IL138173A - PN junction from diamond to diode and method of forming it - Google Patents
PN junction from diamond to diode and method of forming itInfo
- Publication number
- IL138173A IL138173A IL13817300A IL13817300A IL138173A IL 138173 A IL138173 A IL 138173A IL 13817300 A IL13817300 A IL 13817300A IL 13817300 A IL13817300 A IL 13817300A IL 138173 A IL138173 A IL 138173A
- Authority
- IL
- Israel
- Prior art keywords
- film layer
- diamond thin
- diamond
- type
- thin
- Prior art date
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 232
- 239000010432 diamond Substances 0.000 title claims abstract description 232
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims description 54
- 239000010409 thin film Substances 0.000 claims abstract description 183
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000005468 ion implantation Methods 0.000 claims abstract description 40
- 239000012535 impurity Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims description 10
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 230000005284 excitation Effects 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 22
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 22
- 239000007789 gas Substances 0.000 description 19
- 229910002804 graphite Inorganic materials 0.000 description 18
- 239000010439 graphite Substances 0.000 description 18
- 229910052717 sulfur Inorganic materials 0.000 description 17
- 239000011593 sulfur Substances 0.000 description 17
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000004020 luminiscence type Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 sulfur ions Chemical class 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 150000003463 sulfur Chemical class 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical compound CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/34—Materials of the light emitting region containing only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1602—Diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
- H01L29/66022—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6603—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66136—PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/3027—IV compounds
- H01S5/3045—IV compounds diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24488399A JP3138705B1 (ja) | 1999-08-31 | 1999-08-31 | ダイヤモンドｐｎ接合ダイオードおよびその作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL138173A0 IL138173A0 (en) | 2001-10-31 |
| IL138173A true IL138173A (en) | 2004-09-27 |
Family
ID=17125415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13817300A IL138173A (en) | 1999-08-31 | 2000-08-30 | PN junction from diamond to diode and method of forming it |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6727171B2 (ja) |
| EP (1) | EP1081747B1 (ja) |
| JP (1) | JP3138705B1 (ja) |
| DE (1) | DE60035747T2 (ja) |
| IL (1) | IL138173A (ja) |
| ZA (1) | ZA200004518B (ja) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3411989B2 (ja) * | 2000-03-28 | 2003-06-03 | 独立行政法人産業技術総合研究所 | ダイヤモンド半導体発光素子 |
| JP2003321296A (ja) * | 2002-04-25 | 2003-11-11 | Shin Etsu Chem Co Ltd | ダイヤモンド膜及びその製造方法 |
| JP2004095958A (ja) * | 2002-09-02 | 2004-03-25 | National Institute For Materials Science | 深紫外線センサー |
| JP2004103649A (ja) * | 2002-09-05 | 2004-04-02 | Toyota Motor Corp | 熱光発電用光電変換素子 |
| US7224532B2 (en) * | 2002-12-06 | 2007-05-29 | Chevron U.S.A. Inc. | Optical uses diamondoid-containing materials |
| CN100456490C (zh) * | 2003-11-25 | 2009-01-28 | 住友电气工业株式会社 | 金刚石n型半导体及其制造方法、半导体元件及电子发射元件 |
| JP4068048B2 (ja) * | 2003-11-25 | 2008-03-26 | 株式会社東芝 | 発光素子及びこれを用いた発光装置 |
| KR20060122868A (ko) * | 2003-11-25 | 2006-11-30 | 스미토모덴키고교가부시키가이샤 | 다이아몬드 ｎ형 반도체, 그의 제조 방법, 반도체 소자 및전자 방출 소자 |
| KR100644929B1 (ko) * | 2004-03-04 | 2006-11-13 | 한국원자력연구소 | 이온주입과 열처리에 의한 발색된 다이아몬드의 제조방법 |
| US8124509B2 (en) * | 2004-05-28 | 2012-02-28 | Intel Corporation | Method of forming porous diamond films for semiconductor applications |
| US20060017055A1 (en) * | 2004-07-23 | 2006-01-26 | Eastman Kodak Company | Method for manufacturing a display device with low temperature diamond coatings |
| JP4691722B2 (ja) * | 2004-12-15 | 2011-06-01 | 独立行政法人産業技術総合研究所 | ダイヤモンド半導体発光素子 |
| US7714300B1 (en) * | 2006-06-27 | 2010-05-11 | Kla-Tencor Technologies Corporation | High-speed high-efficiency solid-state electron detector |
| JP5273635B2 (ja) * | 2006-08-25 | 2013-08-28 | 独立行政法人産業技術総合研究所 | 高効率間接遷移型半導体紫外線発光素子 |
| JP5565895B2 (ja) * | 2008-03-26 | 2014-08-06 | 日産自動車株式会社 | 半導体装置 |
| US20130026492A1 (en) * | 2011-07-30 | 2013-01-31 | Akhan Technologies Inc. | Diamond Semiconductor System and Method |
| JP6257459B2 (ja) * | 2014-06-23 | 2018-01-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
| DE102018209549A1 (de) * | 2018-06-14 | 2019-12-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | UV-Strahlungssensor auf Basis von Diamant |
| GB202002558D0 (en) * | 2020-02-24 | 2020-04-08 | Ucl Business Ltd | Electronic device |
| CN111613728B (zh) * | 2020-05-15 | 2021-03-09 | 山西绿能光电科技有限公司 | 一种提高钙钛矿太阳能电池的空穴吸收层耐腐蚀性的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036373A (en) * | 1989-06-01 | 1991-07-30 | Semiconductor Energy Laboratory Co., Ltd. | Electric device with grains and an insulating layer |
| JPH03163820A (ja) * | 1989-11-22 | 1991-07-15 | Tokai Univ | ダイヤモンドｎ型半導体およびダイヤモンドｐ―ｎ接合ダイオードの製造方法 |
| JPH03214780A (ja) * | 1990-01-19 | 1991-09-19 | Sumitomo Electric Ind Ltd | 高周波素子 |
| DE69117077T2 (de) * | 1990-03-06 | 1996-06-27 | Sumitomo Electric Industries | Verfahren zum Aufwachsen einer Dünnschicht aus Diamant oder c-BN |
| JP2730271B2 (ja) * | 1990-03-07 | 1998-03-25 | 住友電気工業株式会社 | 半導体装置 |
| US5281831A (en) * | 1990-10-31 | 1994-01-25 | Kabushiki Kaisha Toshiba | Optical semiconductor device |
| JP4071833B2 (ja) * | 1993-09-10 | 2008-04-02 | 住友電気工業株式会社 | ダイヤモンド半導体デバイス |
| JP3584450B2 (ja) * | 1995-03-17 | 2004-11-04 | 住友電気工業株式会社 | レーザー発振素子及びレーザー発振装置 |
| DE19723176C1 (de) * | 1997-06-03 | 1998-08-27 | Daimler Benz Ag | Leistungshalbleiter-Bauelement und Verfahren zu dessen Herstellung |
-
1999
- 1999-08-31 JP JP24488399A patent/JP3138705B1/ja not_active Expired - Lifetime
-
2000
- 2000-08-30 IL IL13817300A patent/IL138173A/en not_active IP Right Cessation
- 2000-08-30 DE DE60035747T patent/DE60035747T2/de not_active Expired - Lifetime
- 2000-08-30 EP EP00307456A patent/EP1081747B1/en not_active Expired - Lifetime
- 2000-08-30 ZA ZA200004518A patent/ZA200004518B/xx unknown
-
2003
- 2003-02-20 US US10/368,482 patent/US6727171B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE60035747T2 (de) | 2008-04-30 |
| ZA200004518B (en) | 2001-02-28 |
| US6727171B2 (en) | 2004-04-27 |
| JP2001068687A (ja) | 2001-03-16 |
| EP1081747A1 (en) | 2001-03-07 |
| US20030155654A1 (en) | 2003-08-21 |
| JP3138705B1 (ja) | 2001-02-26 |
| IL138173A0 (en) | 2001-10-31 |
| DE60035747D1 (de) | 2007-09-13 |
| EP1081747B1 (en) | 2007-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |