IL147278A - Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing same - Google Patents
Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing sameInfo
- Publication number
- IL147278A IL147278A IL14727800A IL14727800A IL147278A IL 147278 A IL147278 A IL 147278A IL 14727800 A IL14727800 A IL 14727800A IL 14727800 A IL14727800 A IL 14727800A IL 147278 A IL147278 A IL 147278A
- Authority
- IL
- Israel
- Prior art keywords
- nest
- transfer module
- wafer
- transport robot
- atmospheric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/342,669 US6244811B1 (en) | 1999-06-29 | 1999-06-29 | Atmospheric wafer transfer module with nest for wafer transport robot |
PCT/US2000/040191 WO2001001454A2 (en) | 1999-06-29 | 2000-06-08 | Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing same |
Publications (2)
Publication Number | Publication Date |
---|---|
IL147278A0 IL147278A0 (en) | 2002-08-14 |
IL147278A true IL147278A (en) | 2005-09-25 |
Family
ID=23342780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14727800A IL147278A (en) | 1999-06-29 | 2000-06-08 | Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing same |
Country Status (10)
Country | Link |
---|---|
US (1) | US6244811B1 (zh) |
EP (1) | EP1192645A2 (zh) |
JP (1) | JP2003503843A (zh) |
KR (1) | KR100699207B1 (zh) |
CN (1) | CN1209790C (zh) |
AU (1) | AU6802200A (zh) |
IL (1) | IL147278A (zh) |
MY (1) | MY117518A (zh) |
TW (1) | TW508625B (zh) |
WO (1) | WO2001001454A2 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US6672819B1 (en) * | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US6139678A (en) * | 1997-11-20 | 2000-10-31 | Trusi Technologies, Llc | Plasma processing methods and apparatus |
JP2001110663A (ja) * | 1999-10-08 | 2001-04-20 | Hitachi Ltd | 試料の処理方法および処理装置並びに磁気ヘッドの製作方法 |
JP2001127044A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Ltd | 真空処理装置および真空処理システム |
JP4937459B2 (ja) * | 2001-04-06 | 2012-05-23 | 東京エレクトロン株式会社 | クラスタツールおよび搬送制御方法 |
US6750155B2 (en) * | 2001-08-08 | 2004-06-15 | Lam Research Corporation | Methods to minimize moisture condensation over a substrate in a rapid cycle chamber |
US20040221811A1 (en) * | 2001-11-30 | 2004-11-11 | Robert Mitchell | Method and apparatus for processing wafers |
US6719517B2 (en) * | 2001-12-04 | 2004-04-13 | Brooks Automation | Substrate processing apparatus with independently configurable integral load locks |
US6729824B2 (en) * | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US7010388B2 (en) * | 2003-05-22 | 2006-03-07 | Axcelis Technologies, Inc. | Work-piece treatment system having load lock and buffer |
CN1981371B (zh) * | 2004-07-09 | 2010-05-05 | 日商乐华股份有限公司 | 驱动源及移动式搬运机器人 |
US7611124B2 (en) * | 2004-12-22 | 2009-11-03 | Tokyo Electron Limited | Vacuum processing apparatus |
CN100435313C (zh) * | 2005-07-12 | 2008-11-19 | Lkt自动化配备私人有限公司 | 定心及定向设备 |
US8794896B2 (en) * | 2005-12-14 | 2014-08-05 | Tokyo Electron Limited | Vacuum processing apparatus and zonal airflow generating unit |
JP4098338B2 (ja) | 2006-07-20 | 2008-06-11 | 川崎重工業株式会社 | ウェハ移載装置および基板移載装置 |
TWI398335B (zh) | 2006-11-27 | 2013-06-11 | Nidec Sankyo Corp | Workpiece conveying system |
US20080242108A1 (en) * | 2007-04-02 | 2008-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating semiconductor device |
GB2482264B (en) * | 2007-09-14 | 2012-04-18 | Doo Technologies Fzco | Method and system for processing of images |
JP2010062534A (ja) * | 2008-06-30 | 2010-03-18 | Intevac Inc | 基板搬送システム及び方法 |
WO2010014761A1 (en) | 2008-07-29 | 2010-02-04 | Intevac, Inc. | Processing tool with combined sputter and evaporation deposition sources |
PL2409317T3 (pl) * | 2009-03-18 | 2014-06-30 | Oerlikon Advanced Tech Ag | Urządzenie do obróbki próżniowej |
JP6271322B2 (ja) * | 2014-03-31 | 2018-01-31 | 東京エレクトロン株式会社 | 基板処理システム |
CN105826227A (zh) * | 2015-01-06 | 2016-08-03 | 沈阳新松机器人自动化股份有限公司 | 一种真空传输装置 |
US10249521B2 (en) | 2016-03-17 | 2019-04-02 | Lam Research Ag | Wet-dry integrated wafer processing system |
CN107665829B (zh) | 2017-08-24 | 2019-12-17 | 长江存储科技有限责任公司 | 晶圆混合键合中提高金属引线制程安全性的方法 |
CN116435246B (zh) * | 2023-06-15 | 2023-09-08 | 上海果纳半导体技术有限公司 | 晶圆盒夹持装置 |
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US3789875A (en) | 1972-05-15 | 1974-02-05 | Gray Tool Co | Fluid pressure actuated valve operator |
US4355937A (en) | 1980-12-24 | 1982-10-26 | International Business Machines Corporation | Low shock transmissive antechamber seal mechanisms for vacuum chamber type semi-conductor wafer electron beam writing apparatus |
US4340462A (en) | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
US4483654A (en) | 1981-02-13 | 1984-11-20 | Lam Research Corporation | Workpiece transfer mechanism |
US4593915A (en) | 1984-11-28 | 1986-06-10 | Grove Valve And Regulator Co. | Orifice plate seal ring |
US4753417A (en) | 1985-01-28 | 1988-06-28 | The Boc Group, Inc. | Gate valve for vacuum processing apparatus |
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US4917556A (en) | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
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DE3704505A1 (de) * | 1987-02-13 | 1988-08-25 | Leybold Ag | Einlegegeraet fuer vakuumanlagen |
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US5002255A (en) | 1989-03-03 | 1991-03-26 | Irie Koken Kabushiki Kaisha | Non-sliding gate valve for high vacuum use |
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US5120019A (en) | 1989-08-03 | 1992-06-09 | Brooks Automation, Inc. | Valve |
JPH0478377A (ja) | 1990-07-20 | 1992-03-12 | Tokyo Electron Ltd | トグル式ゲート |
DE4024973C2 (de) | 1990-08-07 | 1994-11-03 | Ibm | Anordnung zum Lagern, Transportieren und Einschleusen von Substraten |
JP2986121B2 (ja) | 1991-03-26 | 1999-12-06 | 東京エレクトロン株式会社 | ロードロック装置及び真空処理装置 |
US5697749A (en) | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
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JP3394293B2 (ja) | 1993-09-20 | 2003-04-07 | 株式会社日立製作所 | 試料の搬送方法および半導体装置の製造方法 |
US5383338A (en) | 1993-12-17 | 1995-01-24 | Emerson Electric Co. | In-line sight indicator |
KR960002534A (ko) | 1994-06-07 | 1996-01-26 | 이노우에 아키라 | 감압·상압 처리장치 |
US5538385A (en) * | 1994-06-24 | 1996-07-23 | Kensington Laboratories, Inc. | Specimen carrier holder and method of operating it |
JPH08330379A (ja) * | 1995-05-31 | 1996-12-13 | Toshiba Corp | ウェハ搬送制御方法 |
JPH098094A (ja) * | 1995-06-21 | 1997-01-10 | Shibaura Eng Works Co Ltd | 真空処理装置 |
US5667197A (en) | 1996-07-09 | 1997-09-16 | Lam Research Corporation | Vacuum chamber gate valve and method for making same |
JP3549674B2 (ja) * | 1996-07-19 | 2004-08-04 | 東京応化工業株式会社 | ロードロック室を備えた基板の処理装置 |
JP3784117B2 (ja) * | 1996-11-13 | 2006-06-07 | 東京応化工業株式会社 | 基板の処理装置 |
US5902088A (en) | 1996-11-18 | 1999-05-11 | Applied Materials, Inc. | Single loadlock chamber with wafer cooling function |
JP3437734B2 (ja) * | 1997-02-26 | 2003-08-18 | 富士通株式会社 | 製造装置 |
JP4048387B2 (ja) | 1997-09-10 | 2008-02-20 | 東京エレクトロン株式会社 | ロードロック機構及び処理装置 |
-
1999
- 1999-06-29 US US09/342,669 patent/US6244811B1/en not_active Expired - Lifetime
-
2000
- 2000-06-08 EP EP00955899A patent/EP1192645A2/en not_active Ceased
- 2000-06-08 JP JP2001506584A patent/JP2003503843A/ja active Pending
- 2000-06-08 IL IL14727800A patent/IL147278A/xx not_active IP Right Cessation
- 2000-06-08 CN CNB008097607A patent/CN1209790C/zh not_active Expired - Fee Related
- 2000-06-08 KR KR1020017016858A patent/KR100699207B1/ko not_active IP Right Cessation
- 2000-06-08 AU AU68022/00A patent/AU6802200A/en not_active Abandoned
- 2000-06-08 WO PCT/US2000/040191 patent/WO2001001454A2/en active IP Right Grant
- 2000-06-28 TW TW089112930A patent/TW508625B/zh not_active IP Right Cessation
- 2000-06-29 MY MYPI20002973A patent/MY117518A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US6244811B1 (en) | 2001-06-12 |
MY117518A (en) | 2004-07-31 |
WO2001001454A9 (en) | 2002-02-07 |
KR20020063109A (ko) | 2002-08-01 |
WO2001001454A3 (en) | 2001-07-12 |
IL147278A0 (en) | 2002-08-14 |
CN1409867A (zh) | 2003-04-09 |
AU6802200A (en) | 2001-01-31 |
KR100699207B1 (ko) | 2007-03-27 |
CN1209790C (zh) | 2005-07-06 |
TW508625B (en) | 2002-11-01 |
EP1192645A2 (en) | 2002-04-03 |
JP2003503843A (ja) | 2003-01-28 |
WO2001001454A2 (en) | 2001-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |