AU2001273658A1 - Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers - Google Patents

Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers

Info

Publication number
AU2001273658A1
AU2001273658A1 AU2001273658A AU7365801A AU2001273658A1 AU 2001273658 A1 AU2001273658 A1 AU 2001273658A1 AU 2001273658 A AU2001273658 A AU 2001273658A AU 7365801 A AU7365801 A AU 7365801A AU 2001273658 A1 AU2001273658 A1 AU 2001273658A1
Authority
AU
Australia
Prior art keywords
wafers
wheel
conveyor system
transporting semiconductor
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273658A
Inventor
Brian M. Bliven
Michael Ravkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001273658A1 publication Critical patent/AU2001273658A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
AU2001273658A 2000-06-30 2001-06-29 Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers Abandoned AU2001273658A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/608,515 US6439245B1 (en) 2000-06-30 2000-06-30 Method for transferring wafers from a conveyor system to a wafer processing station
US09/608,515 2000-06-30
PCT/US2001/041219 WO2002003433A2 (en) 2000-06-30 2001-06-29 Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers

Publications (1)

Publication Number Publication Date
AU2001273658A1 true AU2001273658A1 (en) 2002-01-14

Family

ID=24436838

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273658A Abandoned AU2001273658A1 (en) 2000-06-30 2001-06-29 Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers

Country Status (4)

Country Link
US (3) US6439245B1 (en)
AU (1) AU2001273658A1 (en)
TW (1) TW492064B (en)
WO (1) WO2002003433A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918864B1 (en) * 1999-06-01 2005-07-19 Applied Materials, Inc. Roller that avoids substrate slippage
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
JP2002052370A (en) * 2000-08-09 2002-02-19 Ebara Corp Substrate cleaning apparatus
US7067016B1 (en) * 2003-03-31 2006-06-27 Lam Research Corporation Chemically assisted mechanical cleaning of MRAM structures
US7056392B1 (en) * 2003-04-16 2006-06-06 Lsi Logic Corporation Wafer chucking apparatus and method for spin processor
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
EP1635223A3 (en) * 2004-08-27 2009-11-11 FUJIFILM Corporation Processing apparatus for lithographic printing plate and process for processing the same
US20080011325A1 (en) * 2006-06-05 2008-01-17 Olgado Donald J Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
US7780825B2 (en) * 2007-05-21 2010-08-24 Lam Research Corporation Substrate gripper with integrated electrical contacts
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
CN101958402B (en) * 2010-05-25 2012-02-29 东莞宏威数码机械有限公司 Tightness-adjustable substrate transmission device
CN102815525A (en) * 2012-07-18 2012-12-12 苏州汾湖电梯有限公司 Guiding and locating device
US20210114832A1 (en) * 2018-06-14 2021-04-22 Applied Materials, Inc. Roller device for guiding a flexible substrate, use of a roller device for transporting a flexible substrate, vacuum processing apparatus, and method of processing a flexible substrate
JP7348021B2 (en) * 2019-10-15 2023-09-20 株式会社荏原製作所 Substrate cleaning equipment and substrate cleaning method
CN113394140B (en) * 2021-07-02 2024-07-23 北京北方华创微电子装备有限公司 Semiconductor cleaning equipment and manipulator thereof
CN117316862B (en) * 2023-10-23 2024-04-05 昆山日月同芯半导体有限公司 Wafer clamping mechanism and wafer transmission equipment

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB365441A (en) * 1930-05-03 1932-01-21 Muller J C & Co Apparatus for delivering cigarettes from a continuous rod cigarette-making machine
US2580469A (en) * 1950-06-01 1952-01-01 Johnson & Johnson Cam device for varying speed of an object
FR2102423A5 (en) * 1970-08-03 1972-04-07 Decoufle Usines
SU470159A1 (en) * 1971-12-22 1976-08-25 Издательство "Известия" Советов Депутатов Трудящихся Ссср Device for moving piece goods in two mutually perpendicular directions
US4181214A (en) * 1977-11-25 1980-01-01 Kasper Instruments, Inc. Wafer transfer apparatus
US4217977A (en) 1978-09-15 1980-08-19 The Silicon Valley Group, Inc. Conveyor system
US4313266A (en) 1980-05-01 1982-02-02 The Silicon Valley Group, Inc. Method and apparatus for drying wafers
US4505381A (en) * 1983-05-23 1985-03-19 Harry Major Machine And Tool Co. Conveyor roller
US4846623A (en) * 1986-10-08 1989-07-11 Dainippon Screen Mfg. Co., Ltd. Wafer transferring device
US5176158A (en) * 1991-10-29 1993-01-05 Chemcut Corporation Apparatus and method for transporting materials which are to be chemically treated
US5345639A (en) * 1992-05-28 1994-09-13 Tokyo Electron Limited Device and method for scrubbing and cleaning substrate
JP2888412B2 (en) * 1994-07-04 1999-05-10 信越半導体株式会社 Brush cleaning device and work cleaning system
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
US5795405A (en) * 1996-03-13 1998-08-18 Eric F. Harnden Machine and method for processing of printed circuit boards by immersion in transversely flowing liquid chemical
US5810549A (en) * 1996-04-17 1998-09-22 Applied Materials, Inc. Independent linear dual-blade robot and method for transferring wafers
US5899216A (en) * 1996-07-08 1999-05-04 Speedfam Corporation Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
US5924154A (en) 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
AT406041B (en) * 1997-01-29 2000-01-25 Knapp Holding Gmbh SWITCH FOR A CONVEYOR
JP3850951B2 (en) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
JPH10314684A (en) * 1997-05-21 1998-12-02 Speedfam Co Ltd Method for washing disk-shaped work and device therefor
WO1999004416A1 (en) 1997-07-17 1999-01-28 Kunze Concewitz Horst Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
JP3331168B2 (en) * 1997-12-09 2002-10-07 ティーディーケイ株式会社 Cleaning method and apparatus
US6021791A (en) 1998-06-29 2000-02-08 Speedfam-Ipec Corporation Method and apparatus for immersion cleaning of semiconductor devices
US6217272B1 (en) * 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
EP1058296A2 (en) * 1999-06-01 2000-12-06 Applied Materials, Inc. A roller for rotating a substrate
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station

Also Published As

Publication number Publication date
WO2002003433A3 (en) 2002-08-15
US6439245B1 (en) 2002-08-27
US6607072B2 (en) 2003-08-19
US20020174881A1 (en) 2002-11-28
WO2002003433A2 (en) 2002-01-10
US6752162B1 (en) 2004-06-22
TW492064B (en) 2002-06-21

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