IN2012DN00528A - - Google Patents

Download PDF

Info

Publication number
IN2012DN00528A
IN2012DN00528A IN528DEN2012A IN2012DN00528A IN 2012DN00528 A IN2012DN00528 A IN 2012DN00528A IN 528DEN2012 A IN528DEN2012 A IN 528DEN2012A IN 2012DN00528 A IN2012DN00528 A IN 2012DN00528A
Authority
IN
India
Prior art keywords
substrate
nickel layer
producing
layer
subjecting
Prior art date
Application number
Other languages
English (en)
Inventor
Ota Hajime
Konishi Masaya
Yamaguchi Takashi
Original Assignee
Sumitomo Electric Industries
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Toyo Kohan Co Ltd filed Critical Sumitomo Electric Industries
Publication of IN2012DN00528A publication Critical patent/IN2012DN00528A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06Films or wires on bases or cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • H10N60/0632Intermediate layers, e.g. for growth control
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
IN528DEN2012 2009-07-10 2010-10-07 IN2012DN00528A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009163513A JP5096422B2 (ja) 2009-07-10 2009-07-10 基板および超電導線材の製造方法
PCT/JP2010/060102 WO2011004684A1 (ja) 2009-07-10 2010-06-15 基板および超電導線材の製造方法

Publications (1)

Publication Number Publication Date
IN2012DN00528A true IN2012DN00528A (https=) 2015-08-21

Family

ID=43429108

Family Applications (1)

Application Number Title Priority Date Filing Date
IN528DEN2012 IN2012DN00528A (https=) 2009-07-10 2010-10-07

Country Status (7)

Country Link
US (1) US9306147B2 (https=)
EP (1) EP2453446A4 (https=)
JP (1) JP5096422B2 (https=)
KR (1) KR101685732B1 (https=)
CN (1) CN102473488B (https=)
IN (1) IN2012DN00528A (https=)
WO (1) WO2011004684A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132128A1 (ja) * 2011-03-28 2012-10-04 株式会社村田製作所 検出デバイスおよびその製造方法、センサ電極、ならびに、空隙配置構造体およびそれを用いた検出方法
JP2013089354A (ja) * 2011-10-14 2013-05-13 Sumitomo Electric Ind Ltd 超電導薄膜線材用の中間層付基材とその製造方法、および超電導薄膜線材
WO2015033808A1 (ja) 2013-09-04 2015-03-12 東洋鋼鈑株式会社 酸化物層の成膜方法、並びにエピタキシャル成長用積層基材及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1325001A (en) 1999-07-23 2001-02-13 American Superconductor Corporation Methods of making a superconductor
KR100352976B1 (ko) * 1999-12-24 2002-09-18 한국기계연구원 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및 그 제조방법
GB0010494D0 (en) * 2000-04-28 2000-06-14 Isis Innovation Textured metal article
US6500568B1 (en) * 2001-06-06 2002-12-31 3M Innovative Properties Company Biaxially textured metal substrate with palladium layer
EP1419538B1 (en) 2001-07-31 2007-03-07 American Superconductor Corporation Methods and reactors for forming superconductor layers
JP2005001935A (ja) 2003-06-11 2005-01-06 Sumitomo Electric Ind Ltd 酸化物薄膜の製造方法
US7816303B2 (en) 2004-10-01 2010-10-19 American Superconductor Corporation Architecture for high temperature superconductor wire
JP5123462B2 (ja) * 2004-10-27 2013-01-23 住友電気工業株式会社 膜形成用配向基板および超電導線材ならびに膜形成用配向基板の製造方法
CN101512829B (zh) 2005-07-29 2013-10-30 美国超导公司 高温超导导线和线圈
JP5156188B2 (ja) 2005-12-14 2013-03-06 公益財団法人国際超電導産業技術研究センター 厚膜テープ状re系(123)超電導体の製造方法
US7674751B2 (en) * 2006-01-10 2010-03-09 American Superconductor Corporation Fabrication of sealed high temperature superconductor wires
JP4602911B2 (ja) * 2006-01-13 2010-12-22 財団法人国際超電導産業技術研究センター 希土類系テープ状酸化物超電導体
JP5074083B2 (ja) 2007-04-17 2012-11-14 中部電力株式会社 エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法
JP5324763B2 (ja) * 2007-08-21 2013-10-23 中部電力株式会社 エピタキシャル膜形成用配向基板及びエピタキシャル膜形成用配向基板の表面改質方法
JP5400416B2 (ja) * 2009-02-20 2014-01-29 中部電力株式会社 超電導線材

Also Published As

Publication number Publication date
JP2011018598A (ja) 2011-01-27
KR20120051010A (ko) 2012-05-21
CN102473488B (zh) 2015-05-06
JP5096422B2 (ja) 2012-12-12
US9306147B2 (en) 2016-04-05
KR101685732B1 (ko) 2016-12-12
EP2453446A4 (en) 2015-04-22
US20120108439A1 (en) 2012-05-03
EP2453446A1 (en) 2012-05-16
CN102473488A (zh) 2012-05-23
WO2011004684A1 (ja) 2011-01-13

Similar Documents

Publication Publication Date Title
WO2010104274A3 (en) Lead frame and method for manufacturing the same
EP2306501A3 (en) Ceramic wiring board and method of manufacturing thereof
EP2515392A3 (en) Process of fabricating a slip ring component
MX367729B (es) Boton o miembro sujetador de aluminio o de aleacion de aluminio electrochapado con cobre y metodo para la produccion del mismo.
WO2008084524A1 (ja) 半導体装置の製造方法、および半導体装置の製造装置
TW200702494A (en) Surface treatment method for copper and copper
TW200746199A (en) Laminated electronic component and method for manufacturing the same
EP2357656A4 (en) METHOD OF PRODUCING METAL LAMINATED SUBSTRATE FOR AN OXID SUPER WIRE WIRE AND THE SUBSTRATE USING OXIDE SUPER WIRE WIRE
TW200726336A (en) Ceramic substrate, electronic device, and manufacturing method of ceramic substrate
GB2486116A (en) Activation of graphene buffer layers on silicon carbide
JP2013187313A5 (https=)
EP2684983A3 (en) Improved method of metal plating semiconductors
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
EP2626891A3 (en) Activation process to improve metal adhesion
IN2012DN00528A (https=)
WO2012082956A3 (en) Methods for metal plating and related devices
SG132658A1 (en) Leadframe comprising tin plating or an intermetallic layer formed therefrom
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
JP2013140982A5 (https=)
GB2500811A (en) Electrolytic gold or gold palladium surface finish application in coreless substrate processing
WO2012096456A3 (ko) 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법
IN2012DN00532A (https=)
SG171520A1 (en) Semiconductor device and method of forming an inductor on polymer matrix composite substrate
SG148086A1 (en) Electrical contact device and its manufacturing process
WO2010098624A3 (ko) 요철부가 형성된 기판 및 이를 이용한 태양전지의 제조방법