IL140682A - Wafer cleaning apparatus - Google Patents

Wafer cleaning apparatus

Info

Publication number
IL140682A
IL140682A IL14068299A IL14068299A IL140682A IL 140682 A IL140682 A IL 140682A IL 14068299 A IL14068299 A IL 14068299A IL 14068299 A IL14068299 A IL 14068299A IL 140682 A IL140682 A IL 140682A
Authority
IL
Israel
Prior art keywords
wafer
brush
substrate
brushes
effector
Prior art date
Application number
IL14068299A
Other languages
English (en)
Other versions
IL140682A0 (en
Inventor
David Jones Oliver
Vail Jim
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of IL140682A0 publication Critical patent/IL140682A0/xx
Publication of IL140682A publication Critical patent/IL140682A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
IL14068299A 1998-07-09 1999-07-09 Wafer cleaning apparatus IL140682A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/113,811 US6230753B1 (en) 1996-07-15 1998-07-09 Wafer cleaning apparatus
PCT/US1999/015471 WO2000003419A2 (en) 1998-07-09 1999-07-09 Wafer cleaning apparatus

Publications (2)

Publication Number Publication Date
IL140682A0 IL140682A0 (en) 2002-02-10
IL140682A true IL140682A (en) 2004-06-01

Family

ID=22351657

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14068299A IL140682A (en) 1998-07-09 1999-07-09 Wafer cleaning apparatus

Country Status (8)

Country Link
US (1) US6230753B1 (da)
EP (1) EP1099240A2 (da)
JP (1) JP2002520846A (da)
KR (1) KR20010071804A (da)
CN (1) CN1312953A (da)
AU (1) AU4977799A (da)
IL (1) IL140682A (da)
WO (1) WO2000003419A2 (da)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6516816B1 (en) * 1999-04-08 2003-02-11 Applied Materials, Inc. Spin-rinse-dryer
KR20010021299A (ko) * 1999-08-14 2001-03-15 조셉 제이. 스위니 스크루버에서의 후면부 에칭
TW434668B (en) * 2000-01-27 2001-05-16 Ind Tech Res Inst Wafer rinse apparatus and rinse method of the same
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6482678B1 (en) * 2000-03-31 2002-11-19 Lam Research Corporation Wafer preparation systems and methods for preparing wafers
US6427566B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
US6616509B1 (en) * 2000-03-31 2003-09-09 Lam Research Corporation Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
JP2002052370A (ja) 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
JP2005534188A (ja) * 2002-07-26 2005-11-10 アプライド　マテリアルズ　インコーポレイテッド スピンドライヤーの為の親水性構成要素
US6910240B1 (en) * 2002-12-16 2005-06-28 Lam Research Corporation Wafer bevel edge cleaning system and apparatus
KR20120004551A (ko) * 2003-10-28 2012-01-12 어플라이드 머티어리얼스, 인코포레이티드 스크러버 박스 및 그 사용 방법
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
JP4537826B2 (ja) * 2004-10-22 2010-09-08 芝浦メカトロニクス株式会社 基板の処理装置
EP1872392B1 (en) * 2005-04-19 2012-02-22 Ebara Corporation Substrate processing apparatus
CN101604625B (zh) * 2005-04-20 2011-06-01 飞思卡尔半导体公司 清洗电路衬底的设备
DE602005026179D1 (de) 2005-04-20 2011-03-10 Freescale Semiconductor Inc Vorrichtung zum reinigen von schaltungssubstraten
JP2007165554A (ja) * 2005-12-13 2007-06-28 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
US7962990B2 (en) * 2008-10-01 2011-06-21 Applied Materials, Inc. Brush box cleaner module with force control
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP2011165751A (ja) * 2010-02-05 2011-08-25 Toshiba Corp 洗浄装置及び半導体装置の製造方法
CN102194653B (zh) * 2010-03-11 2013-02-13 中芯国际集成电路制造(上海)有限公司 晶片清洗装置
CN102074455B (zh) * 2010-09-03 2012-11-14 清华大学 用于晶圆的刷洗装置
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
CN102592961A (zh) * 2011-01-12 2012-07-18 柏连企业股份有限公司 晶片下片排片机
WO2013112196A1 (en) * 2012-01-24 2013-08-01 Applied Materials, Inc. Cleaning module and process for particle reduction
KR200473415Y1 (ko) * 2012-05-10 2014-07-04 신형철 폴리셔용 이중 도어 시스템
JP6262983B2 (ja) 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
CN102969226B (zh) * 2012-11-01 2017-06-23 上海集成电路研发中心有限公司 晶圆边缘的处理装置和系统
CN103008301B (zh) * 2013-01-11 2016-01-20 常州市科沛达超声工程设备有限公司 晶圆片双面刷洗机
CN112233971B (zh) * 2020-12-15 2021-03-16 华海清科(北京)科技有限公司 一种晶圆清洗方法和晶圆清洗装置
CN114937618B (zh) * 2022-04-22 2025-03-18 浙江富芯微电子科技有限公司 双面刷洗机和碳化硅晶片表面的清洗方法
CN116765966B (zh) * 2023-08-18 2023-12-19 浙江求是半导体设备有限公司 晶片表面处理设备

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062463A (en) 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
US4208760A (en) 1977-12-19 1980-06-24 Huestis Machine Corp. Apparatus and method for cleaning wafers
US4202071A (en) 1978-03-20 1980-05-13 Scharpf Mike A Apparatus for washing and drying phonograph records
US4382308A (en) 1981-02-18 1983-05-10 Chemcut Corporation Scrubbing torque monitoring and control system
JPS5986226A (ja) 1982-11-08 1984-05-18 Mitsubishi Electric Corp 薄板状材の洗浄装置
US4569695A (en) 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US5357645A (en) 1989-04-09 1994-10-25 System Seiko Co., Ltd. Apparatus for cleaning and drying hard disk substrates
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
US5317778A (en) 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
JP2877216B2 (ja) 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
JP3493676B2 (ja) 1992-11-25 2004-02-03 ソニー株式会社 半導体基板の洗浄方法および洗浄装置
US5442828A (en) 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5555177A (en) 1994-05-27 1996-09-10 Ontrak Systems, Inc. Method and apparatus for resetting individual processes in a control system
JP2888412B2 (ja) 1994-07-04 1999-05-10 信越半導体株式会社 ブラシ洗浄装置及びワーク洗浄システム
US5727332A (en) 1994-07-15 1998-03-17 Ontrak Systems, Inc. Contamination control in substrate processing system
US5475889A (en) 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
US5745946A (en) 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
US5723019A (en) 1994-07-15 1998-03-03 Ontrak Systems, Incorporated Drip chemical delivery method and apparatus
US5606251A (en) 1994-07-15 1997-02-25 Ontrak Systems, Inc. Method and apparatus for detecting a substrate in a substrate processing system
TW316995B (da) 1995-01-19 1997-10-01 Tokyo Electron Co Ltd
US5639311A (en) 1995-06-07 1997-06-17 International Business Machines Corporation Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
US5624501A (en) 1995-09-26 1997-04-29 Gill, Jr.; Gerald L. Apparatus for cleaning semiconductor wafers
WO1997013590A1 (en) 1995-10-13 1997-04-17 Ontrak Systems, Inc. Method and apparatus for chemical delivery through the brush
US5693148A (en) 1995-11-08 1997-12-02 Ontrak Systems, Incorporated Process for brush cleaning
US5675856A (en) 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5778554A (en) 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US5933902A (en) 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system

Also Published As

Publication number Publication date
US6230753B1 (en) 2001-05-15
AU4977799A (en) 2000-02-01
WO2000003419A3 (en) 2000-08-24
JP2002520846A (ja) 2002-07-09
IL140682A0 (en) 2002-02-10
CN1312953A (zh) 2001-09-12
KR20010071804A (ko) 2001-07-31
EP1099240A2 (en) 2001-05-16
WO2000003419A2 (en) 2000-01-20

Similar Documents

Publication Publication Date Title
US6230753B1 (en) Wafer cleaning apparatus
US6143089A (en) Method of cleaning semiconductor wafers and other substrates
US11192147B2 (en) Substrate processing apparatus and substrate processing method
US6012470A (en) Method of drying a wafer
EP0843341B1 (en) Apparatus and method for washing substrate
US6167893B1 (en) Dynamic chuck for semiconductor wafer or other substrate
KR101796651B1 (ko) 유체 제트를 구비한 디스크-브러시 세정장치 모듈
JP7644176B2 (ja) 非接触洗浄モジュール
KR20170095748A (ko) 기판 세정 장치 및 기판 처리 장치
JP6073192B2 (ja) 基板洗浄装置、基板洗浄システムおよび基板洗浄方法
JP2002159927A (ja) 基板洗浄装置
JP6568975B2 (ja) テープカートリッジ、スクラバー、および基板処理装置
JPH07161670A (ja) ウェーハハンドリング装置
US20030136431A1 (en) Method and apparatus for cleaning of microelectronic workpieces after chemical-mechanical planarization
CN111799209B (zh) 基板支承装置以及基板支承装置的控制方法
KR100317326B1 (ko) 웨이퍼 배면 세척장치의 웨이퍼 끼임 해제구조
JP2002164318A (ja) 基板スピン装置
JP5026351B2 (ja) 処理装置

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees