JPS5274536A - Process and apparatus for selectively plating metals - Google Patents

Process and apparatus for selectively plating metals

Info

Publication number
JPS5274536A
JPS5274536A JP51138273A JP13827376A JPS5274536A JP S5274536 A JPS5274536 A JP S5274536A JP 51138273 A JP51138273 A JP 51138273A JP 13827376 A JP13827376 A JP 13827376A JP S5274536 A JPS5274536 A JP S5274536A
Authority
JP
Japan
Prior art keywords
selectively plating
plating metals
metals
selectively
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51138273A
Other languages
Japanese (ja)
Inventor
Detsutoke Manfureeto
Buaisuhauputo Borufuganku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPS5274536A publication Critical patent/JPS5274536A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
JP51138273A 1975-11-17 1976-11-17 Process and apparatus for selectively plating metals Pending JPS5274536A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752551988 DE2551988A1 (en) 1975-11-17 1975-11-17 PROCESS FOR THE SELECTIVE GALVANIC DEPOSITION OF METALS AND DEVICE FOR CARRYING OUT THE PROCESS

Publications (1)

Publication Number Publication Date
JPS5274536A true JPS5274536A (en) 1977-06-22

Family

ID=5962145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51138273A Pending JPS5274536A (en) 1975-11-17 1976-11-17 Process and apparatus for selectively plating metals

Country Status (12)

Country Link
JP (1) JPS5274536A (en)
BE (1) BE848442A (en)
CH (1) CH623850A5 (en)
DE (1) DE2551988A1 (en)
DK (1) DK296976A (en)
FR (1) FR2331629A1 (en)
GB (1) GB1569994A (en)
IE (1) IE44205B1 (en)
IT (1) IT1063937B (en)
LU (1) LU76198A1 (en)
NL (1) NL7612774A (en)
SE (1) SE7612738L (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579894A (en) * 1980-06-18 1982-01-19 Osaki Kinzoku:Kk Partial plating method
JPS5837190A (en) * 1981-08-26 1983-03-04 Sonitsukusu:Kk Method and device for partial plating
JPS5887294A (en) * 1981-11-18 1983-05-25 Sonitsukusu:Kk Method and device for surface treatment of very small part
JPS59107094A (en) * 1982-12-13 1984-06-21 Sonitsukusu:Kk Method and device for partial plating
WO2006068097A1 (en) * 2004-12-20 2006-06-29 Nsk Ltd. Method of electrodepositing hub

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2448585A1 (en) * 1979-02-08 1980-09-05 Souriau & Cie Selective electroplating of metals onto conducting substrates - esp. the inexpensive local deposition of gold onto electrical connectors or conductor paths
DE3108358C2 (en) * 1981-03-05 1985-08-29 Siemens AG, 1000 Berlin und 8000 München Device for the partial electroplating of electrically conductive bands, strips or the like. Parts combined in a continuous process
DE3148788C2 (en) * 1981-12-09 1986-08-21 Siemens AG, 1000 Berlin und 8000 München Aqueous bath and process for the galvanic deposition of shiny and crack-free palladium layers and process for the production of the bath
NL8300916A (en) * 1983-03-14 1984-10-01 Philips Nv METHOD FOR GALVANIC DEPOSITING OF A HOMOGENEOUS THICK METAL LAYER, SO METAL LAYER OBTAINED AND USE OF METAL LAYER THUS OBTAINED, APPARATUS FOR CARRYING OUT THE METHOD AND OBTAINED DIE.
FR2592895B1 (en) * 1986-01-16 1990-11-16 Selectrons France INSTALLATION FOR PERFORMING LOCALIZED ELECTROLYTIC TREATMENTS OF SURFACES.
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
FR2688804A1 (en) * 1992-03-20 1993-09-24 Souriau & Cie METHOD FOR THE SELECTIVE ELECTROLYTIC DEPOSITION OF A METAL, PARTICULARLY A NOBLE METAL, SUCH AS GOLD ON THE INTERNAL SIDE OF HOLLOW BODY IN SOCKET FORM, IN PARTICULAR OF MACHINE CONNECTOR CONTACT ELEMENTS FOR IMPLEMENTING THE PROCESS, PRODUCT OBTAINED .
DE10149733A1 (en) * 2001-10-09 2003-04-24 Bosch Gmbh Robert Method and device for producing an electroplating layer on a substrate surface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030337U (en) * 1973-06-19 1975-04-04

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1360811A (en) * 1963-04-03 1964-05-15 Micro-stripper
DE2010139A1 (en) * 1970-03-04 1971-09-23 Inovan Stroebe Selective electro plating of metal strip
US3810829A (en) * 1972-06-28 1974-05-14 Nasa Scanning nozzle plating system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030337U (en) * 1973-06-19 1975-04-04

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579894A (en) * 1980-06-18 1982-01-19 Osaki Kinzoku:Kk Partial plating method
JPS5837190A (en) * 1981-08-26 1983-03-04 Sonitsukusu:Kk Method and device for partial plating
JPS5852034B2 (en) * 1981-08-26 1983-11-19 株式会社ソニツクス Partial plating method and device
JPS5887294A (en) * 1981-11-18 1983-05-25 Sonitsukusu:Kk Method and device for surface treatment of very small part
JPS627279B2 (en) * 1981-11-18 1987-02-16 Sonitsukusu Kk
JPS59107094A (en) * 1982-12-13 1984-06-21 Sonitsukusu:Kk Method and device for partial plating
JPS628516B2 (en) * 1982-12-13 1987-02-23 Sonitsukusu Kk
WO2006068097A1 (en) * 2004-12-20 2006-06-29 Nsk Ltd. Method of electrodepositing hub
GB2435600A (en) * 2004-12-20 2007-08-29 Nsk Ltd Method of electrodepositing hub

Also Published As

Publication number Publication date
FR2331629A1 (en) 1977-06-10
FR2331629B1 (en) 1980-03-07
CH623850A5 (en) 1981-06-30
NL7612774A (en) 1977-05-20
BE848442A (en) 1977-05-17
DE2551988A1 (en) 1977-05-26
SE7612738L (en) 1977-05-18
IE44205L (en) 1977-05-17
DK296976A (en) 1977-05-18
LU76198A1 (en) 1977-05-23
IE44205B1 (en) 1981-09-09
IT1063937B (en) 1985-02-18
GB1569994A (en) 1980-06-25

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