CN105925053A - Conductive pressure-sensitive adhesive ink - Google Patents
Conductive pressure-sensitive adhesive ink Download PDFInfo
- Publication number
- CN105925053A CN105925053A CN201610130257.8A CN201610130257A CN105925053A CN 105925053 A CN105925053 A CN 105925053A CN 201610130257 A CN201610130257 A CN 201610130257A CN 105925053 A CN105925053 A CN 105925053A
- Authority
- CN
- China
- Prior art keywords
- sensitive adhesive
- gas phase
- phase nano
- heat conduction
- adhesive sticker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a conductive pressure-sensitive adhesive ink, which is characterized by comprising the following raw materials by weight: 20%-30% of ethyl acetate, 30-40% of methylacrylate, 10-15% of epoxy resin, 8-12%of gas phase nano aluminum oxide, 5-9% of fumed nano silica and 3-8% of graphene oxide. The conductive pressure-sensitive adhesive ink has the advantages of excellent thermal conductivity, high temperature resistance, no bubble reaction, strong cohesion, excellent flame retardancy, no production of harmful substances that pollute the environment and human health under heating, high viscosity and good insulation.
Description
Technical field
The present invention relates to a kind of ink, particularly relate to a kind of heat conduction pressure-sensitive adhesive sticker ink.
Background technology
Heat conduction pressure-sensitive adhesive sticker ink is widely used in electronic product, at present, due to the pressure-sensitive adhesive sticker ink heat conductivity of heat conduction on the market and poor insulativity, heat produces harmful substance and pollutes environment and health, the heat that the upgrading of mobile phone plane plate computer system, the main frame of desktop computer and intelligent instrumentation produce cannot obtain good eliminating, can not meet people's needs.
Summary of the invention
It is an object of the invention to provide a kind of heat conduction pressure-sensitive adhesive sticker ink, its excellent heat conductivity, high temperature resistant and bubble-free reaction, cohesiveness is strong, excellent in flame retardance, and heat will not produce harmful substance and pollute environment and health, the advantages such as viscosity is high, good insulating.
The technical solution adopted for the present invention to solve the technical problems is: a kind of heat conduction pressure-sensitive adhesive sticker ink, it is characterized in that, raw material is respectively as follows: ethyl acetate 20-30%, methyl acrylate 30-40%, epoxy resin 10-15%, gas phase nano alchlor 8-12%, gas phase nano silicon dioxide 5-9%, graphene oxide 3-8% by weight percentage.
As preferably, the raw material of heat conduction pressure-sensitive adhesive sticker ink is respectively as follows: ethyl acetate 27%, methyl acrylate 36%, epoxy resin 13%, gas phase nano alchlor 10%, gas phase nano silicon dioxide 8%, graphene oxide 6% by weight percentage.
Preferably, described heat conduction pressure-sensitive adhesive sticker ink is applied to the cooling system of far infrared physical therapy product.
The invention has the beneficial effects as follows: by ethyl acetate, propylene fat acetic acid, epoxy resin is carrier, adds gas phase nano alchlor, gas phase nano silicon dioxide and graphene oxide, it is prepared as heat conduction pressure-sensitive adhesive sticker ink, possessing excellent heat conductivity, high temperature resistant and bubble-free reaction, cohesiveness is strong, excellent in flame retardance, heat will not produce harmful substance and pollute environment and health, the advantages such as viscosity is high, good insulating.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further illustrated.Should be appreciated that embodiment described herein is used only for explaining the present invention, be not intended to limit the present invention.
Embodiment 1
A kind of heat conduction pressure-sensitive adhesive sticker ink, its raw material is respectively as follows: ethyl acetate 30%, methyl acrylate 40%, epoxy resin 10%, gas phase nano alchlor 8%, gas phase nano silicon dioxide 5%, graphene oxide 7% by weight percentage.
Embodiment 2
A kind of heat conduction pressure-sensitive adhesive sticker ink, its raw material is respectively as follows: ethyl acetate 25%, methyl acrylate 35%, epoxy resin 14%, gas phase nano alchlor 11%, gas phase nano silicon dioxide 7%, graphene oxide 8% by weight percentage.
Embodiment 3
A kind of heat conduction pressure-sensitive adhesive sticker ink, its raw material is respectively as follows: ethyl acetate 27%, methyl acrylate 36%, epoxy resin 13%, gas phase nano alchlor 10%, gas phase nano silicon dioxide 8%, graphene oxide 6% by weight percentage.
Embodiment 4
A kind of heat conduction pressure-sensitive adhesive sticker ink, its raw material is respectively as follows: ethyl acetate 29%, methyl acrylate 39%, epoxy resin 12%, gas phase nano alchlor 9%, gas phase nano silicon dioxide 6%, graphene oxide 5% by weight percentage.
Embodiment 5
A kind of heat conduction pressure-sensitive adhesive sticker ink, its raw material is respectively as follows: ethyl acetate 28%, methyl acrylate 38%, epoxy resin 11%, gas phase nano alchlor 10%, gas phase nano silicon dioxide 9%, graphene oxide 4% by weight percentage.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equal replacement and improvement etc. made within the spirit and principles in the present invention, all should fall within the scope and spirit of the invention.
Claims (3)
1. a heat conduction pressure-sensitive adhesive sticker ink, it is characterized in that, raw material is respectively as follows: ethyl acetate 20-30%, methyl acrylate 30-40%, epoxy resin 10-15%, gas phase nano alchlor 8-12%, gas phase nano silicon dioxide 5-9%, graphene oxide 3-8% by weight percentage.
Heat conduction the most according to claim 1 pressure-sensitive adhesive sticker ink, it is characterized in that, raw material is respectively as follows: ethyl acetate 27%, methyl acrylate 36%, epoxy resin 13%, gas phase nano alchlor 10%, gas phase nano silicon dioxide 8%, graphene oxide 6% by weight percentage.
Heat conduction the most according to claim 1 and 2 pressure-sensitive adhesive sticker ink, it is characterised in that: described heat conduction pressure-sensitive adhesive sticker ink is applied to the cooling system of far infrared physical therapy product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610130257.8A CN105925053A (en) | 2016-03-09 | 2016-03-09 | Conductive pressure-sensitive adhesive ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610130257.8A CN105925053A (en) | 2016-03-09 | 2016-03-09 | Conductive pressure-sensitive adhesive ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105925053A true CN105925053A (en) | 2016-09-07 |
Family
ID=56840121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610130257.8A Pending CN105925053A (en) | 2016-03-09 | 2016-03-09 | Conductive pressure-sensitive adhesive ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105925053A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107489074A (en) * | 2017-07-31 | 2017-12-19 | 苏州飘志华复合材料科技有限公司 | A kind of weather-proof self-adhesive paper of high adhesion |
| WO2019033841A1 (en) * | 2017-08-14 | 2019-02-21 | 苏州格优碳素新材料有限公司 | Heat conduction adhesive sticker, heat conduction film and preparation method therefor and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433098A (en) * | 2011-09-19 | 2012-05-02 | 常州合润新材料科技有限公司 | Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method |
| US20130193976A1 (en) * | 2012-01-26 | 2013-08-01 | Sancoa International Company, L.P. | Label with on-battery voltage indicator |
| CN104212241A (en) * | 2014-09-01 | 2014-12-17 | 江苏格美高科技发展有限公司 | High-thermal-conductivity polymer conductive ink and production process thereof |
-
2016
- 2016-03-09 CN CN201610130257.8A patent/CN105925053A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433098A (en) * | 2011-09-19 | 2012-05-02 | 常州合润新材料科技有限公司 | Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method |
| US20130193976A1 (en) * | 2012-01-26 | 2013-08-01 | Sancoa International Company, L.P. | Label with on-battery voltage indicator |
| CN104212241A (en) * | 2014-09-01 | 2014-12-17 | 江苏格美高科技发展有限公司 | High-thermal-conductivity polymer conductive ink and production process thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107489074A (en) * | 2017-07-31 | 2017-12-19 | 苏州飘志华复合材料科技有限公司 | A kind of weather-proof self-adhesive paper of high adhesion |
| WO2019033841A1 (en) * | 2017-08-14 | 2019-02-21 | 苏州格优碳素新材料有限公司 | Heat conduction adhesive sticker, heat conduction film and preparation method therefor and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160907 |
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| WD01 | Invention patent application deemed withdrawn after publication |