HK115195A - Etching solution - Google Patents
Etching solutionInfo
- Publication number
- HK115195A HK115195A HK115195A HK115195A HK115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A HK 115195 A HK115195 A HK 115195A
- Authority
- HK
- Hong Kong
- Prior art keywords
- etching solution
- copper
- vanadium
- etching
- catalyzer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
- Printing Plates And Materials Therefor (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Gyroscopes (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0143390A AT395177B (de) | 1990-07-05 | 1990-07-05 | Aetzloesung |
US07/562,745 US6129858A (en) | 1990-07-05 | 1990-08-06 | Etching solution |
PCT/EP1991/001159 WO1992001086A1 (de) | 1990-07-05 | 1991-06-22 | Ätzlösung |
Publications (1)
Publication Number | Publication Date |
---|---|
HK115195A true HK115195A (en) | 1995-07-21 |
Family
ID=25595841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK115195A HK115195A (en) | 1990-07-05 | 1995-07-13 | Etching solution |
Country Status (15)
Country | Link |
---|---|
US (1) | US6129858A (xx) |
EP (1) | EP0491020B1 (xx) |
AT (2) | AT395177B (xx) |
CA (1) | CA2069933C (xx) |
CZ (1) | CZ281606B6 (xx) |
DE (1) | DE59100461D1 (xx) |
DK (1) | DK0491020T3 (xx) |
ES (1) | ES2046055T3 (xx) |
HK (1) | HK115195A (xx) |
HU (1) | HU210320B (xx) |
IL (1) | IL98645A (xx) |
LT (1) | LTIP1580A (xx) |
RU (1) | RU2078850C1 (xx) |
SK (1) | SK281643B6 (xx) |
WO (1) | WO1992001086A1 (xx) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT705327E (pt) * | 1993-06-16 | 2000-10-31 | Call Hans Peter | Sistema de branqueamento de varios componentes |
DE4339320A1 (de) * | 1993-11-18 | 1995-05-24 | Elochem Aetztechnik Gmbh | Verfahren zum beschleunigten Ätzen und Abscheiden von Metallen in ammoniakalischen Ätzanlagen |
DE102004030924A1 (de) * | 2004-06-25 | 2006-01-19 | Elo-Chem-Csm Gmbh | Elektrolytisch regenerierbare Ätzlösung |
DE102006036888A1 (de) * | 2005-11-10 | 2007-05-16 | Eve Recycling Sarl | Regenerierbare Ätzlösung |
CN102154646A (zh) * | 2011-03-04 | 2011-08-17 | 侯延辉 | 一种不产生氯气的酸性蚀刻液及其催化剂 |
CN114752940B (zh) * | 2022-04-21 | 2024-02-06 | 盛隆资源再生(无锡)有限公司 | 一种碱性含铜蚀刻废液的回收方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1294804A (en) * | 1970-07-24 | 1972-11-01 | Shipley Co | Etchant for cupreous metals |
DE2625869A1 (de) * | 1976-06-09 | 1977-12-22 | Siemens Ag | Waessrige ammoniakalische aetzloesung zum aetzen von kupfer und kupferlegierungen |
JPS5355474A (en) * | 1976-10-29 | 1978-05-19 | Kyoritsu Kogyo | Method of treating ammonium peroxysulfate waste liquid |
US4319955A (en) * | 1980-11-05 | 1982-03-16 | Philip A. Hunt Chemical Corp. | Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut |
DE3305319A1 (de) * | 1983-02-16 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | Elektrolytisches vollregenerierverfahren einer ammoniakalischen aetzloesung |
DE3429902A1 (de) * | 1984-08-14 | 1986-02-27 | Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg | Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung |
-
1990
- 1990-07-05 AT AT0143390A patent/AT395177B/de active
- 1990-08-06 US US07/562,745 patent/US6129858A/en not_active Expired - Fee Related
-
1991
- 1991-06-22 ES ES91912126T patent/ES2046055T3/es not_active Expired - Lifetime
- 1991-06-22 SK SK1020-92A patent/SK281643B6/sk unknown
- 1991-06-22 DK DK91912126.9T patent/DK0491020T3/da active
- 1991-06-22 DE DE91912126T patent/DE59100461D1/de not_active Expired - Fee Related
- 1991-06-22 EP EP91912126A patent/EP0491020B1/de not_active Expired - Lifetime
- 1991-06-22 HU HU9201131A patent/HU210320B/hu not_active IP Right Cessation
- 1991-06-22 CA CA002069933A patent/CA2069933C/en not_active Expired - Fee Related
- 1991-06-22 WO PCT/EP1991/001159 patent/WO1992001086A1/de active IP Right Grant
- 1991-06-22 AT AT91912126T patent/ATE95578T1/de active
- 1991-06-22 RU SU915011717A patent/RU2078850C1/ru not_active IP Right Cessation
- 1991-06-22 CZ CS921020A patent/CZ281606B6/cs not_active IP Right Cessation
- 1991-06-27 IL IL9864591A patent/IL98645A/en not_active IP Right Cessation
-
1993
- 1993-12-10 LT LTIP1580A patent/LTIP1580A/xx not_active Application Discontinuation
-
1995
- 1995-07-13 HK HK115195A patent/HK115195A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AT395177B (de) | 1992-10-12 |
HU210320B (en) | 1995-03-28 |
CA2069933A1 (en) | 1992-01-06 |
DE59100461D1 (de) | 1993-11-11 |
ATE95578T1 (de) | 1993-10-15 |
CA2069933C (en) | 2000-06-20 |
IL98645A (en) | 1994-11-11 |
IL98645A0 (en) | 1992-07-15 |
RU2078850C1 (ru) | 1997-05-10 |
US6129858A (en) | 2000-10-10 |
DK0491020T3 (da) | 1994-03-21 |
ATA143390A (de) | 1992-02-15 |
WO1992001086A1 (de) | 1992-01-23 |
SK102092A3 (en) | 1996-06-05 |
EP0491020B1 (de) | 1993-10-06 |
LTIP1580A (en) | 1995-06-26 |
SK281643B6 (sk) | 2001-06-11 |
CZ281606B6 (cs) | 1996-11-13 |
ES2046055T3 (es) | 1994-01-16 |
EP0491020A1 (de) | 1992-06-24 |
CZ102092A3 (en) | 1993-01-13 |
HUT64109A (en) | 1993-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |