IL47310A - Photopolymerizable protective coatings and process for electroless plating - Google Patents

Photopolymerizable protective coatings and process for electroless plating

Info

Publication number
IL47310A
IL47310A IL47310A IL4731075A IL47310A IL 47310 A IL47310 A IL 47310A IL 47310 A IL47310 A IL 47310A IL 4731075 A IL4731075 A IL 4731075A IL 47310 A IL47310 A IL 47310A
Authority
IL
Israel
Prior art keywords
photopolymerizable
electroless plating
protective coatings
coatings
protective
Prior art date
Application number
IL47310A
Other languages
English (en)
Other versions
IL47310A0 (en
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of IL47310A0 publication Critical patent/IL47310A0/xx
Publication of IL47310A publication Critical patent/IL47310A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4981Utilizing transitory attached element or associated separate material
    • Y10T29/49812Temporary protective coating, impregnation, or cast layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
IL47310A 1974-05-24 1975-05-18 Photopolymerizable protective coatings and process for electroless plating IL47310A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/473,180 US4003877A (en) 1974-05-24 1974-05-24 Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions

Publications (2)

Publication Number Publication Date
IL47310A0 IL47310A0 (en) 1975-07-28
IL47310A true IL47310A (en) 1978-07-31

Family

ID=23878521

Family Applications (1)

Application Number Title Priority Date Filing Date
IL47310A IL47310A (en) 1974-05-24 1975-05-18 Photopolymerizable protective coatings and process for electroless plating

Country Status (24)

Country Link
US (2) US4003877A (da)
JP (1) JPS515388A (da)
AR (1) AR217039A1 (da)
AT (1) AT339928B (da)
BE (1) BE829437A (da)
BG (1) BG26402A3 (da)
BR (1) BR7503276A (da)
CA (1) CA1049691A (da)
CH (1) CH608825A5 (da)
DD (2) DD124390A5 (da)
DE (1) DE2522811C2 (da)
DK (1) DK154919C (da)
ES (1) ES437825A1 (da)
FI (1) FI59112C (da)
FR (1) FR2274652A1 (da)
GB (1) GB1507842A (da)
IL (1) IL47310A (da)
IN (1) IN142791B (da)
IT (1) IT1035820B (da)
NL (1) NL173178B (da)
NO (1) NO146676C (da)
RO (1) RO67457A (da)
SE (1) SE431879B (da)
ZA (1) ZA753049B (da)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5296690A (en) * 1976-02-10 1977-08-13 Dainippon Ink & Chem Inc Rapidly curable photo-setting resin composition
US4234676A (en) * 1978-01-23 1980-11-18 W. R. Grace & Co. Polythiol effect curable polymeric composition
DE2861486D1 (en) * 1977-11-21 1982-02-18 Ciba Geigy Ag Process for the application of soldering masks to printed circuits with through holes for contacting
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
US4381951A (en) * 1978-01-25 1983-05-03 Western Electric Co. Inc. Method of removing contaminants from a surface
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS5953164B2 (ja) * 1978-04-13 1984-12-24 日本文化精工株式会社 印刷とメツキとによるプラスチツク製品の加飾方法
JPS54158661A (en) * 1978-06-01 1979-12-14 Tokyo Purinto Kougiyou Kk Printed circuit board
GB2030584B (en) * 1978-10-03 1983-03-23 Lankro Chem Ltd Photopolymerisable solder resist compositions
NO159729C (no) * 1978-11-01 1989-02-01 Coates Brothers & Co Fremgangsmaate for fremstilling av et moenster av loddemetall paa et lag elektrisk ledende metall baaret av et ikke-ledende underlag.
US4486466A (en) * 1979-01-12 1984-12-04 Kollmorgen Technologies Corporation High resolution screen printable resists
US4240945A (en) * 1979-01-31 1980-12-23 Albert Gabrick Solder mask composition
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
GB2050946B (en) * 1979-05-30 1983-02-16 Tdk Electronics Co Ltd Hot melt screen printing machine and process for producing a screen printing plate
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
US4390615A (en) * 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
US4306012A (en) * 1979-12-05 1981-12-15 Hercules Incorporated Process of radiation and heat treatment of printing medium
US4252888A (en) * 1980-02-26 1981-02-24 Minnesota Mining And Manufacturing Company Solder mask composition
JPS6045665B2 (ja) * 1980-04-21 1985-10-11 日立化成工業株式会社 実装回路板用防湿絶縁塗料組成物
JPS573875A (en) * 1980-06-11 1982-01-09 Tamura Kaken Kk Photopolymerizable ink composition
US4490457A (en) * 1980-11-28 1984-12-25 Honeywell Inc. Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance
JPS5888741A (ja) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
JPS58177492A (ja) * 1982-04-12 1983-10-18 Tadao Mutou プラスチツク成形品に部分的な金属メツキを施す方法
US4522914A (en) * 1982-10-22 1985-06-11 Wabash College Imaging method of making a raised line facsimile of a photographic image
JPS59204036A (ja) * 1983-05-06 1984-11-19 Dainippon Ink & Chem Inc レジストパタ−ンの形成法
US4533445A (en) * 1983-07-06 1985-08-06 Shipley Company Inc. U.V. Curable composition
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
US4690833A (en) * 1986-03-28 1987-09-01 International Business Machines Corporation Providing circuit lines on a substrate
JPH0688012B2 (ja) * 1986-07-02 1994-11-09 ロクタイト.コーポレーション 放射線硬化性マスキング組成物
US4826705A (en) * 1986-07-02 1989-05-02 Loctite Corporation Radiation curable temporary solder mask
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
US5630869A (en) * 1988-01-12 1997-05-20 Sicipa Holding S.A. Reversibly photochromic printing inks
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
US5667934A (en) * 1990-10-09 1997-09-16 International Business Machines Corporation Thermally stable photoimaging composition
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
DE4316087A1 (de) * 1993-05-13 1994-11-17 Morton Int Inc Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten
US5458921A (en) 1994-10-11 1995-10-17 Morton International, Inc. Solvent system for forming films of photoimageable compositions
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5802713A (en) * 1995-01-20 1998-09-08 Fairchild Space And Defense Corportion Circuit board manufacturing method
US5952153A (en) * 1997-12-01 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility, adhesion and stripping characteristics
US5939239A (en) * 1997-12-01 1999-08-17 Nichigo-Morton Co., Ltd. Photoimageable compositions containing photopolymerizable urethane oligomers and dibenzoate plasticizers
US5939238A (en) * 1998-06-02 1999-08-17 Morton International, Inc. Photoimageable composition having improved photoinitiator system
US5952154A (en) * 1998-05-29 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
JP2000118113A (ja) * 1998-10-15 2000-04-25 Riso Kagaku Corp 孔版印刷方法及び装置
WO2002070591A2 (en) * 2001-02-08 2002-09-12 Mbt Holding Ag Polymeric excavation structural support membrane
US20030119955A1 (en) * 2001-02-08 2003-06-26 Mbt Holding Ag Polymeric structural support membrane
US6855480B2 (en) 2001-04-19 2005-02-15 Shipley Company, L.L.C. Photoresist composition
TW511423B (en) * 2001-09-25 2002-11-21 Benq Corp Soft circuit board for recognition and the manufacturing method thereof
US20060154180A1 (en) 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
KR101202228B1 (ko) * 2005-02-04 2012-11-16 덴끼 가가꾸 고교 가부시키가이샤 수지 조성물 및 그것을 이용한 경화물 그리고 시트
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto
EP2256167B1 (en) 2008-03-03 2018-08-22 Asahi Kasei Kabushiki Kaisha Flame-retardant resin composition
TWI353808B (en) * 2008-04-28 2011-12-01 Ind Tech Res Inst Method for fabricating conductive pattern on flexi
WO2010068488A1 (en) * 2008-11-25 2010-06-17 Lord Corporation Methods for protecting a die surface with photocurable materials
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
US20130029046A1 (en) * 2010-04-09 2013-01-31 Basf Se Printing ink containing a divinyl ester
US8344172B2 (en) * 2011-03-25 2013-01-01 Stepan Company Preparation of antiplasticizers for thermoplastic polyesters
WO2013100087A1 (ja) 2011-12-28 2013-07-04 旭化成イーマテリアルズ株式会社 レドックスフロー二次電池及びレドックスフロー二次電池用電解質膜
GB201223064D0 (en) * 2012-12-20 2013-02-06 Rainbow Technology Systems Ltd Curable coatings for photoimaging
WO2015036421A1 (en) * 2013-09-13 2015-03-19 Basf Se Scratch-resistant radiation-cured coatings
DE102014106230A1 (de) * 2014-05-05 2015-11-05 Preh Gmbh Galvanisierverfahren für Inselstrukturen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3066112A (en) * 1959-01-30 1962-11-27 Rafael L Bowen Dental filling material comprising vinyl silane treated fused silica and a binder consisting of the reaction product of bis phenol and glycidyl acrylate
US3539533A (en) * 1968-06-14 1970-11-10 Johnson & Johnson Dental filling material
US3661576A (en) * 1970-02-09 1972-05-09 Brady Co W H Photopolymerizable compositions and articles
US3772062A (en) * 1971-11-16 1973-11-13 Inmont Corp Ultra-violet curable coating compositions
JPS5414605B2 (da) * 1972-07-05 1979-06-08
JPS5625441B2 (da) * 1972-09-04 1981-06-12
JPS535712B2 (da) * 1973-01-24 1978-03-01
DE2349979A1 (de) * 1973-10-04 1975-04-17 Bayer Ag Uv-licht-haertende massen hoher reaktivitaet

Also Published As

Publication number Publication date
NO751830L (da) 1975-11-25
ZA753049B (en) 1976-04-28
ATA400775A (de) 1977-03-15
BE829437A (fr) 1975-09-15
CA1049691A (en) 1979-02-27
FR2274652B1 (da) 1979-01-19
FI59112B (fi) 1981-02-27
NL173178B (nl) 1983-07-18
SE431879B (sv) 1984-03-05
CH608825A5 (da) 1979-01-31
IN142791B (da) 1977-08-27
AU8112875A (en) 1976-11-18
IT1035820B (it) 1979-10-20
DE2522811A1 (de) 1975-11-27
FI59112C (fi) 1981-06-10
NO146676C (no) 1982-11-17
GB1507842A (en) 1978-04-19
DK154919C (da) 1989-05-29
US4003877A (en) 1977-01-18
DE2522811C2 (de) 1983-01-13
JPS515388A (en) 1976-01-17
ES437825A1 (es) 1977-07-01
IL47310A0 (en) 1975-07-28
DD120662A5 (da) 1976-06-20
NL7506080A (nl) 1975-11-26
NO146676B (no) 1982-08-09
FI751475A (da) 1975-11-25
SE7505838L (sv) 1975-12-11
DK154919B (da) 1989-01-02
AR217039A1 (es) 1980-02-29
RO67457A (ro) 1981-07-30
BG26402A3 (bg) 1979-03-15
US4064287A (en) 1977-12-20
DK227875A (da) 1975-11-25
DD124390A5 (da) 1977-02-16
AT339928B (de) 1977-11-10
BR7503276A (pt) 1976-04-27
FR2274652A1 (fr) 1976-01-09

Similar Documents

Publication Publication Date Title
IL47310A0 (en) Photopolymerizable protective coatings and process for electroless plating
JPS51112489A (en) Process and apparatus for coating substrate
JPS51137629A (en) Highhspeed continuous plating method
ZA763606B (en) Process for coating metals
ZA751534B (en) Process for coating metal substrates
JPS5253736A (en) Metallizing apparatus
ZA761496B (en) Coating apparatus
JPS5274536A (en) Process and apparatus for selectively plating metals
IL47491A0 (en) Process and device for stripping covered substrates
AU7707875A (en) Metal coating process
ZA761497B (en) Coating apparatus
MY8000242A (en) Process for coating aluminium and aluminium alloys
JPS5224131A (en) Luster* thick rhodium plating method
GB1537868A (en) Method for coating parts
JPS5250937A (en) Plating method
ZA76582B (en) Method for stripping aluminide coatings
ZA75550B (en) Resin coated metal substrates
JPS5242564A (en) Coating process
JPS5235721A (en) Electroplating apparatus
HK14282A (en) Method of plating a substrate
JPS5270945A (en) Plating method
JPS51131426A (en) Plating method
ZA762314B (en) Electroless plating substrates
JPS5217341A (en) Hifukukinzokuzai no seizohoho process for preparing coated metallic member
JPS5272334A (en) Plating method