CN105647124A - Electronic packaging plastic material and preparation method thereof - Google Patents
Electronic packaging plastic material and preparation method thereof Download PDFInfo
- Publication number
- CN105647124A CN105647124A CN201610222655.2A CN201610222655A CN105647124A CN 105647124 A CN105647124 A CN 105647124A CN 201610222655 A CN201610222655 A CN 201610222655A CN 105647124 A CN105647124 A CN 105647124A
- Authority
- CN
- China
- Prior art keywords
- plastic material
- packaging plastic
- electronic packaging
- parts
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5816—Measuring, controlling or regulating temperature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides an electronic packaging plastic material and a preparation method thereof. The preparation method comprises the following steps: mixing and stirring 3-aminopropyltriethoxysilane, gamma-thiopropyltrimethoxysilane, ethyl acetate and acetone, adding glass fibers and ramee fibers, stirring, standing, filtering, and drying in a drying oven; mixing a bisphenol F epoxy resin, a polyethersulfone resin, dicyanodiamine, dichlorophenyl dimethyl urea, ethylene bis stearamide, butyl stearate, N,N-dimethylformamide and isophorone diamine, heating while stirring, adding the treated fibers, continuing stirring, drying in a vacuum drying oven, pouring into a mold, and carrying out pressure molding. The electronic packaging plastic material has the advantages of favorable aging resistance, excellent mechanical properties and long service life.
Description
Technical field
The present invention relates to Material Field, be specifically related to a kind of Electronic Packaging plastic material and preparation method thereof.
Background technology
Plastic material is modern social development and a progressive indispensable part, no matter being all seen everywhere in life or production, meanwhile, it is also a mark of a kind of modernization. Along with the progress of science and technology, every profession and trade is also more and more higher for the requirement of material, especially develops swift and violent electron trade. Do not require nothing more than it and have some properties, also more and more higher simultaneously for its service life. The service life of general electronic products is not long, and particularly in, under hygrothermal environment, being substantially reduced the service life of electronic material, the waste of a kind of resource is not only in the shortening in life-span, also result in burden for environment. Therefore, research is a kind of ageing-resistant, and properties is relatively superior, and the electronic package material of life-span length, for extending the service life of electronic product, reduces environmental disruption pressure and has important practical significance.
Summary of the invention
Solve the technical problem that:It is an object of the invention to provide a kind of Electronic Packaging plastic material, have good ageing-resistant performance, mechanical property is good simultaneously, long service life.
Technical scheme:A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 40-60 part, polyethersulfone resin 20-30 part, glass fibre 5-10 part, ramee 2-5 part, dicyan diamino 2-5 part, Dichlorobenzene base Dimethylcarbamide 1-2 part, ethylene bis stearamide 1-2 part, butyl stearate 1-3 part, APTES 1-2 part, ��-mercaptopropyl trimethoxysilane 2-4 part, DMF 1-2 part, isophorone diamine 1-3 part, ethyl acetate 20-40 part, acetone 20-40 part.
It is preferred that, described a kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 45-55 part, polyethersulfone resin 22-28 part, glass fibre 6-9 part, ramee 3-4 part, dicyan diamino 3-4 part, Dichlorobenzene base Dimethylcarbamide 1.2-1.7 part, ethylene bis stearamide 1.2-1.8 part, butyl stearate 1.5-2.5 part, APTES 1.3-1.8 part, ��-mercaptopropyl trimethoxysilane 2.5-3.5 part, N, dinethylformamide 1.2-1.8 part, isophorone diamine 1.5-2.5 part, ethyl acetate 25-35 part, acetone 25-35 part.
The preparation method of above-mentioned Electronic Packaging plastic material comprises the following steps:
Step 1: APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stirs 20-40 minute under rotating speed 60-80r/min with magnetic stirrer;
Step 2: add glass fibre and ramee, stirs 20-50 minute at temperature 50-70 DEG C, stands 2-3 hour;
Step 3: filter, put in baking oven, dries at temperature 80-100 DEG C;
Step 4: mixed by remaining ingredient, heats to 90-120 DEG C of stirring;
Step 5: add above-mentioned process fiber, continues stirring 30-50 minute;
Step 6: put at temperature 80-90 DEG C in vacuum drying oven, dries 2-3 hour under vacuum-0.1MPa;
Step 7: pouring into compressing in mould and get final product, first heating-up temperature is to 110-120 DEG C, and the time is 1 hour, is warming up to 130-140 DEG C, is incubated 2 hours, is continuously heating to 150-160 DEG C, is incubated 1 hour.
It is further preferred that step 1 medium speed is 65-75r/min, mixing time is 25-35 minute.
It is further preferred that temperature is 55-65 DEG C in step 2, mixing time is 30-40 minute, and time of repose is 2.5 hours.
It is further preferred that temperature is 85-95 DEG C in step 3.
It is further preferred that temperature is 100-110 DEG C in step 4.
It is further preferred that mixing time is 35-45 minute in step 5.
It is further preferred that temperature is 85 DEG C in step 6, drying time is 2.5 hours.
It is further preferred that first time heating is to 115 DEG C in step 7, second time heating is to 135 DEG C, and third time heating is to 155 DEG C.
Beneficial effect:The Electronic Packaging plastic material of the present invention has good ageing-resistant performance, at 70 DEG C after aging 30 days its hot strength, bending strength, impact strength and compressive strength retention rate respectively up to 71.5%, 64.3%, 85.6% and 81.7%, mechanical property is good, long service life.
Detailed description of the invention
Embodiment 1
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 40 parts, polyethersulfone resin 20 parts, glass fibre 5 parts, ramee 2 parts, dicyan diamino 2 parts, Dichlorobenzene base Dimethylcarbamide 1 part, ethylene bis stearamide 1 part, butyl stearate 1 part, APTES 1 part, ��-mercaptopropyl trimethoxysilane 2 parts, DMF 1 part, isophorone diamine 1 part, ethyl acetate 20 parts, 20 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 20 minutes under rotating speed 60r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 20 minutes under temperature 50 C, stand 2 hours, filter, put in baking oven, dry at temperature 80 DEG C; Being mixed by remaining ingredient, heating, to 90 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 30 minutes, put into temperature 80 DEG C in vacuum drying oven, dry 2 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 110 DEG C, time is 1 hour, is warming up to 130 DEG C, is incubated 2 hours, it is continuously heating to 150 DEG C, is incubated 1 hour.
Embodiment 2
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 45 parts, polyethersulfone resin 22 parts, glass fibre 6 parts, ramee 3 parts, dicyan diamino 3 parts, Dichlorobenzene base Dimethylcarbamide 1.2 parts, ethylene bis stearamide 1.2 parts, butyl stearate 1.5 parts, APTES 1.3 parts, ��-mercaptopropyl trimethoxysilane 2.5 parts, DMF 1.2 parts, isophorone diamine 1.5 parts, ethyl acetate 25 parts, 25 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 25 minutes under rotating speed 65r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 30 minutes at temperature 55 DEG C, stand 2.5 hours, filter, put in baking oven, dry at temperature 85 DEG C; Being mixed by remaining ingredient, heating, to 100 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 35 minutes, put into temperature 85 DEG C in vacuum drying oven, dry 2.5 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 115 DEG C, time is 1 hour, is warming up to 135 DEG C, is incubated 2 hours, it is continuously heating to 155 DEG C, is incubated 1 hour.
Embodiment 3
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 50 parts, polyethersulfone resin 25 parts, glass fibre 7.5 parts, ramee 3.5 parts, dicyan diamino 3.5 parts, Dichlorobenzene base Dimethylcarbamide 1.5 parts, ethylene bis stearamide 1.5 parts, butyl stearate 2 parts, APTES 1.5 parts, ��-mercaptopropyl trimethoxysilane 3 parts, DMF 1.5 parts, isophorone diamine 2 parts, ethyl acetate 30 parts, 30 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 30 minutes under rotating speed 70r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 35 minutes under temperature 60 C, stand 2.5 hours, filter, put in baking oven, dry at temperature 90 DEG C; Being mixed by remaining ingredient, heating, to 105 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 40 minutes, put into temperature 85 DEG C in vacuum drying oven, dry 2.5 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 115 DEG C, time is 1 hour, is warming up to 135 DEG C, is incubated 2 hours, it is continuously heating to 155 DEG C, is incubated 1 hour.
Embodiment 4
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 55 parts, polyethersulfone resin 28 parts, glass fibre 9 parts, ramee 4 parts, dicyan diamino 4 parts, Dichlorobenzene base Dimethylcarbamide 1.7 parts, ethylene bis stearamide 1.8 parts, butyl stearate 2.5 parts, APTES 1.8 parts, ��-mercaptopropyl trimethoxysilane 3.5 parts, DMF 1.8 parts, isophorone diamine 2.5 parts, ethyl acetate 35 parts, 35 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 35 minutes under rotating speed 75r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 40 minutes at temperature 65 DEG C, stand 2.5 hours, filter, put in baking oven, dry at temperature 95 DEG C; Being mixed by remaining ingredient, heating, to 110 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 45 minutes, put into temperature 85 DEG C in vacuum drying oven, dry 2.5 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 115 DEG C, time is 1 hour, is warming up to 135 DEG C, is incubated 2 hours, it is continuously heating to 155 DEG C, is incubated 1 hour.
Embodiment 5
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 60 parts, polyethersulfone resin 30 parts, glass fibre 10 parts, ramee 5 parts, dicyan diamino 5 parts, Dichlorobenzene base Dimethylcarbamide 2 parts, ethylene bis stearamide 2 parts, butyl stearate 3 parts, APTES 2 parts, ��-mercaptopropyl trimethoxysilane 4 parts, DMF 2 parts, isophorone diamine 3 parts, ethyl acetate 40 parts, 40 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 40 minutes under rotating speed 80r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 50 minutes under temperature 70 C, stand 3 hours, filter, put in baking oven, dry at temperature 100 DEG C; Being mixed by remaining ingredient, heating, to 120 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 50 minutes, put into temperature 90 DEG C in vacuum drying oven, dry 3 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 120 DEG C, time is 1 hour, is warming up to 140 DEG C, is incubated 2 hours, it is continuously heating to 160 DEG C, is incubated 1 hour.
Comparative example 1
The present embodiment and embodiment 5 are distinctive in that and do not contain ramee. Specifically:
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 60 parts, polyethersulfone resin 30 parts, glass fibre 10 parts, dicyan diamino 5 parts, Dichlorobenzene base Dimethylcarbamide 2 parts, ethylene bis stearamide 2 parts, butyl stearate 3 parts, APTES 2 parts, ��-mercaptopropyl trimethoxysilane 4 parts, DMF 2 parts, isophorone diamine 3 parts, ethyl acetate 40 parts, 40 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 40 minutes under rotating speed 80r/min with magnetic stirrer, it is subsequently adding glass fibre, stir 50 minutes under temperature 70 C, stand 3 hours, filter, put in baking oven, dry at temperature 100 DEG C; Being mixed by remaining ingredient, heating, to 120 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 50 minutes, put into temperature 90 DEG C in vacuum drying oven, dry 3 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 120 DEG C, time is 1 hour, is warming up to 140 DEG C, is incubated 2 hours, it is continuously heating to 160 DEG C, is incubated 1 hour.
Comparative example 2
The present embodiment and embodiment 5 are distinctive in that and replace isophorone diamine with N,N-dimethylformamide. Specifically:
A kind of Electronic Packaging plastic material, it is prepared from weight portion by following component: bisphenol f type epoxy resin 60 parts, polyethersulfone resin 30 parts, glass fibre 10 parts, ramee 5 parts, dicyan diamino 5 parts, Dichlorobenzene base Dimethylcarbamide 2 parts, ethylene bis stearamide 2 parts, butyl stearate 3 parts, APTES 2 parts, ��-mercaptopropyl trimethoxysilane 4 parts, DMF 2 parts, ethyl acetate 40 parts, 40 parts of acetone.
The preparation method of above-mentioned Electronic Packaging plastic material is: first APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stir 40 minutes under rotating speed 80r/min with magnetic stirrer, it is subsequently adding glass fibre and ramee, stir 50 minutes under temperature 70 C, stand 3 hours, filter, put in baking oven, dry at temperature 100 DEG C;Being mixed by remaining ingredient, heating, to 120 DEG C of stirrings, is subsequently adding above-mentioned process fiber, continue stirring 50 minutes, put into temperature 90 DEG C in vacuum drying oven, dry 3 hours under vacuum-0.1MPa, finally pour into compressing in mould and get final product, first heating-up temperature is to 120 DEG C, time is 1 hour, is warming up to 140 DEG C, is incubated 2 hours, it is continuously heating to 160 DEG C, is incubated 1 hour.
Its every mechanical performance index is measured after at each embodiment before ageing with 70 DEG C aging 30 days, result is shown in following table, it may be seen that the embodiment of the present invention has good ageing-resistant performance, its hot strength, bending strength, impact strength and compressive strength retention rate respectively up to 71.5%, 64.3%, 85.6% and 81.7%, mechanical property is good, long service life.
Partial properties index after table 1 Electronic Packaging plastic material is aging
Claims (10)
1. an Electronic Packaging plastic material, it is characterized in that: be prepared from weight portion by following component: bisphenol f type epoxy resin 40-60 part, polyethersulfone resin 20-30 part, glass fibre 5-10 part, ramee 2-5 part, dicyan diamino 2-5 part, Dichlorobenzene base Dimethylcarbamide 1-2 part, ethylene bis stearamide 1-2 part, butyl stearate 1-3 part, APTES 1-2 part, ��-mercaptopropyl trimethoxysilane 2-4 part, DMF 1-2 part, isophorone diamine 1-3 part, ethyl acetate 20-40 part, acetone 20-40 part.
2. a kind of Electronic Packaging plastic material according to claim 1, it is characterized in that: be prepared from weight portion by following component: bisphenol f type epoxy resin 45-55 part, polyethersulfone resin 22-28 part, glass fibre 6-9 part, ramee 3-4 part, dicyan diamino 3-4 part, Dichlorobenzene base Dimethylcarbamide 1.2-1.7 part, ethylene bis stearamide 1.2-1.8 part, butyl stearate 1.5-2.5 part, APTES 1.3-1.8 part, ��-mercaptopropyl trimethoxysilane 2.5-3.5 part, N, dinethylformamide 1.2-1.8 part, isophorone diamine 1.5-2.5 part, ethyl acetate 25-35 part, acetone 25-35 part.
3. the preparation method of a kind of Electronic Packaging plastic material described in any one of claim 1 to 2, it is characterised in that: comprise the following steps:
Step 1: APTES, ��-mercaptopropyl trimethoxysilane, ethyl acetate and acetone are mixed, stirs 20-40 minute under rotating speed 60-80r/min with magnetic stirrer;
Step 2: add glass fibre and ramee, stirs 20-50 minute at temperature 50-70 DEG C, stands 2-3 hour;
Step 3: filter, put in baking oven, dries at temperature 80-100 DEG C;
Step 4: mixed by remaining ingredient, heats to 90-120 DEG C of stirring;
Step 5: add above-mentioned process fiber, continues stirring 30-50 minute;
Step 6: put at temperature 80-90 DEG C in vacuum drying oven, dries 2-3 hour under vacuum-0.1MPa;
Step 7: pouring into compressing in mould and get final product, first heating-up temperature is to 110-120 DEG C, and the time is 1 hour, is warming up to 130-140 DEG C, is incubated 2 hours, is continuously heating to 150-160 DEG C, is incubated 1 hour.
4. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: described step 1 medium speed is 65-75r/min, and mixing time is 25-35 minute.
5. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 2, temperature is 55-65 DEG C, and mixing time is 30-40 minute, and time of repose is 2.5 hours.
6. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 3, temperature is 85-95 DEG C.
7. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 4, temperature is 100-110 DEG C.
8. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 5, mixing time is 35-45 minute.
9. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 6, temperature is 85 DEG C, and drying time is 2.5 hours.
10. the preparation method of a kind of Electronic Packaging plastic material according to claim 3, it is characterised in that: in described step 7, first time heating is to 115 DEG C, and second time heating is to 135 DEG C, and third time heating is to 155 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610222655.2A CN105647124A (en) | 2016-04-12 | 2016-04-12 | Electronic packaging plastic material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610222655.2A CN105647124A (en) | 2016-04-12 | 2016-04-12 | Electronic packaging plastic material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105647124A true CN105647124A (en) | 2016-06-08 |
Family
ID=56496227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610222655.2A Pending CN105647124A (en) | 2016-04-12 | 2016-04-12 | Electronic packaging plastic material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105647124A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130115442A1 (en) * | 2011-11-09 | 2013-05-09 | Cytec Technology Corp. | Structural adhesive and bonding application thereof |
| CN104045978A (en) * | 2014-06-24 | 2014-09-17 | 大连理工大学 | Polyarylether nitrile/epoxy resin copolymerized modified composition and preparation method and application thereof |
-
2016
- 2016-04-12 CN CN201610222655.2A patent/CN105647124A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130115442A1 (en) * | 2011-11-09 | 2013-05-09 | Cytec Technology Corp. | Structural adhesive and bonding application thereof |
| CN104045978A (en) * | 2014-06-24 | 2014-09-17 | 大连理工大学 | Polyarylether nitrile/epoxy resin copolymerized modified composition and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 孟玲宇等: ""玻纤/聚醚砜/环氧复合材料老化性能研究"", 《玻璃钢/复合材料》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104592667B (en) | A kind of high flowing, high-impact ASA materials and preparation method thereof | |
| JP2012056980A5 (en) | ||
| CN103146141A (en) | Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method | |
| CN104448395A (en) | Composite inorganic mineral powder filler and preparation method thereof | |
| CN107286585A (en) | It is a kind of for epoxy PUR of high modulus carbon fiber prepreg and preparation method thereof | |
| CN104559752B (en) | A kind of heat resistant type self-adhesive enameled wire paint and preparation method thereof | |
| CN103788660B (en) | A kind of glass fibre/epoxy resin hybrid modification silicone molding rubber and preparation method thereof | |
| CN105647124A (en) | Electronic packaging plastic material and preparation method thereof | |
| CN102690507A (en) | Glass fiber reinforced polylactic acid composite material | |
| CN104944977A (en) | Production method of flame-retardant fiber board | |
| CN103173015A (en) | High-strength PPS (polyphenylene sulfide) material and its preparation method | |
| CN109593070B (en) | Nitrile resin for high-frequency and high-speed copper-clad plate and preparation method thereof | |
| CN104927310A (en) | Epoxy resin composition and epoxy resin material obtained by curing | |
| CN103694937B (en) | Epoxy resin adhesive with fast curing speed and good mechanical properties | |
| CN105255361A (en) | Silicone impregnating varnish as well as preparation method and application thereof | |
| CN106380813B (en) | A kind of PC-ABS alloy and preparation method thereof for beating the rigidity-toughness balanced of screw hole | |
| CN103834179A (en) | Artificial cultured stone mould rubber and preparation method thereof | |
| CN104070765A (en) | Manufacture process of halogen-free CEM-3 copper-clad plate with low warping degree and high peel resistance | |
| CN106967297A (en) | High content short glass fiber enhancing polyphenyl thioether composite material and preparation method thereof | |
| CN104278523B (en) | Insulated paint and preparation method thereof, insulating varnished silk and preparation method thereof | |
| KR20080019030A (en) | Use of a particular composition for producing parts by filament winding | |
| CN105885350B (en) | Preparation method of fiber membrane/epoxy resin composite material with triple shape memory performance | |
| KR101351330B1 (en) | Thermosetting resin and its manufacturing method for prepreg | |
| CN104479290A (en) | Toughening type epoxy resin and preparation method thereof | |
| CN104974321A (en) | Methyletherified melamine resin and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |