IL137977A0 - Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric - Google Patents

Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

Info

Publication number
IL137977A0
IL137977A0 IL13797799A IL13797799A IL137977A0 IL 137977 A0 IL137977 A0 IL 137977A0 IL 13797799 A IL13797799 A IL 13797799A IL 13797799 A IL13797799 A IL 13797799A IL 137977 A0 IL137977 A0 IL 137977A0
Authority
IL
Israel
Prior art keywords
fabric
assembling
methods
glass fiber
electronic circuit
Prior art date
Application number
IL13797799A
Other languages
English (en)
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of IL137977A0 publication Critical patent/IL137977A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Woven Fabrics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laser Surgery Devices (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
IL13797799A 1998-03-03 1999-02-25 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric IL137977A0 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13
PCT/US1999/004086 WO1999044959A1 (en) 1998-03-03 1999-02-25 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

Publications (1)

Publication Number Publication Date
IL137977A0 true IL137977A0 (en) 2001-10-31

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13797799A IL137977A0 (en) 1998-03-03 1999-02-25 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

Country Status (16)

Country Link
EP (1) EP1060144A1 (id)
JP (1) JP2002505216A (id)
KR (1) KR20010041518A (id)
CN (1) CN1291963A (id)
AU (1) AU2788999A (id)
BR (1) BR9908520A (id)
CA (1) CA2320746A1 (id)
HU (1) HUP0101382A3 (id)
ID (1) ID26528A (id)
IL (1) IL137977A0 (id)
MX (2) MXPA00008517A (id)
NO (1) NO20004272L (id)
PL (1) PL342654A1 (id)
TR (1) TR200002520T2 (id)
TW (1) TW436422B (id)
WO (1) WO1999044959A1 (id)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA01003660A (es) * 1999-07-30 2001-07-01 Torones de fibra de vidrio impregnados y productos que los inclu
EP1204613A1 (en) * 1999-07-30 2002-05-15 PPG Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
JP2004500488A (ja) * 1999-07-30 2004-01-08 ピーピージー　インダストリーズ　オハイオ，　インコーポレイテッド 含浸ガラス繊維ストランドおよび同ストランドを含む製品
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
WO2001068748A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001249257A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068749A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252915A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068755A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (ja) 2006-11-13 2012-10-17 信越石英株式会社 複合織物及びプリント配線基板
DE102009045892A1 (de) * 2009-10-21 2011-04-28 Evonik Degussa Gmbh Folie aus Polyarylenetherketon
KR101890915B1 (ko) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 폴리아릴렌 설파이드계 수지 조성물 및 성형품
CN103788583B (zh) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 一种耐高温抗静电人造合成石及其制造工艺
FR3020361B1 (fr) * 2014-04-28 2016-05-06 Saint Gobain Procede de fabrication de verre mince
JPWO2017077980A1 (ja) * 2015-11-02 2018-08-23 セントラル硝子株式会社 電磁遮蔽性金属被覆ガラス繊維フィラー、電磁遮蔽性金属被覆ガラス繊維フィラーの製造方法、及び、電磁遮蔽性樹脂物品
CN105517324B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层基板结构
CN105517323B (zh) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 印刷电路板的负载导体图案的叠层板
CN105517322B (zh) * 2015-11-30 2018-08-14 卢美珍 印刷电路板的织物基层覆金属的叠板结构
CN105517321B (zh) * 2015-11-30 2018-06-19 燕山大学里仁学院 电子元件封装体的覆金属层基板结构
CN105517325B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层叠板结构
CN105517332B (zh) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 一种用于多层压合的粘结片及其制备方法
JP7395476B2 (ja) * 2017-08-07 2023-12-11 ゾルテック コーポレイション プラスチックを強化するためのポリビニルアルコールでサイジング処理されたフィラー
CN110981223B (zh) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 一种耐高温玻璃纤维及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
ID26528A (id) 2001-01-11
WO1999044959A1 (en) 1999-09-10
HUP0101382A2 (hu) 2001-08-28
AU2788999A (en) 1999-09-20
MXPA00008554A (es) 2001-03-01
EP1060144A1 (en) 2000-12-20
HUP0101382A3 (en) 2002-10-28
NO20004272L (no) 2000-11-01
CA2320746A1 (en) 1999-09-10
TR200002520T2 (tr) 2001-01-22
NO20004272D0 (no) 2000-08-25
PL342654A1 (en) 2001-07-02
TW436422B (en) 2001-05-28
MXPA00008517A (es) 2001-03-01
CN1291963A (zh) 2001-04-18
KR20010041518A (ko) 2001-05-25
JP2002505216A (ja) 2002-02-19
BR9908520A (pt) 2000-10-24

Similar Documents

Publication Publication Date Title
IL137977A0 (en) Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric
AU6391499A (en) Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
HUP0200426A2 (en) Method for manufacturing a multilayer printed circuit board and composite foil for use therein
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
AU6483199A (en) Electronic circuit board
HK1030398A1 (en) Metal laminate for a circuit board.
HUP0100338A3 (en) Method for connecting electronic components to a substrate, and a method for checking such a connection
EP1229769A4 (en) CARRIER FILM WITH COPPER GUIDE RAILS, METHOD TO MAKE A PCB WITH THE USE OF SUPPORT FILMS AND PCB
AU2002214241A1 (en) Multi-layer printed circuit board fabrication system and method
EP0621746A3 (en) Composite circuit board and process for its manufacture.
IL142354A0 (en) Multi-layer printed circuit board fabrication system and method
SG71716A1 (en) Multilayer printed circuit boards
HK1048666B (zh) 印刷線路板
SG74116A1 (en) Composite copper foil process for preparing the same and copper-clad laminate and printed wiring board using the same
GB0024401D0 (en) Printed circuit board
GB9721706D0 (en) Printed circuit boards
GB0001573D0 (en) Printed circuit board with fuse
GB9820932D0 (en) Circuit board and connection method
SG91842A1 (en) Printed circuit board with shielded circuitry
HK1066321A1 (en) Printed circuit boards with plated resistors and process for the manufacturing the same
GB2337862B (en) Printed circuit board
PL343028A1 (en) Base webs for printed circuit board production using the foam process and aramid fibers
SG85102A1 (en) Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same
EP0669793A3 (en) Method of manufacturing a printed circuit board.