IL133722A - Methods and apparatus for improving microloading while etching a substrate - Google Patents

Methods and apparatus for improving microloading while etching a substrate

Info

Publication number
IL133722A
IL133722A IL13372298A IL13372298A IL133722A IL 133722 A IL133722 A IL 133722A IL 13372298 A IL13372298 A IL 13372298A IL 13372298 A IL13372298 A IL 13372298A IL 133722 A IL133722 A IL 133722A
Authority
IL
Israel
Prior art keywords
microloading
data set
power supply
power
trench width
Prior art date
Application number
IL13372298A
Other languages
English (en)
Other versions
IL133722A0 (en
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of IL133722A0 publication Critical patent/IL133722A0/xx
Publication of IL133722A publication Critical patent/IL133722A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0203—Protection arrangements
    • H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
IL13372298A 1997-06-27 1998-06-24 Methods and apparatus for improving microloading while etching a substrate IL133722A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/883,860 US6087266A (en) 1997-06-27 1997-06-27 Methods and apparatus for improving microloading while etching a substrate
PCT/US1998/013443 WO1999000832A1 (en) 1997-06-27 1998-06-24 Methods and apparatus for improving microloading while etching a substrate

Publications (2)

Publication Number Publication Date
IL133722A0 IL133722A0 (en) 2001-04-30
IL133722A true IL133722A (en) 2003-05-29

Family

ID=25383476

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13372298A IL133722A (en) 1997-06-27 1998-06-24 Methods and apparatus for improving microloading while etching a substrate

Country Status (9)

Country Link
US (1) US6087266A (ja)
EP (1) EP0993685B1 (ja)
JP (1) JP4384731B2 (ja)
KR (1) KR100542665B1 (ja)
AT (1) ATE371264T1 (ja)
DE (1) DE69838292T2 (ja)
IL (1) IL133722A (ja)
TW (1) TW447038B (ja)
WO (1) WO1999000832A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492281B1 (en) * 2000-09-22 2002-12-10 Advanced Micro Devices, Inc. Method of fabricating conductor structures with metal comb bridging avoidance
US6495469B1 (en) 2001-12-03 2002-12-17 Taiwan Semiconductor Manufacturing Company High selectivity, low etch depth micro-loading process for non stop layer damascene etch
JP3857707B2 (ja) * 2002-09-11 2006-12-13 富士通株式会社 光デバイスの製造方法
US7767508B2 (en) * 2006-10-16 2010-08-03 Advanced Micro Devices, Inc. Method for forming offset spacers for semiconductor device arrangements
CN102420124B (zh) * 2011-05-26 2014-04-02 上海华力微电子有限公司 一种介质层刻蚀方法
US10069490B2 (en) * 2016-02-02 2018-09-04 Globalfoundries Inc. Method, apparatus and system for voltage compensation in a semiconductor wafer

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4267012A (en) * 1979-04-30 1981-05-12 Fairchild Camera & Instrument Corp. Process for patterning metal connections on a semiconductor structure by using a tungsten-titanium etch resistant layer
US4740485A (en) * 1986-07-22 1988-04-26 Monolithic Memories, Inc. Method for forming a fuse
US4878994A (en) * 1987-07-16 1989-11-07 Texas Instruments Incorporated Method for etching titanium nitride local interconnects
DE3842758A1 (de) * 1988-12-19 1990-06-21 Siemens Ag Verfahren zum aetzen einer dreilagigen verdrahtungsebene bei der herstellung integrierter halbleiterschaltungen
JP2528962B2 (ja) * 1989-02-27 1996-08-28 株式会社日立製作所 試料処理方法及び装置
US5429070A (en) * 1989-06-13 1995-07-04 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4980018A (en) * 1989-11-14 1990-12-25 Intel Corporation Plasma etching process for refractory metal vias
JP2519364B2 (ja) * 1990-12-03 1996-07-31 アプライド マテリアルズ インコーポレイテッド Ｕｈｆ／ｖｈｆ共振アンテナ供給源を用いたプラズマリアクタ
US5217570A (en) * 1991-01-31 1993-06-08 Sony Corporation Dry etching method
KR100293830B1 (ko) * 1992-06-22 2001-09-17 리차드 에이치. 로브그렌 플라즈마 처리 쳄버내의 잔류물 제거를 위한 플라즈마 정결방법
US5256245A (en) * 1992-08-11 1993-10-26 Micron Semiconductor, Inc. Use of a clean up step to form more vertical profiles of polycrystalline silicon sidewalls during the manufacture of a semiconductor device
US5326427A (en) * 1992-09-11 1994-07-05 Lsi Logic Corporation Method of selectively etching titanium-containing materials on a semiconductor wafer using remote plasma generation
JPH06151382A (ja) * 1992-11-11 1994-05-31 Toshiba Corp ドライエッチング方法
US5387556A (en) * 1993-02-24 1995-02-07 Applied Materials, Inc. Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub.2
US5545289A (en) * 1994-02-03 1996-08-13 Applied Materials, Inc. Passivating, stripping and corrosion inhibition of semiconductor substrates
JP2809087B2 (ja) * 1994-02-15 1998-10-08 日本電気株式会社 配線形成方法
US5562801A (en) * 1994-04-28 1996-10-08 Cypress Semiconductor Corporation Method of etching an oxide layer
US5620615A (en) * 1994-05-13 1997-04-15 Micron Technology, Inc. Method of etching or removing W and WSix films
US5496762A (en) * 1994-06-02 1996-03-05 Micron Semiconductor, Inc. Highly resistive structures for integrated circuits and method of manufacturing the same
US5779926A (en) * 1994-09-16 1998-07-14 Applied Materials, Inc. Plasma process for etching multicomponent alloys
US5783101A (en) * 1994-09-16 1998-07-21 Applied Materials, Inc. High etch rate residue free metal etch process with low frequency high power inductive coupled plasma
US5609775A (en) * 1995-03-17 1997-03-11 Chartered Semiconductor Manufacturing Pte Ltd. Dry etch process for titanium-tungsten films
US6017825A (en) * 1996-03-29 2000-01-25 Lam Research Corporation Etch rate loading improvement
US5904862A (en) * 1996-06-26 1999-05-18 Lam Research Corporation Methods for etching borophosphosilicate glass
US5883007A (en) * 1996-12-20 1999-03-16 Lam Research Corporation Methods and apparatuses for improving photoresist selectivity and reducing etch rate loading

Also Published As

Publication number Publication date
JP2002507328A (ja) 2002-03-05
WO1999000832A1 (en) 1999-01-07
EP0993685B1 (en) 2007-08-22
KR20010014077A (ko) 2001-02-26
KR100542665B1 (ko) 2006-01-12
TW447038B (en) 2001-07-21
US6087266A (en) 2000-07-11
IL133722A0 (en) 2001-04-30
JP4384731B2 (ja) 2009-12-16
EP0993685A1 (en) 2000-04-19
DE69838292T2 (de) 2008-05-15
DE69838292D1 (de) 2007-10-04
ATE371264T1 (de) 2007-09-15

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