DE602005026179D1 - Vorrichtung zum reinigen von schaltungssubstraten - Google Patents

Vorrichtung zum reinigen von schaltungssubstraten

Info

Publication number
DE602005026179D1
DE602005026179D1 DE602005026179T DE602005026179T DE602005026179D1 DE 602005026179 D1 DE602005026179 D1 DE 602005026179D1 DE 602005026179 T DE602005026179 T DE 602005026179T DE 602005026179 T DE602005026179 T DE 602005026179T DE 602005026179 D1 DE602005026179 D1 DE 602005026179D1
Authority
DE
Germany
Prior art keywords
cleaning
wafer
central region
rotary brushes
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005026179T
Other languages
English (en)
Inventor
Janos Farkas
Srdjan Kordic
Sebastien Petitdidier
Kevin E Cooper
Jan Van-Hassel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
NXP USA Inc
Original Assignee
NXP BV
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV, Freescale Semiconductor Inc filed Critical NXP BV
Publication of DE602005026179D1 publication Critical patent/DE602005026179D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Vehicle Body Suspensions (AREA)
DE602005026179T 2005-04-20 2005-04-20 Vorrichtung zum reinigen von schaltungssubstraten Active DE602005026179D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/005552 WO2006111193A1 (en) 2005-04-20 2005-04-20 Apparatus for cleaning of circuit substrates

Publications (1)

Publication Number Publication Date
DE602005026179D1 true DE602005026179D1 (de) 2011-03-10

Family

ID=35198088

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005026179T Active DE602005026179D1 (de) 2005-04-20 2005-04-20 Vorrichtung zum reinigen von schaltungssubstraten

Country Status (8)

Country Link
US (1) US8752228B2 (de)
EP (1) EP1875490B1 (de)
JP (1) JP2008537346A (de)
CN (1) CN100576428C (de)
AT (1) ATE497255T1 (de)
DE (1) DE602005026179D1 (de)
TW (1) TW200735192A (de)
WO (1) WO2006111193A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005026179D1 (de) 2005-04-20 2011-03-10 Freescale Semiconductor Inc Vorrichtung zum reinigen von schaltungssubstraten
CN102194653B (zh) * 2010-03-11 2013-02-13 中芯国际集成电路制造(上海)有限公司 晶片清洗装置
US8340363B2 (en) 2010-05-27 2012-12-25 Palo Alto Research Center Incorporated System and method for efficient interpretation of images in terms of objects and their parts
JP5833959B2 (ja) * 2011-09-28 2015-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2014094341A (ja) * 2012-11-08 2014-05-22 Sony Corp 清掃装置
US9857680B2 (en) * 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
CN104941959B (zh) * 2014-03-27 2020-05-19 海德堡印刷机械股份公司 利用胶条去除硬化的墨、涂料或漆的方法
JP6554864B2 (ja) * 2015-03-30 2019-08-07 大日本印刷株式会社 ペリクル接着剤除去装置及びペリクル接着剤除去方法
CN106298440A (zh) * 2015-05-15 2017-01-04 南京瀚宇彩欣科技有限责任公司 基板的清洁模块与方法
US11145521B2 (en) * 2017-09-28 2021-10-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method for cleaning a semiconductor substrate
CN111854428A (zh) * 2019-04-29 2020-10-30 伊利诺斯工具制品有限公司 带清洁装置及具有带清洁装置的烧结炉
US20230064958A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing

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JPS5499374A (en) 1978-01-23 1979-08-06 Toshiba Corp Wedge-pace type bulb
US4744833A (en) 1987-06-11 1988-05-17 International Business Machines Corporation Electrostatic removal of contaminants
JPH0388330A (ja) 1989-08-30 1991-04-12 Nec Yamagata Ltd ブラシスクラバー
JPH03165902A (ja) 1989-11-24 1991-07-17 Kawasaki Steel Corp 搬送ロールの付着塵埃除去方法
JPH0828334B2 (ja) 1992-11-30 1996-03-21 株式会社半導体プロセス研究所 半導体装置の製造装置及びその使用方法
JPH06304537A (ja) 1993-04-21 1994-11-01 Amitec Corp 除塵装置
JP2600587B2 (ja) * 1993-10-05 1997-04-16 日本電気株式会社 半導体洗浄装置
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
US5884640A (en) 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
JP3343503B2 (ja) 1997-12-12 2002-11-11 東京エレクトロン株式会社 洗浄装置
EP1064321A1 (de) 1998-03-13 2001-01-03 The Procter & Gamble Company Abriebfester polymerschaum und daraus hergestellte fleckentferner
JPH11347499A (ja) 1998-06-05 1999-12-21 Toshiba Corp 洗浄器具及び半導体ウェーハ洗浄装置並びに半導体ウェーハの洗浄方法
JP2000077379A (ja) 1998-09-03 2000-03-14 Toshiba Mach Co Ltd ブラシ洗浄装置
DE19904548C2 (de) 1999-02-04 2001-07-05 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
JP2000305402A (ja) 1999-04-22 2000-11-02 Kureha Ltd 回転ローラ用クリーニング装置
JP4099292B2 (ja) 1999-07-01 2008-06-11 芝浦メカトロニクス株式会社 基板のクリーニング装置
US6240588B1 (en) 1999-12-03 2001-06-05 Lam Research Corporation Wafer scrubbing brush core
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2002023143A (ja) 2000-07-05 2002-01-23 Seiko Epson Corp 液晶装置用異物除去装置及びその方法
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2003163196A (ja) 2001-11-28 2003-06-06 Kaijo Corp 半導体基板の基板洗浄装置及び洗浄方法
US6616516B1 (en) 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US7007333B1 (en) * 2002-06-28 2006-03-07 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
DE602005026179D1 (de) 2005-04-20 2011-03-10 Freescale Semiconductor Inc Vorrichtung zum reinigen von schaltungssubstraten
US7115023B1 (en) * 2005-06-29 2006-10-03 Lam Research Corporation Process tape for cleaning or processing the edge of a semiconductor wafer

Also Published As

Publication number Publication date
EP1875490A1 (de) 2008-01-09
EP1875490B1 (de) 2011-01-26
JP2008537346A (ja) 2008-09-11
US20080271274A1 (en) 2008-11-06
ATE497255T1 (de) 2011-02-15
US8752228B2 (en) 2014-06-17
WO2006111193A1 (en) 2006-10-26
TW200735192A (en) 2007-09-16
CN100576428C (zh) 2009-12-30
CN101203937A (zh) 2008-06-18

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