IN2004CH02744A - - Google Patents
Info
- Publication number
- IN2004CH02744A IN2004CH02744A IN2744CH2004A IN2004CH02744A IN 2004CH02744 A IN2004CH02744 A IN 2004CH02744A IN 2744CH2004 A IN2744CH2004 A IN 2744CH2004A IN 2004CH02744 A IN2004CH02744 A IN 2004CH02744A
- Authority
- IN
- India
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38680002P | 2002-06-07 | 2002-06-07 | |
| US40168802P | 2002-08-07 | 2002-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2004CH02744A true IN2004CH02744A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2006-02-10 |
Family
ID=29739917
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2744CH2004 IN2004CH02744A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2002-06-07 | 2004-12-06 | |
| IN2762CH2004 IN2004CH02762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2002-06-07 | 2004-12-07 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2762CH2004 IN2004CH02762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2002-06-07 | 2004-12-07 |
Country Status (17)
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7208049B2 (en) * | 2003-10-20 | 2007-04-24 | Air Products And Chemicals, Inc. | Process solutions containing surfactants used as post-chemical mechanical planarization treatment |
| BRPI0418529A (pt) * | 2004-02-11 | 2007-05-15 | Mallinckrodt Baker Inc | composições de limpeza para microeletrÈnicos contendo ácidos de halogênio oxigenados, sais e derivados dos mesmos |
| US8338087B2 (en) * | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
| US7867779B2 (en) | 2005-02-03 | 2011-01-11 | Air Products And Chemicals, Inc. | System and method comprising same for measurement and/or analysis of particles in gas stream |
| US7923424B2 (en) * | 2005-02-14 | 2011-04-12 | Advanced Process Technologies, Llc | Semiconductor cleaning using superacids |
| SG161211A1 (en) * | 2005-04-04 | 2010-05-27 | Mallinckrodt Baker Inc | Compositions for cleaning ion implanted photoresist in front end of line applications |
| WO2006133253A1 (en) | 2005-06-07 | 2006-12-14 | Advanced Technology Materials, Inc. | Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition |
| KR101152139B1 (ko) | 2005-12-06 | 2012-06-15 | 삼성전자주식회사 | 표시 장치용 세정제 및 이를 사용하는 박막 트랜지스터표시판의 제조 방법 |
| CN101331811B (zh) * | 2005-12-20 | 2010-09-08 | 三菱瓦斯化学株式会社 | 用于除去配线基板的残渣的组合物以及洗涤方法 |
| US20080149884A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
| WO2008080097A2 (en) * | 2006-12-21 | 2008-07-03 | Advanced Technology Materials, Inc. | Liquid cleaner for the removal of post-etch residues |
| US8110508B2 (en) | 2007-11-22 | 2012-02-07 | Samsung Electronics Co., Ltd. | Method of forming a bump structure using an etching composition for an under bump metallurgy layer |
| CN101487993A (zh) * | 2008-01-18 | 2009-07-22 | 安集微电子（上海）有限公司 | 一种厚膜光刻胶清洗剂 |
| JP5512554B2 (ja) * | 2008-02-29 | 2014-06-04 | アバントール パフォーマンス マテリアルズ， インコーポレイテッド | マイクロエレクトロニクス基板洗浄用組成物 |
| JP2009231354A (ja) * | 2008-03-19 | 2009-10-08 | Fujifilm Corp | 半導体デバイス用洗浄液、および洗浄方法 |
| CN101359189B (zh) * | 2008-09-17 | 2011-04-27 | 电子科技大学 | 正性光敏聚酰亚胺光刻胶用显影液 |
| SG172973A1 (en) * | 2009-01-14 | 2011-08-29 | Avantor Performance Materials B V | Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level |
| EP2401352B1 (en) * | 2009-02-25 | 2013-06-12 | Avantor Performance Materials, Inc. | Stripping compositions for cleaning ion implanted photoresist from semiconductor device wafers |
| MY152051A (en) * | 2009-02-25 | 2014-08-15 | Avantor Performance Mat Inc | Multipurpose acidic, organic solvent based microelectronic cleaning composition |
| US8754021B2 (en) | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
| CN101901784B (zh) * | 2010-07-21 | 2012-05-30 | 河北工业大学 | 钽化学机械抛光工序中的表面清洗方法 |
| CN101901782B (zh) * | 2010-07-21 | 2011-12-14 | 河北工业大学 | 极大规模集成电路多层布线碱性抛光后防氧化方法 |
| KR101914817B1 (ko) * | 2011-10-21 | 2018-12-28 | 엔테그리스, 아이엔씨. | 비-아민 cmp-후 조성물 및 사용 방법 |
| CN103809394B (zh) * | 2012-11-12 | 2019-12-31 | 安集微电子科技（上海）股份有限公司 | 一种去除光阻蚀刻残留物的清洗液 |
| US9460934B2 (en) | 2013-03-15 | 2016-10-04 | Globalfoundries Inc. | Wet strip process for an antireflective coating layer |
| SG11201603122XA (en) | 2013-10-21 | 2016-05-30 | Fujifilm Electronic Materials | Cleaning formulations for removing residues on surfaces |
| JP2015108041A (ja) * | 2013-12-03 | 2015-06-11 | ダイキン工業株式会社 | 洗浄用組成物 |
| US9562211B2 (en) | 2013-12-06 | 2017-02-07 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| EP3093875A4 (en) | 2014-04-10 | 2017-03-08 | Mitsubishi Gas Chemical Company, Inc. | Liquid composition for semiconductor element cleaning and method for cleaning semiconductor element |
| US9570285B2 (en) * | 2015-04-17 | 2017-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cleaning composition and methods thereof |
| TWI705132B (zh) | 2015-10-08 | 2020-09-21 | 日商三菱瓦斯化學股份有限公司 | 半導體元件之洗淨用液體組成物、半導體元件之洗淨方法及半導體元件之製造方法 |
| TWI816635B (zh) | 2015-10-15 | 2023-10-01 | 日商三菱瓦斯化學股份有限公司 | 半導體元件之洗淨用液體組成物、半導體元件之洗淨方法及半導體元件之製造方法 |
| US10988718B2 (en) | 2016-03-09 | 2021-04-27 | Entegris, Inc. | Tungsten post-CMP cleaning composition |
| CN107313055A (zh) * | 2017-07-19 | 2017-11-03 | 马爱连 | 一种金属油污清洗剂及其制备方法和使用方法 |
| JP6458913B1 (ja) * | 2018-03-26 | 2019-01-30 | 三菱瓦斯化学株式会社 | エッチング液 |
| JP7311229B2 (ja) | 2018-03-28 | 2023-07-19 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 洗浄用組成物 |
| JPWO2022163350A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2021-01-29 | 2022-08-04 | ||
| JP2024060243A (ja) * | 2022-10-19 | 2024-05-02 | Jsr株式会社 | 半導体処理用組成物及び処理方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673099A (en) * | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| US4744834A (en) * | 1986-04-30 | 1988-05-17 | Noor Haq | Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide |
| US5037724A (en) | 1988-02-25 | 1991-08-06 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin |
| US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| US5308745A (en) | 1992-11-06 | 1994-05-03 | J. T. Baker Inc. | Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins |
| US5561105A (en) * | 1995-05-08 | 1996-10-01 | Ocg Microelectronic Materials, Inc. | Chelating reagent containing photoresist stripper composition |
| JPH1055993A (ja) * | 1996-08-09 | 1998-02-24 | Hitachi Ltd | 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法 |
| JPH1116882A (ja) * | 1997-06-19 | 1999-01-22 | Toray Fine Chem Co Ltd | フォトレジスト剥離用組成物 |
| JPH1167632A (ja) * | 1997-08-18 | 1999-03-09 | Mitsubishi Gas Chem Co Inc | 半導体装置用洗浄剤 |
| JPH11323394A (ja) * | 1998-05-14 | 1999-11-26 | Texas Instr Japan Ltd | 半導体素子製造用洗浄剤及びそれを用いた半導体素子の製造方法 |
| JP3606738B2 (ja) * | 1998-06-05 | 2005-01-05 | 東京応化工業株式会社 | アッシング後の処理液およびこれを用いた処理方法 |
| JP4224652B2 (ja) * | 1999-03-08 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離液およびそれを用いたレジストの剥離方法 |
| US6531436B1 (en) * | 2000-02-25 | 2003-03-11 | Shipley Company, L.L.C. | Polymer removal |
| US6475966B1 (en) * | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
| MY129673A (en) * | 2000-03-20 | 2007-04-30 | Avantor Performance Mat Inc | Method and composition for removing sodium-containing material from microcircuit substrates |
| US6274296B1 (en) * | 2000-06-08 | 2001-08-14 | Shipley Company, L.L.C. | Stripper pretreatment |
| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US6599370B2 (en) | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| US6773873B2 (en) * | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
-
2003
- 2003-05-27 CA CA002488737A patent/CA2488737A1/en not_active Abandoned
- 2003-05-27 TW TW092114287A patent/TWI330766B/zh not_active IP Right Cessation
- 2003-05-27 PL PL374021A patent/PL207297B1/pl not_active IP Right Cessation
- 2003-05-27 CN CN038130262A patent/CN1659480A/zh active Pending
- 2003-05-27 BR BR0311830-4A patent/BR0311830A/pt not_active IP Right Cessation
- 2003-05-27 CN CN2011100761494A patent/CN102135735A/zh active Pending
- 2003-05-27 US US10/515,372 patent/US8906838B2/en active Active
- 2003-05-27 WO PCT/US2003/016829 patent/WO2003104901A2/en active Application Filing
- 2003-05-27 KR KR1020047019579A patent/KR100958068B1/ko not_active Expired - Lifetime
- 2003-05-27 JP JP2004511911A patent/JP4330529B2/ja not_active Expired - Fee Related
- 2003-05-27 RS YUP-1061/04A patent/RS106104A/sr unknown
- 2003-05-27 EP EP03731423A patent/EP1512050A2/en not_active Withdrawn
- 2003-05-27 AU AU2003240827A patent/AU2003240827A1/en not_active Abandoned
- 2003-06-06 MY MYPI20032124A patent/MY142745A/en unknown
-
2004
- 2004-11-29 ZA ZA200409622A patent/ZA200409622B/xx unknown
- 2004-12-06 IL IL165581A patent/IL165581A/en active IP Right Grant
- 2004-12-06 IN IN2744CH2004 patent/IN2004CH02744A/en unknown
- 2004-12-07 IN IN2762CH2004 patent/IN2004CH02762A/en unknown
-
2005
- 2005-01-06 NO NO20050075A patent/NO20050075L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| RS106104A (en) | 2007-04-10 |
| CA2488737A1 (en) | 2003-12-18 |
| CN102135735A (zh) | 2011-07-27 |
| US20050176602A1 (en) | 2005-08-11 |
| US8906838B2 (en) | 2014-12-09 |
| WO2003104901A2 (en) | 2003-12-18 |
| ZA200409622B (en) | 2006-05-31 |
| BR0311830A (pt) | 2005-03-29 |
| PL207297B1 (pl) | 2010-11-30 |
| IL165581A0 (en) | 2006-01-15 |
| KR100958068B1 (ko) | 2010-05-14 |
| AU2003240827A8 (en) | 2003-12-22 |
| IL165581A (en) | 2009-06-15 |
| WO2003104901A3 (en) | 2004-03-18 |
| NO20050075L (no) | 2005-01-06 |
| PL374021A1 (en) | 2005-09-19 |
| TWI330766B (en) | 2010-09-21 |
| TW200401958A (en) | 2004-02-01 |
| AU2003240827A1 (en) | 2003-12-22 |
| IN2004CH02762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2006-02-10 |
| MY142745A (en) | 2010-12-31 |
| EP1512050A2 (en) | 2005-03-09 |
| CN1659480A (zh) | 2005-08-24 |
| KR20050012770A (ko) | 2005-02-02 |
| JP2005529363A (ja) | 2005-09-29 |
| JP4330529B2 (ja) | 2009-09-16 |