoxy adhesive for nano rubber modified LED backlight source and preparation method thereof | |
| CN105505273A (en) | Structural bonding glue | |
| DE102012202161A1 (en) | Electrical insulating resin based on Isohexiddioldiglycidethern | |
| CN109627426A (en) | A kind of preparation method of epoxy latent curing agent | |
| CN105331052B (en) | A kind of composition epoxy resin | |
| CN115073873A (en) | Photo-thermal dual-system curing pultrusion resin and production process | |
| JP3902140B2 (en) | Epoxy resin composition | |
| CN103289623A (en) | Bi-component adhesive for wood floor | |
| CN110746741A (en) | Resin composite material and preparation method and application thereof | |
| CN108794981A (en) | Fire-retardant epoxy resin and preparation method thereof | |
| CN104745130A (en) | High-performance epoxy adhesive | |
| CN111333997A (en) | Toughened clay-like composite material composition | |
| CN109401708A (en) | A kind of normal temperature cure casting glue and its application method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170322 |
|
| WD01 | Invention patent application deemed withdrawn after publication |