HK115195A - Etching solution - Google Patents

Etching solution Download PDF

Info

Publication number
HK115195A
HK115195A HK115195A HK115195A HK115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A
Authority
HK
Hong Kong
Prior art keywords
copper
etching solution
etching
vanadium
ammonium
Prior art date
Application number
HK115195A
Other languages
German (de)
English (en)
French (fr)
Inventor
Lindinger Bernd
Original Assignee
Elo-Chem Atztechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elo-Chem Atztechnik Gmbh filed Critical Elo-Chem Atztechnik Gmbh
Publication of HK115195A publication Critical patent/HK115195A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Gyroscopes (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
HK115195A 1990-07-05 1995-07-13 Etching solution HK115195A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT0143390A AT395177B (de) 1990-07-05 1990-07-05 Aetzloesung
US07/562,745 US6129858A (en) 1990-07-05 1990-08-06 Etching solution
PCT/EP1991/001159 WO1992001086A1 (de) 1990-07-05 1991-06-22 Ätzlösung

Publications (1)

Publication Number Publication Date
HK115195A true HK115195A (en) 1995-07-21

Family

ID=25595841

Family Applications (1)

Application Number Title Priority Date Filing Date
HK115195A HK115195A (en) 1990-07-05 1995-07-13 Etching solution

Country Status (15)

Country Link
US (1) US6129858A (cs)
EP (1) EP0491020B1 (cs)
AT (2) AT395177B (cs)
CA (1) CA2069933C (cs)
CZ (1) CZ281606B6 (cs)
DE (1) DE59100461D1 (cs)
DK (1) DK0491020T3 (cs)
ES (1) ES2046055T3 (cs)
HK (1) HK115195A (cs)
HU (1) HU210320B (cs)
IL (1) IL98645A (cs)
LT (1) LTIP1580A (cs)
RU (1) RU2078850C1 (cs)
SK (1) SK281643B6 (cs)
WO (1) WO1992001086A1 (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59406698D1 (de) * 1993-06-16 1998-09-17 Lignozym Gmbh Verfahren zur veränderung, abbau oder bleichen von lignin, ligninhaltigen materialien oder kohle
DE4339320A1 (de) * 1993-11-18 1995-05-24 Elochem Aetztechnik Gmbh Verfahren zum beschleunigten Ätzen und Abscheiden von Metallen in ammoniakalischen Ätzanlagen
DE102004030924A1 (de) * 2004-06-25 2006-01-19 Elo-Chem-Csm Gmbh Elektrolytisch regenerierbare Ätzlösung
DE102006036888A1 (de) * 2005-11-10 2007-05-16 Eve Recycling Sarl Regenerierbare Ätzlösung
CN102154646A (zh) * 2011-03-04 2011-08-17 侯延辉 一种不产生氯气的酸性蚀刻液及其催化剂
CN114752940B (zh) * 2022-04-21 2024-02-06 盛隆资源再生（无锡）有限公司 一种碱性含铜蚀刻废液的回收方法
CN120476227A (zh) * 2022-11-30 2025-08-12 叶涛 一种线路板氨碱性硫酸四氨合铜蚀刻工艺及其装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1294804A (en) * 1970-07-24 1972-11-01 Shipley Co Etchant for cupreous metals
DE2625869A1 (de) * 1976-06-09 1977-12-22 Siemens Ag Waessrige ammoniakalische aetzloesung zum aetzen von kupfer und kupferlegierungen
JPS5355474A (en) * 1976-10-29 1978-05-19 Kyoritsu Kogyo Method of treating ammonium peroxysulfate waste liquid
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
DE3305319A1 (de) * 1983-02-16 1984-08-16 Siemens AG, 1000 Berlin und 8000 München Elektrolytisches vollregenerierverfahren einer ammoniakalischen aetzloesung
DE3429902A1 (de) * 1984-08-14 1986-02-27 Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung

Also Published As

Publication number Publication date
ATA143390A (de) 1992-02-15
AT395177B (de) 1992-10-12
ES2046055T3 (es) 1994-01-16
WO1992001086A1 (de) 1992-01-23
CZ102092A3 (en) 1993-01-13
EP0491020B1 (de) 1993-10-06
DK0491020T3 (da) 1994-03-21
DE59100461D1 (de) 1993-11-11
EP0491020A1 (de) 1992-06-24
CA2069933A1 (en) 1992-01-06
CZ281606B6 (cs) 1996-11-13
IL98645A0 (en) 1992-07-15
HUT64109A (en) 1993-11-29
LTIP1580A (en) 1995-06-26
RU2078850C1 (ru) 1997-05-10
HU210320B (en) 1995-03-28
CA2069933C (en) 2000-06-20
ATE95578T1 (de) 1993-10-15
SK102092A3 (en) 1996-06-05
IL98645A (en) 1994-11-11
SK281643B6 (sk) 2001-06-11
US6129858A (en) 2000-10-10

Similar Documents

Publication Publication Date Title
US4632727A (en) Copper etching process and solution
US5431776A (en) Copper etchant solution additives
GB9901586D0 (en) Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
EP0349600B1 (en) Improved copper etchant compositions
EP1427869B1 (en) Regeneration method for a plating solution
US4329210A (en) Method of regenerating etchant and recovering etched metal
US4437928A (en) Dissolution of metals utilizing a glycol ether
HK115195A (en) Etching solution
US4424097A (en) Metal stripping process and composition
US4236957A (en) Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
US4140646A (en) Dissolution of metals with a selenium catalyzed H2 O2 -H2 SO4 etchant containing t-butyl hydroperoxide
JPS63502600A (ja) はんだ剥離溶液の再生方法
US4158593A (en) Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds
TWI539038B (zh) 包含在酸介質中的三價錳之蝕刻溶液的再生
KR920006351B1 (ko) ε-카프로락탐을 이용한 금속의 용해 방법 및 그 조성물
JP4673368B2 (ja) エッチング溶液
KR920006353B1 (ko) 피롤리돈을 이용한 금속의 용해 방법 및 그 조성물
KR920006354B1 (ko) 푸란 유도체를 이용한 금속의 용해 방법 및 그 조성물
KR100272318B1 (ko) 부식액
JPH05295567A (ja) 腐食性溶液
Luke Etching of copper with sulphuric acid/hydrogen peroxide solutions
JPS6363630B2 (cs)
HK1062926B (en) Regeneration method for a plating solution

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)