IL98645A - Alkaline solution for engraving - Google Patents
Alkaline solution for engravingInfo
- Publication number
- IL98645A IL98645A IL9864591A IL9864591A IL98645A IL 98645 A IL98645 A IL 98645A IL 9864591 A IL9864591 A IL 9864591A IL 9864591 A IL9864591 A IL 9864591A IL 98645 A IL98645 A IL 98645A
- Authority
- IL
- Israel
- Prior art keywords
- etching
- copper
- etching solution
- vanadium
- ammonia
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 71
- 239000010949 copper Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 18
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 10
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 7
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims abstract description 5
- 235000011130 ammonium sulphate Nutrition 0.000 claims abstract description 5
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 150000003682 vanadium compounds Chemical class 0.000 claims abstract description 4
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims abstract 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 2
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims description 2
- 150000003016 phosphoric acids Chemical class 0.000 claims 2
- QKSIFUGZHOUETI-UHFFFAOYSA-N copper;azane Chemical compound N.N.N.N.[Cu+2] QKSIFUGZHOUETI-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- BIGPRXCJEDHCLP-UHFFFAOYSA-N ammonium bisulfate Chemical compound [NH4+].OS([O-])(=O)=O BIGPRXCJEDHCLP-UHFFFAOYSA-N 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010405 reoxidation reaction Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- -1 S04 ions Chemical class 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UNTBPXHCXVWYOI-UHFFFAOYSA-O azanium;oxido(dioxo)vanadium Chemical compound [NH4+].[O-][V](=O)=O UNTBPXHCXVWYOI-UHFFFAOYSA-O 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001784 detoxification Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- 150000003681 vanadium Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
- Printing Plates And Materials Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Gyroscopes (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0143390A AT395177B (de) | 1990-07-05 | 1990-07-05 | Aetzloesung |
| US07/562,745 US6129858A (en) | 1990-07-05 | 1990-08-06 | Etching solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL98645A0 IL98645A0 (en) | 1992-07-15 |
| IL98645A true IL98645A (en) | 1994-11-11 |
Family
ID=25595841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL9864591A IL98645A (en) | 1990-07-05 | 1991-06-27 | Alkaline solution for engraving |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US6129858A (cs) |
| EP (1) | EP0491020B1 (cs) |
| AT (2) | AT395177B (cs) |
| CA (1) | CA2069933C (cs) |
| CZ (1) | CZ281606B6 (cs) |
| DE (1) | DE59100461D1 (cs) |
| DK (1) | DK0491020T3 (cs) |
| ES (1) | ES2046055T3 (cs) |
| HK (1) | HK115195A (cs) |
| HU (1) | HU210320B (cs) |
| IL (1) | IL98645A (cs) |
| LT (1) | LTIP1580A (cs) |
| RU (1) | RU2078850C1 (cs) |
| SK (1) | SK281643B6 (cs) |
| WO (1) | WO1992001086A1 (cs) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59406698D1 (de) * | 1993-06-16 | 1998-09-17 | Lignozym Gmbh | Verfahren zur veränderung, abbau oder bleichen von lignin, ligninhaltigen materialien oder kohle |
| DE4339320A1 (de) * | 1993-11-18 | 1995-05-24 | Elochem Aetztechnik Gmbh | Verfahren zum beschleunigten Ätzen und Abscheiden von Metallen in ammoniakalischen Ätzanlagen |
| DE102004030924A1 (de) * | 2004-06-25 | 2006-01-19 | Elo-Chem-Csm Gmbh | Elektrolytisch regenerierbare Ätzlösung |
| DE102006036888A1 (de) * | 2005-11-10 | 2007-05-16 | Eve Recycling Sarl | Regenerierbare Ätzlösung |
| CN102154646A (zh) * | 2011-03-04 | 2011-08-17 | 侯延辉 | 一种不产生氯气的酸性蚀刻液及其催化剂 |
| CN114752940B (zh) * | 2022-04-21 | 2024-02-06 | 盛隆资源再生（无锡）有限公司 | 一种碱性含铜蚀刻废液的回收方法 |
| CN120476227A (zh) * | 2022-11-30 | 2025-08-12 | 叶涛 | 一种线路板氨碱性硫酸四氨合铜蚀刻工艺及其装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1294804A (en) * | 1970-07-24 | 1972-11-01 | Shipley Co | Etchant for cupreous metals |
| DE2625869A1 (de) * | 1976-06-09 | 1977-12-22 | Siemens Ag | Waessrige ammoniakalische aetzloesung zum aetzen von kupfer und kupferlegierungen |
| JPS5355474A (en) * | 1976-10-29 | 1978-05-19 | Kyoritsu Kogyo | Method of treating ammonium peroxysulfate waste liquid |
| US4319955A (en) * | 1980-11-05 | 1982-03-16 | Philip A. Hunt Chemical Corp. | Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut |
| DE3305319A1 (de) * | 1983-02-16 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | Elektrolytisches vollregenerierverfahren einer ammoniakalischen aetzloesung |
| DE3429902A1 (de) * | 1984-08-14 | 1986-02-27 | Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg | Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung |
-
1990
- 1990-07-05 AT AT0143390A patent/AT395177B/de active
- 1990-08-06 US US07/562,745 patent/US6129858A/en not_active Expired - Fee Related
-
1991
- 1991-06-22 AT AT91912126T patent/ATE95578T1/de active
- 1991-06-22 CZ CS921020A patent/CZ281606B6/cs not_active IP Right Cessation
- 1991-06-22 HU HU9201131A patent/HU210320B/hu not_active IP Right Cessation
- 1991-06-22 CA CA002069933A patent/CA2069933C/en not_active Expired - Fee Related
- 1991-06-22 RU SU915011717A patent/RU2078850C1/ru not_active IP Right Cessation
- 1991-06-22 SK SK1020-92A patent/SK281643B6/sk unknown
- 1991-06-22 DK DK91912126.9T patent/DK0491020T3/da active
- 1991-06-22 WO PCT/EP1991/001159 patent/WO1992001086A1/de active IP Right Grant
- 1991-06-22 DE DE91912126T patent/DE59100461D1/de not_active Expired - Fee Related
- 1991-06-22 EP EP91912126A patent/EP0491020B1/de not_active Expired - Lifetime
- 1991-06-22 ES ES91912126T patent/ES2046055T3/es not_active Expired - Lifetime
- 1991-06-27 IL IL9864591A patent/IL98645A/en not_active IP Right Cessation
-
1993
- 1993-12-10 LT LTIP1580A patent/LTIP1580A/xx not_active Application Discontinuation
-
1995
- 1995-07-13 HK HK115195A patent/HK115195A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATA143390A (de) | 1992-02-15 |
| AT395177B (de) | 1992-10-12 |
| ES2046055T3 (es) | 1994-01-16 |
| WO1992001086A1 (de) | 1992-01-23 |
| CZ102092A3 (en) | 1993-01-13 |
| EP0491020B1 (de) | 1993-10-06 |
| DK0491020T3 (da) | 1994-03-21 |
| DE59100461D1 (de) | 1993-11-11 |
| EP0491020A1 (de) | 1992-06-24 |
| CA2069933A1 (en) | 1992-01-06 |
| CZ281606B6 (cs) | 1996-11-13 |
| IL98645A0 (en) | 1992-07-15 |
| HUT64109A (en) | 1993-11-29 |
| LTIP1580A (en) | 1995-06-26 |
| HK115195A (en) | 1995-07-21 |
| RU2078850C1 (ru) | 1997-05-10 |
| HU210320B (en) | 1995-03-28 |
| CA2069933C (en) | 2000-06-20 |
| ATE95578T1 (de) | 1993-10-15 |
| SK102092A3 (en) | 1996-06-05 |
| SK281643B6 (sk) | 2001-06-11 |
| US6129858A (en) | 2000-10-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |