CN106893540A - A kind of high-temperature Resistance Adhesives - Google Patents

A kind of high-temperature Resistance Adhesives Download PDF

Info

Publication number
CN106893540A
CN106893540A CN201510981392.9A CN201510981392A CN106893540A CN 106893540 A CN106893540 A CN 106893540A CN 201510981392 A CN201510981392 A CN 201510981392A CN 106893540 A CN106893540 A CN 106893540A
Authority
CN
China
Prior art keywords
parts
temperature
temperature resistance
resistance adhesives
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510981392.9A
Other languages
Chinese (zh)
Inventor
赵俊娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Genyuan Technology Development Co Ltd
Original Assignee
Tianjin Genyuan Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Genyuan Technology Development Co Ltd filed Critical Tianjin Genyuan Technology Development Co Ltd
Priority to CN201510981392.9A priority Critical patent/CN106893540A/en
Publication of CN106893540A publication Critical patent/CN106893540A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention provides a kind of high-temperature Resistance Adhesives, and the adhesive constitutes as follows by weight:Contain high-temperature-resistant epoxy resin 45-65 parts, anhydride curing agent 8-18 parts accelerator 2-3 parts, high-temperature stabilizer 4-9 parts, toughening rubber 15-20 parts, 3-8 parts of high temperature resistant auxiliary agent, filler surplus in every 100 parts.The present invention has the advantages and positive effects that:Due to using above-mentioned technical proposal, adhesive normal temperature cure, high-temperature resistant result is good, instead of the shortcoming that epoxy structural rubber is inconvenient to operate.

Description

A kind of high-temperature Resistance Adhesives
Technical field
The invention belongs to adhesive field, more particularly, to a kind of high-temperature Resistance Adhesives.
Background technology
In adhesives industry, with electronic component and electronic equipment to it is thin it is light it is small in terms of develop, for As envelope Zhuanghe's thermal interfacial material heat conduction adhesive especially the agent of heat conductive insulating gluing demand increasingly It is high.During loudspeaker makes, can also use to heat conductive insulating gluing agent.Epoxy adhesive master If being made up of epoxy resin and the major part of curing agent two.In order to improve some performances, different purposes are met The auxiliary materials such as toughener, diluent, the urgent, coupling agent in village can also be added.
The content of the invention
It is an object of the invention to provide a kind of simple structure, it is simple to operate, bond that degree is high, high temperature resistant effect The obvious high-temperature Resistance Adhesives of fruit.
The technical scheme is that:A kind of high-temperature Resistance Adhesives, the adhesive is constituted by weight, Contain in every 100 parts:
Further, the filler is calcium carbonate, silica, organobentonite, kaolin, oxygen Change aluminium, aluminium hydroxide, wollastonite in powder, talcum powder, activated magnesia, silicon powder, lithopone, ultra-fine The mixture of one or more in barium sulfate.
Further, the high-temperature stabilizer be antioxidant 264, antioxidant 1010, hydroquinones, to uncle The mixture of one or more in butyl-catechol, hydroquinone monomethyl ether, 1,4-benzoquinone.
Further, the high temperature resistant auxiliary agent be silane coupler, polyimides, span come polyimides, The mixture of one or more in ceramic powders, silicone grease.
The present invention has the advantages and positive effects that:Due to using above-mentioned technical proposal, adhesive normal temperature Solidification, high-temperature resistant result is good, instead of the shortcoming that epoxy structural rubber is inconvenient to operate.
Specific embodiment
The present invention is elaborated with reference to embodiment.
A kind of high-temperature Resistance Adhesives of the present invention, the adhesive is constituted, contained in every 100 parts by weight:
The filler is calcium carbonate, silica, organobentonite, kaolin, aluminum oxide, hydrogen-oxygen In change aluminium, wollastonite in powder, talcum powder, activated magnesia, silicon powder, lithopone, ultra-fine barium sulfate The mixture of one or more.
The high-temperature stabilizer is antioxidant 264, hydroquinones, p-tert-Butylcatechol, quinhydrones list The mixture of one or more in methyl ether, 1,4-benzoquinone.
The high temperature resistant auxiliary agent be silane coupler, polyimides, span come polyimides, ceramic powders, The mixture of one or more in silicone grease.
Embodiment 1
The course of work of this example:A kind of high-temperature Resistance Adhesives, the adhesive constitutes as follows by weight:
Embodiment 2
The course of work of this example:A kind of high-temperature Resistance Adhesives, the adhesive constitutes as follows by weight:
Embodiment 3
The course of work of this example:A kind of high-temperature Resistance Adhesives, the adhesive constitutes as follows by weight:
The filler is calcium carbonate, silica, organobentonite, kaolin, aluminum oxide, hydrogen-oxygen In change aluminium, wollastonite in powder, talcum powder, activated magnesia, silicon powder, lithopone, ultra-fine barium sulfate The mixture of one or more.
The high-temperature stabilizer is antioxidant 264, hydroquinones, p-tert-Butylcatechol, quinhydrones list The mixture of one or more in methyl ether, 1,4-benzoquinone.
The high temperature resistant auxiliary agent be silane coupler, polyimides, span come polyimides, ceramic powders, The mixture of one or more in silicone grease.
One embodiment of the present of invention has been described in detail above, but the content is only of the invention Preferred embodiment, it is impossible to be considered as limiting practical range of the invention.It is all according to the present patent application scope The impartial change made and improvement etc., all should still belong within patent covering scope of the invention.

Claims (4)

1. a kind of high-temperature Resistance Adhesives, the adhesive is constituted, contained in every 100 parts by weight:
2. high-temperature Resistance Adhesives according to claim 1, it is characterised in that:The filler is Calcium carbonate, silica, organobentonite, kaolin, aluminum oxide, aluminium hydroxide, wollastonite in powder, The mixing of one or more in talcum powder, activated magnesia, silicon powder, lithopone, ultra-fine barium sulfate Thing.
3. high-temperature Resistance Adhesives according to claim 1, it is characterised in that:The high-temperature stable Agent is in antioxidant 264, hydroquinones, p-tert-Butylcatechol, hydroquinone monomethyl ether, 1,4-benzoquinone The mixture of one or more.
4. high-temperature Resistance Adhesives according to claim 1, it is characterised in that:The high temperature resistant is helped Agent be one kind that silane coupler, polyimides, span come in polyimides, ceramic powders, silicone grease or Several mixtures.
CN201510981392.9A 2015-12-17 2015-12-17 A kind of high-temperature Resistance Adhesives Pending CN106893540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510981392.9A CN106893540A (en) 2015-12-17 2015-12-17 A kind of high-temperature Resistance Adhesives

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510981392.9A CN106893540A (en) 2015-12-17 2015-12-17 A kind of high-temperature Resistance Adhesives

Publications (1)

Publication Number Publication Date
CN106893540A true CN106893540A (en) 2017-06-27

Family

ID=59190832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510981392.9A Pending CN106893540A (en) 2015-12-17 2015-12-17 A kind of high-temperature Resistance Adhesives

Country Status (1)

Country Link
CN (1) CN106893540A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107880828A (en) * 2017-11-21 2018-04-06 苏州赛伍应用技术股份有限公司 A kind of Microspeaker vibrating diaphragm top dome bonding glued membrane and top dome module
CN108329891A (en) * 2018-01-25 2018-07-27 合肥中科富华新材料有限公司 A kind of waterproof roll adhesive and preparation method thereof
CN109251708A (en) * 2017-07-14 2019-01-22 李跃龙 A kind of energy-saving and environment-friendly viscose glue
CN110117475A (en) * 2019-06-04 2019-08-13 扬州四菱电子有限公司 A kind of rotary module epoxy potting compound and the preparation method and application thereof method
CN112625633A (en) * 2020-12-11 2021-04-09 固德电材系统(苏州)股份有限公司 Weather-resistant epoxy resin adhesive for wind power blade and preparation method and application thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109251708A (en) * 2017-07-14 2019-01-22 李跃龙 A kind of energy-saving and environment-friendly viscose glue
CN109251708B (en) * 2017-07-14 2021-04-02 深圳市宏进科技有限公司 Energy-saving and environment-friendly adhesive
CN107880828A (en) * 2017-11-21 2018-04-06 苏州赛伍应用技术股份有限公司 A kind of Microspeaker vibrating diaphragm top dome bonding glued membrane and top dome module
CN108329891A (en) * 2018-01-25 2018-07-27 合肥中科富华新材料有限公司 A kind of waterproof roll adhesive and preparation method thereof
CN110117475A (en) * 2019-06-04 2019-08-13 扬州四菱电子有限公司 A kind of rotary module epoxy potting compound and the preparation method and application thereof method
CN112625633A (en) * 2020-12-11 2021-04-09 固德电材系统(苏州)股份有限公司 Weather-resistant epoxy resin adhesive for wind power blade and preparation method and application thereof

Similar Documents

Publication Publication Date Title
CN106893540A (en) A kind of high-temperature Resistance Adhesives
WO2014199650A1 (en) Thermosetting resin composition, method for producing thermally conductive sheet, and power module
IN2014CN03459A (en)
CN102719210A (en) Insulating heat-conducting adhesive for ultralow temperature
CN102391818A (en) Insulated thermal conductive adhesive and preparation method thereof
CN107227133A (en) Heat-conducting insulating adhesive for high-voltage electrical appliance and preparation method thereof
CN105419672A (en) Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED
CN104559819A (en) High-performance nano carbon cooling composite material
CN110776819A (en) Graphene heat dissipation coating for electronic and electric appliances
CN103409115A (en) Enhanced heat conducting interface material and preparation method thereof
CN107097508A (en) A kind of high heat-resisting, highly heat-conductive copper-clad plate preparation method
CN106634763A (en) High-heat-conductivity electric-insulation adhesive material and preparation method thereof
JP5597498B2 (en) Epoxy resin composition, circuit board, and light emitting device
CN106634812A (en) Organic silicon resin pouring sealant with high thermal conductivity and low viscosity for PCB (Printed Circuit Board)
CN108048011A (en) A kind of heat dissipation mica tape
CN103468194B (en) Patch inductor packaging single-component glue and preparation method thereof
CN106189974A (en) A kind of preparation technology of the good conducting resinl of LED caking property
CN103304961B (en) High heat conduction semicure film of composite copper-clad plate and preparation method thereof
CN106609117A (en) Preparation method for two-component epoxy electronic pouring sealant
CN102368390B (en) Low temperature solidification conduction slurry and preparation method thereof
CN106916556A (en) A kind of loudspeaker assembling high-temperature Resistance Adhesives
CN108911610A (en) A kind of homogeneous insulation board of high-strength damp-proof
CN106496946A (en) A kind of preparation of heat conduction epoxy material
CN105925053A (en) Conductive pressure-sensitive adhesive ink
CN101805576B (en) Epoxy-resin single-component soft adhesive

Legal Events

Date Code Title Description
DD01 Delivery of document by public notice

Addressee: Xin Fenglian

Document name: Notification of Acceptance of Patent Application

PB01 Publication
PB01 Publication
DD01 Delivery of document by public notice
DD01 Delivery of document by public notice

Addressee: TIANJIN GENYUAN TECHNOLOGY DEVELOPMENT CO., LTD.

Document name: Notification of before Expiration of Request of Examination as to Substance

WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170627