CN109627426A - Preparation method of epoxy latent curing agent - Google Patents
Preparation method of epoxy latent curing agent Download PDFInfo
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- CN109627426A CN109627426A CN201811397336.0A CN201811397336A CN109627426A CN 109627426 A CN109627426 A CN 109627426A CN 201811397336 A CN201811397336 A CN 201811397336A CN 109627426 A CN109627426 A CN 109627426A
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- epoxy
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 25
- 239000004593 Epoxy Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 30
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 8
- 150000002460 imidazoles Chemical class 0.000 claims description 8
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000011863 silicon-based powder Substances 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004327 boric acid Substances 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 4
- 239000001530 fumaric acid Substances 0.000 claims description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 6
- 239000002994 raw material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010426 asphalt Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229940125717 barbiturate Drugs 0.000 description 3
- -1 hydrogen imidazoles Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- AGJXDKGTTMVHOU-UHFFFAOYSA-N [4-(hydroxymethyl)-1h-imidazol-5-yl]methanol Chemical compound OCC=1N=CNC=1CO AGJXDKGTTMVHOU-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- QDYTUZCWBJRHKK-UHFFFAOYSA-N imidazole-4-methanol Chemical compound OCC1=CNC=N1 QDYTUZCWBJRHKK-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The latent epoxy curing agent is prepared through the reaction of epoxy resin and active hydrogen imidazole, the subsequent addition of inorganic stuffing and inorganic or organic weak acid and final crushing into 5-10 micron size powder.
Description
Technical field
The present invention relates to a kind of preparation methods of epoxy latency, belong to electronic adhesives field.
Background technique
A kind of Common Curing Agents of the imidazole curing agent as epoxy resin, can be in lower temperature with seldom amount
Degree, faster speed obtains the preferable solidfied material of heat resistance, while can also be used as acid anhydrides, the curing accelerator of dicyandiamide.
However imidazoles and epoxy resin are made into single-component epoxy system, Storage period is still partially short, to limit it in one pack system ring
The application of oxygen system.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of epoxy latent curing agent and preparation method thereof, the present invention
Epoxy latent curing agent easily disperse, storage stability is excellent, while can be widely applied to single group with medium temperature rapid curing
Divide in epoxy systems.
The technical scheme to solve the above technical problems is that
A kind of epoxy latent curing agent and preparation method thereof, which is characterized in that the latent curing agent is by 100 parts of asphalt mixtures modified by epoxy resin
Rouge reacted in 50-100 parts of solvents with the imidazoles of 20-50 active hydrogen be made, then add part 5-20 inorganic filler and
The organic monoacid of 0.1-1 mass parts had both obtained 5-10 microns of micro mist curing agent after finally pulverizing and sieving again.
The beneficial effects of the present invention are: epoxy latent curing agent of the invention easily disperses, storage stability is excellent, simultaneously
It can be can be widely applied in single-component epoxy system with medium temperature rapid curing.
Based on the above technical solution, the present invention can also be improved as follows.
The epoxy resin is EP 828 EL, the DER of DOW company of Hexion in low-viscosity bisphenol A or bisphenol F resin
The mixture of the EXA-830LVP one or more of the EP-4901E of 331, ADEKA companies, DIC.
Beneficial effect using above-mentioned further scheme is that the skeleton structure of low-viscosity bisphenol A and bisphenol F epoxy resin is determined
Its solidfied material has been determined with preferable obdurability and heat resistance, and hydroxyl therein assigns it with preferable adhesive property.
Further, the imidazoles is to have following with one of active hydrogen imidazoles or any several mixture
Molecular structure, wherein R1,R2Including but not limited to hydrogen, phenyl, one kind of alkyl.
Beneficial effect using above-mentioned further scheme is that imidazoles solidfied material has preferable temperature tolerance, and mechanical performance is resistance to
The comprehensive performance of final products can be improved in solvent borne etc..
Further, the solvent is benzene, toluene, dimethylbenzene, butanone, one of or any several mixture.
Beneficial effect using above-mentioned further scheme is imidazoles can be dissolved in a solvent, be made before reaction early period
It must react more abundant, while with after epoxy resin reaction and insoluble in solvent, be easily isolated.
Further, the inorganic filler be silicon powder, calcium carbonate, talcum powder, bentonite, one of kaolin or
Any several mixture.
Beneficial effect using above-mentioned further scheme is, since reaction product is that excessive imidazoles and epoxy resin are anti-
It answers, so the extent of reaction is not high, melting is easy in the crushing process in later period, is reunited, inorganic filler is added and makes final dive
Volt property curing agent is easier to crush, and not conglomeration, later period use process is easier to be distributed in epoxy systems.
Further, the organic monoacid be citric acid, salicylic acid, barbiturates, adipic acid, fumaric acid, maleic acid,
One of boric acid or any several mixture.
Beneficial effect using above-mentioned further scheme is to further increase the storage stability of final products.
Another technical solution that the present invention solves above-mentioned technical problem is as follows: a kind of preparation side of epoxy latent curing agent
Method, specific preparation step are as follows: imidazoles and solvent are charged first to the reactor with thermometer, constant pressure funnel and condenser
In, it under the protection of nitrogen, heats, then slowly heats up again while stirring, temperature rises to 120 DEG C, is then added dropwise to ring in 1h
Oxygen resin, then 2h is reacted under this condition, it stirs evenly, is finally sloughed in vacuum molten after adding inorganic filler and organic monoacid
Agent, be cooled to room temperature pulverize and sieve both epoxy latent curing agent.
Specific embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit
Determine the scope of the present invention.
Embodiment 1
Raw material is weighed according to following mass parts
EP-828EL: 100 parts
2-methylimidazole 20
Salicylic acid: 1 part
Silicon powder: 20 parts
50 parts of toluene
2-methylimidazole and toluene are charged first to thermometer, in the reactor of constant pressure funnel and condenser, in nitrogen
It under the protection of gas, heating, then slowly heats up again while stirring, temperature rises to 120 DEG C, and then 60min drips epoxy resin,
It reacts 2h under this condition again, is stirred evenly after adding silicon powder and salicylic acid, finally slough solvent in vacuum, be cooled to room
Temperature, which pulverizes and sieves, both obtains epoxy latent curing agent.
Embodiment 2
Raw material is weighed according to following mass parts
EP-4901E: 100 parts
2- phenylimidazole 25
Barbiturates: 0.2 part
Talcum powder: 100 parts
75 parts of dimethylbenzene
2- phenylimidazole and dimethylbenzene are charged first to thermometer, in the reactor of constant pressure funnel and condenser,
It under the protection of nitrogen, heats, then slowly heats up again while stirring, temperature rises to 120 DEG C, and then 40min drips asphalt mixtures modified by epoxy resin
Rouge EP-4901E, then 2h is reacted under this condition, it stirs evenly after adding talcum powder and barbiturates, is finally sloughed in vacuum
Solvent, be cooled to room temperature pulverize and sieve both epoxy latent curing agent.
Embodiment 3
Raw material is weighed according to following mass parts
EXA-830LVP: 100 parts
- 4 methylimidazole 35 of 2- ethyl
Boric acid: 0.6 part
Montmorillonite: 5 parts
100 parts of toluene
2-ethyl-4-methylimidazole and toluene are charged first to the reactor with thermometer, constant pressure funnel and condenser
In, it under the protection of nitrogen, heats, then slowly heats up again while stirring, temperature rises to 120 DEG C, and then 30min drips ring
Oxygen resin, then 2h is reacted under this condition, it is stirred evenly after adding montmorillonite and boric acid, finally sloughs solvent in vacuum, it is cold
But it pulverizes and sieves to room temperature and both obtains epoxy latent curing agent.
Embodiment 4
Raw material is weighed according to following mass parts
EP-828EL: 100 parts
2- heptadecyl imidazole 40
Citric acid: 1 part
Calcium carbonate: 15 parts
60 parts of toluene
2- heptadecyl imidazole and toluene are charged first to thermometer, in the reactor of constant pressure funnel and condenser,
It under the protection of nitrogen, heats, then slowly heats up again while stirring, temperature rises to 120 DEG C, and then 60min drips epoxy
Resin, then 2h is reacted under this condition, it is stirred evenly after adding calcium carbonate and citric acid, finally sloughs solvent in vacuum, it is cold
But it pulverizes and sieves to room temperature and both obtains epoxy latent curing agent.
Embodiment 5
Raw material is weighed according to following mass parts
EP-828EL: 100 parts
50 parts of 2 pheny1 4,5 dihydroxymethyl imidazole
Fumaric acid: 1 part
Silicon powder: 20 parts
70 parts of toluene
2- phenyl -4,5- hydroxymethyl-imidazole and toluene are charged first to thermometer, constant pressure funnel and condenser
It in reactor, under the protection of nitrogen, heats, then slowly heats up again while stirring, temperature rises to 120 DEG C, then 60min drop
Epoxy resin is added, then reacts 2h under this condition, is stirred evenly after adding silicon powder and fumaric acid, is finally sloughed in vacuum
Solvent, be cooled to room temperature pulverize and sieve both epoxy latent curing agent.
Specific verification experimental verification
Epoxy latent curing agent obtained by the above embodiment of the present invention 1~5 is verified by following tests.
Test experiments 1: softening point is measured according to GB/T 15332-94；
Test experiments 2: adhesive working life is according to (GB/T 7123.1-2002 measurement；
Test result is as follows shown in table 1.
The properties of sample contrast test result of 1 embodiment 1-5 of table
| Sample serial number | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 |
| Softening point (DEG C) | 90 | 100 | 95 | 105 | 110 |
| 25 DEG C of working lives (day) | 30 | 25 | 35 | 28 | 35 |
| 120 DEG C of gel times (min) | 5 | 4 | 7 | 6 | 8 |
| 150 DEG C of gel times (min) | 2 | 1 | 3 | 4 | 5 |
Note: the mass ratio for being standard Bisphenol-A epoxy resin EP-828EL and latent curing agent is 100:25
As it can be seen from table 1 epoxy latent curing agent softening point with higher synthesized by the present invention, while and asphalt mixtures modified by epoxy resin
There is preferable storage stability and faster Chinese curing rate, especially suitable in single-component epoxy system after rouge cooperation.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of preparation method of epoxy latent curing agent, which is characterized in that preparation step are as follows: in parts by mass, by 5-20
Part imidazoles and 50-100 parts of solvents are charged first in the reactor with constant pressure funnel and condenser, in the protection of nitrogen
Under, it heating, then slowly heats up again while stirring, temperature rises to 120 DEG C, then it is added dropwise to 100 parts of epoxy resin in 1h, then
2h is reacted under this condition, is stirred evenly after adding 5-20 parts of inorganic fillers and 0.1-2 parts of organic monoacids, is finally sloughed in vacuum
Solvent, be cooled to room temperature pulverize and sieve both epoxy latent curing agent.
2. preparation method according to claim 1, which is characterized in that the epoxy resin is low-viscosity bisphenol A or Bisphenol F
828 EL of EP of resin Hexion, the DER 331 of DOW company, the EXA-830LVP mono- of the EP-4901E of ADEKA company, DIC
Kind or several mixtures.
3. preparation method according to claim 1, which is characterized in that the imidazole molecule structure is as follows, wherein R1,R2Packet
Contain but be not limited to hydrogen, phenyl, one kind of alkyl,
。
4. preparation method according to claim 1, which is characterized in that the solvent is benzene, toluene, dimethylbenzene, in butanone
One or any of several mixture.
5. preparation method according to claim 1, which is characterized in that the inorganic filler is silicon powder, calcium carbonate, talcum
Powder, bentonite, one of kaolin or any several mixture, partial size are 1-10 microns.
6. preparation method according to claim 1, which is characterized in that the organic monoacid is citric acid, salicylic acid, bar ratio
Appropriate acid, adipic acid, fumaric acid, maleic acid, one of boric acid or any several mixture.
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| CN201811397336.0A CN109627426B (en) | 2018-11-22 | 2018-11-22 | Preparation method of epoxy latent curing agent |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111808268A (en) * | 2020-07-23 | 2020-10-23 | 苏州科技大学 | Epoxy resin latent curing agent and preparation method thereof |
| CN115160229A (en) * | 2022-05-31 | 2022-10-11 | 上海大学 | Modified imidazole latent epoxy resin curing agent and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546155A (en) * | 1983-09-30 | 1985-10-08 | Ajinomoto Co., Inc. | Latent curing agents for epoxy resins |
| JPS61268721A (en) * | 1985-05-24 | 1986-11-28 | Asahi Chem Ind Co Ltd | Curing agent for epoxy resin |
| CN1537878A (en) * | 2003-10-22 | 2004-10-20 | 萍 刘 | Manufacturing method of latent solidifying agent |
-
2018
- 2018-11-22 CN CN201811397336.0A patent/CN109627426B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546155A (en) * | 1983-09-30 | 1985-10-08 | Ajinomoto Co., Inc. | Latent curing agents for epoxy resins |
| JPS61268721A (en) * | 1985-05-24 | 1986-11-28 | Asahi Chem Ind Co Ltd | Curing agent for epoxy resin |
| CN1537878A (en) * | 2003-10-22 | 2004-10-20 | 萍 刘 | Manufacturing method of latent solidifying agent |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111808268A (en) * | 2020-07-23 | 2020-10-23 | 苏州科技大学 | Epoxy resin latent curing agent and preparation method thereof |
| CN115160229A (en) * | 2022-05-31 | 2022-10-11 | 上海大学 | Modified imidazole latent epoxy resin curing agent and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN109627426B (en) | 2020-11-10 |
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