IL195951A0 - Semiconductor device and manufacturing method of semiconductor device - Google Patents

Semiconductor device and manufacturing method of semiconductor device

Info

Publication number
IL195951A0
IL195951A0 IL195951A IL19595108A IL195951A0 IL 195951 A0 IL195951 A0 IL 195951A0 IL 195951 A IL195951 A IL 195951A IL 19595108 A IL19595108 A IL 19595108A IL 195951 A0 IL195951 A0 IL 195951A0
Authority
IL
Israel
Prior art keywords
semiconductor device
manufacturing
semiconductor
Prior art date
Application number
IL195951A
Other languages
English (en)
Original Assignee
Tokyo Electron Ltd
Masahiro Horigome
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Masahiro Horigome filed Critical Tokyo Electron Ltd
Publication of IL195951A0 publication Critical patent/IL195951A0/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6506—Formation of intermediate materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/035—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/47—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts comprising two or more dielectric layers having different properties, e.g. different dielectric constants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H10P14/687—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
IL195951A 2006-06-23 2008-12-15 Semiconductor device and manufacturing method of semiconductor device IL195951A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006174429A JP5194393B2 (ja) 2006-06-23 2006-06-23 半導体装置の製造方法
PCT/JP2007/061450 WO2007148535A1 (ja) 2006-06-23 2007-06-06 半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
IL195951A0 true IL195951A0 (en) 2009-09-01

Family

ID=38833277

Family Applications (1)

Application Number Title Priority Date Filing Date
IL195951A IL195951A0 (en) 2006-06-23 2008-12-15 Semiconductor device and manufacturing method of semiconductor device

Country Status (8)

Country Link
US (1) US20090134518A1 (OSRAM)
EP (1) EP2034517A4 (OSRAM)
JP (1) JP5194393B2 (OSRAM)
KR (1) KR20090003368A (OSRAM)
CN (1) CN101461043A (OSRAM)
IL (1) IL195951A0 (OSRAM)
TW (1) TW200811953A (OSRAM)
WO (1) WO2007148535A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8778810B2 (en) 2009-06-26 2014-07-15 Tokyo Electron Limited Plasma treatment method
JP5364765B2 (ja) 2011-09-07 2013-12-11 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
US8691709B2 (en) * 2011-09-24 2014-04-08 Tokyo Electron Limited Method of forming metal carbide barrier layers for fluorocarbon films
JP2015195282A (ja) * 2014-03-31 2015-11-05 東京エレクトロン株式会社 成膜方法、半導体製造方法及び半導体装置
JP5778820B1 (ja) * 2014-04-09 2015-09-16 日本特殊陶業株式会社 スパークプラグ
WO2016021533A1 (ja) * 2014-08-04 2016-02-11 Ｊｘ日鉱日石エネルギー株式会社 凹凸パターンを有する部材の製造方法
DE112015005198B4 (de) * 2014-11-18 2023-05-17 Mitsubishi Electric Corporation Signalübertragungs-isoliereinrichtung und leistungshalbleitermodul

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03140496A (ja) * 1989-10-25 1991-06-14 Daido Steel Co Ltd 母材の表面着色方法
JP3158598B2 (ja) * 1991-02-26 2001-04-23 日本電気株式会社 半導体装置およびその製造方法
JP4355039B2 (ja) * 1998-05-07 2009-10-28 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
JP2000208622A (ja) * 1999-01-12 2000-07-28 Tokyo Electron Ltd 半導体装置及びその製造方法
DE60037395T2 (de) * 1999-03-09 2008-11-27 Tokyo Electron Ltd. Herstellung eines halbleiter-bauelementes
JP4260764B2 (ja) * 1999-03-09 2009-04-30 東京エレクトロン株式会社 半導体装置の製造方法
EP1077479A1 (en) * 1999-08-17 2001-02-21 Applied Materials, Inc. Post-deposition treatment to enchance properties of Si-O-C low K film
WO2002023616A1 (en) * 2000-09-18 2002-03-21 Acm Research, Inc. Integrating metal with ultra low-k dielectrics
JP3817463B2 (ja) * 2001-11-12 2006-09-06 新光電気工業株式会社 多層配線基板の製造方法
JP2005026386A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 半導体装置
JP4413556B2 (ja) * 2003-08-15 2010-02-10 東京エレクトロン株式会社 成膜方法、半導体装置の製造方法
JP2005109138A (ja) 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP4715207B2 (ja) * 2004-01-13 2011-07-06 東京エレクトロン株式会社 半導体装置の製造方法及び成膜システム
JP4194521B2 (ja) 2004-04-07 2008-12-10 東京エレクトロン株式会社 半導体装置の製造方法
JP4555143B2 (ja) * 2004-05-11 2010-09-29 東京エレクトロン株式会社 基板の処理方法
US20060113675A1 (en) * 2004-12-01 2006-06-01 Chung-Liang Chang Barrier material and process for Cu interconnect
JP2006190884A (ja) * 2005-01-07 2006-07-20 Toshiba Corp 半導体装置及び半導体装置の製造方法
JP2006135363A (ja) * 2006-02-14 2006-05-25 Renesas Technology Corp 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
KR20090003368A (ko) 2009-01-09
WO2007148535A1 (ja) 2007-12-27
TW200811953A (en) 2008-03-01
CN101461043A (zh) 2009-06-17
JP5194393B2 (ja) 2013-05-08
EP2034517A4 (en) 2010-07-21
JP2008004841A (ja) 2008-01-10
EP2034517A1 (en) 2009-03-11
US20090134518A1 (en) 2009-05-28

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