IL123575A - Method and apparatus for alignment of a wafer - Google Patents
Method and apparatus for alignment of a waferInfo
- Publication number
- IL123575A IL123575A IL12357598A IL12357598A IL123575A IL 123575 A IL123575 A IL 123575A IL 12357598 A IL12357598 A IL 12357598A IL 12357598 A IL12357598 A IL 12357598A IL 123575 A IL123575 A IL 123575A
- Authority
- IL
- Israel
- Prior art keywords
- wafer
- alignment
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12357598A IL123575A (en) | 1998-03-05 | 1998-03-05 | Method and apparatus for alignment of a wafer |
US09/097,298 US6038029A (en) | 1998-03-05 | 1998-06-12 | Method and apparatus for alignment of a wafer |
DE19908980A DE19908980A1 (de) | 1998-03-05 | 1999-03-02 | Verfahren und Vorrichtung zum Ausrichten eines Wafers |
FR9902623A FR2776421A1 (fr) | 1998-03-05 | 1999-03-03 | Dispositif et procede de fabrication de semi-conducteurs determinant l'alignement d'une galette a la station de fabrication de celle-ci |
JP11058504A JP2000068361A (ja) | 1998-03-05 | 1999-03-05 | 半導体の製造装置及びウェ―ハのアライメント状態を決定する方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12357598A IL123575A (en) | 1998-03-05 | 1998-03-05 | Method and apparatus for alignment of a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
IL123575A0 IL123575A0 (en) | 1998-10-30 |
IL123575A true IL123575A (en) | 2001-08-26 |
Family
ID=11071308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12357598A IL123575A (en) | 1998-03-05 | 1998-03-05 | Method and apparatus for alignment of a wafer |
Country Status (5)
Country | Link |
---|---|
US (1) | US6038029A (fr) |
JP (1) | JP2000068361A (fr) |
DE (1) | DE19908980A1 (fr) |
FR (1) | FR2776421A1 (fr) |
IL (1) | IL123575A (fr) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6115648A (en) * | 1997-09-16 | 2000-09-05 | International Business Machines Corporation | System and method for non-invasive accessor recalibration |
US7295314B1 (en) | 1998-07-10 | 2007-11-13 | Nanometrics Incorporated | Metrology/inspection positioning system |
US6320609B1 (en) * | 1998-07-10 | 2001-11-20 | Nanometrics Incorporated | System using a polar coordinate stage and continuous image rotation to compensate for stage rotation |
JP4722244B2 (ja) * | 1998-07-14 | 2011-07-13 | ノバ・メジャリング・インストルメンツ・リミテッド | 所定のフォトリソグラフィ工程に従って基板を加工する装置 |
US6212961B1 (en) | 1999-02-11 | 2001-04-10 | Nova Measuring Instruments Ltd. | Buffer system for a wafer handling system |
IL128087A (en) * | 1999-01-17 | 2002-04-21 | Nova Measuring Instr Ltd | Buffer station for a wafer handling system |
US20050229725A1 (en) * | 1999-01-17 | 2005-10-20 | Nova Measuring Instruments Ltd. | Buffer system for a wafer handling system |
US6529274B1 (en) * | 1999-05-11 | 2003-03-04 | Micron Technology, Inc. | System for processing semiconductor products |
EP1269521A1 (fr) | 2000-04-07 | 2003-01-02 | Varian Semiconductor Equipment Associates Inc. | DETECTEUR D'ORIENTATION DE TRANCHES DE GaAs |
US6782337B2 (en) * | 2000-09-20 | 2004-08-24 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension an a presence of defects on a specimen |
US6673637B2 (en) * | 2000-09-20 | 2004-01-06 | Kla-Tencor Technologies | Methods and systems for determining a presence of macro defects and overlay of a specimen |
US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
US6806951B2 (en) * | 2000-09-20 | 2004-10-19 | Kla-Tencor Technologies Corp. | Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen |
US6812045B1 (en) | 2000-09-20 | 2004-11-02 | Kla-Tencor, Inc. | Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation |
US6694284B1 (en) | 2000-09-20 | 2004-02-17 | Kla-Tencor Technologies Corp. | Methods and systems for determining at least four properties of a specimen |
DE10102540B4 (de) * | 2001-01-19 | 2013-03-21 | Vistec Semiconductor Systems Jena Gmbh | Anordnung und Verfahren zur Identifikation von Substraten |
US20020114507A1 (en) * | 2001-02-21 | 2002-08-22 | Mark Lynch | Saw alignment technique for array device singulation |
US7112812B2 (en) * | 2001-12-28 | 2006-09-26 | Applied Materials, Inc. | Optical measurement apparatus |
AU2003263737A1 (en) * | 2002-05-16 | 2003-12-02 | Asyst Technologies, Inc. | Pre-aligner |
US7030984B2 (en) * | 2002-05-23 | 2006-04-18 | Therma-Wave, Inc. | Fast wafer positioning method for optical metrology |
US6836690B1 (en) | 2002-07-19 | 2004-12-28 | Nanometrics Incorporated | High precision substrate prealigner |
DE10303459A1 (de) * | 2003-01-29 | 2004-08-19 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Kontrollieren des Randes eines scheibenförmigen Gegenstandes |
EP1625388A1 (fr) * | 2003-05-19 | 2006-02-15 | Micro-Epsilon Messtechnik GmbH & Co. KG | Procede et dispositif pour controler visuellement la qualite d'objets presentant de preference un bord circulaire |
US7106434B1 (en) * | 2003-07-28 | 2006-09-12 | Kla-Tencor Technologies, Inc. | Inspection tool |
KR20050020328A (ko) * | 2003-08-22 | 2005-03-04 | 삼성전자주식회사 | 습식 세정설비의 웨이퍼 이송시스템 |
IL158086A (en) * | 2003-09-24 | 2010-02-17 | Nova Measuring Instr Ltd | Method and system for positioning articles with respect to a processing tool |
AU2003300005A1 (en) | 2003-12-19 | 2005-08-03 | International Business Machines Corporation | Differential critical dimension and overlay metrology apparatus and measurement method |
DE102005032871A1 (de) * | 2005-07-14 | 2007-01-25 | Leopold Kostal Gmbh & Co. Kg | Verfahren zum Bestimmen der absoluten Winkelstellung des Lenkrades eines Kraftfahrzeugs |
KR100825968B1 (ko) | 2006-06-09 | 2008-04-29 | (주)리드 | 평판 디스플레이의 가장자리 검사 장치 |
JP5010881B2 (ja) * | 2006-09-11 | 2012-08-29 | 株式会社日立ハイテクノロジーズ | 検査装置および検査方法 |
FR2934083B1 (fr) * | 2008-07-17 | 2010-09-10 | St Microelectronics Rousset | Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four |
US9476701B2 (en) * | 2013-07-05 | 2016-10-25 | Infineon Technologies Ag | Apparatus for detecting a pre-aligning element at a wafer |
US9796045B2 (en) * | 2013-12-19 | 2017-10-24 | Sunpower Corporation | Wafer alignment with restricted visual access |
JP6286256B2 (ja) * | 2014-03-31 | 2018-02-28 | 株式会社東京精密 | ウエハマーキング・研削装置及びウエハマーキング・研削方法 |
CN104979257B (zh) * | 2014-04-14 | 2021-03-09 | 睿励科学仪器(上海)有限公司 | 用于无图案硅片测量的定位方法 |
JP7516403B2 (ja) | 2019-02-08 | 2024-07-16 | ヤスカワ アメリカ インコーポレイティッド | スルービーム自動ティーチング |
CN114975213B (zh) * | 2022-07-26 | 2022-11-18 | 之江实验室 | 一种晶圆对准装置及对准方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4328553A (en) * | 1976-12-07 | 1982-05-04 | Computervision Corporation | Method and apparatus for targetless wafer alignment |
US4308586A (en) * | 1980-05-02 | 1981-12-29 | Nanometrics, Incorporated | Method for the precise determination of photoresist exposure time |
US4516855A (en) * | 1981-04-03 | 1985-05-14 | International Business Machines Corporation | Method and apparatus for determining the polarization state of a light wave field |
US4585348A (en) * | 1981-09-28 | 1986-04-29 | International Business Machines Corporation | Ultra-fast photometric instrument |
US4475122A (en) * | 1981-11-09 | 1984-10-02 | Tre Semiconductor Equipment Corporation | Automatic wafer alignment technique |
US4555767A (en) * | 1982-05-27 | 1985-11-26 | International Business Machines Corporation | Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance |
JPS59125009A (ja) * | 1982-12-29 | 1984-07-19 | Fujitsu Ltd | パタ−ン検知法 |
US4618262A (en) * | 1984-04-13 | 1986-10-21 | Applied Materials, Inc. | Laser interferometer system and method for monitoring and controlling IC processing |
DE3419463C1 (de) * | 1984-05-24 | 1985-09-12 | Sagax Instrument AB, Sundbyberg | Vorrichtung zur Erfassung von Stoffeigenschaften von Probenoberflaechen |
US4653924A (en) * | 1984-06-12 | 1987-03-31 | Victor Company Of Japan, Ltd. | Rotating analyzer type ellipsometer |
US4681450A (en) * | 1985-06-21 | 1987-07-21 | Research Corporation | Photodetector arrangement for measuring the state of polarization of light |
US4815856A (en) * | 1986-06-05 | 1989-03-28 | Storage Technology Partners Ii | Method and apparatus for measuring the absolute thickness of dust defocus layers |
US5109430A (en) * | 1986-07-22 | 1992-04-28 | Schlumberger Technologies, Inc. | Mask alignment and measurement of critical dimensions in integrated circuits |
US4842410A (en) * | 1986-10-24 | 1989-06-27 | Geo-Centers, Inc. | Apparatus and method utilizing interference fringes to determine the thermal stability of a liquid |
EP0266203B1 (fr) * | 1986-10-30 | 1994-07-06 | Canon Kabushiki Kaisha | Dispositif d'illumination |
US4908508A (en) * | 1987-02-12 | 1990-03-13 | Akzo N.V. | Process and apparatus for determining thicknesses of layers |
US4713140A (en) * | 1987-03-02 | 1987-12-15 | International Business Machines Corporation | Laser luminescence monitor for material thickness |
JPS6454207A (en) * | 1987-08-25 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Optical measuring apparatus of film thickness |
KR960016175B1 (en) * | 1987-08-28 | 1996-12-04 | Tokyo Electron Ltd | Exposing method and apparatus thereof |
WO1989006354A1 (fr) * | 1988-01-11 | 1989-07-13 | The Commonwealth Of Australia | Ellipsometre differentiel |
US4826321A (en) * | 1988-03-14 | 1989-05-02 | Nanometrics, Incorporated | Thin dielectric film measuring system |
JPH0224502A (ja) * | 1988-07-12 | 1990-01-26 | Dainippon Screen Mfg Co Ltd | 膜厚測定方法 |
US4873430A (en) * | 1988-10-25 | 1989-10-10 | International Business Machines Corporation | Method and apparatus for optically measuring characteristics of a thin film by directing a P-polarized beam through an integrating sphere at the brewster's angle of the film |
US4957368A (en) * | 1989-03-16 | 1990-09-18 | Photoacoustic Technology, Inc. | Apparatus and process for performing ellipsometric measurements of surfaces |
US4999014A (en) * | 1989-05-04 | 1991-03-12 | Therma-Wave, Inc. | Method and apparatus for measuring thickness of thin films |
US5042951A (en) * | 1989-09-19 | 1991-08-27 | Therma-Wave, Inc. | High resolution ellipsometric apparatus |
US5166752A (en) * | 1990-01-11 | 1992-11-24 | Rudolph Research Corporation | Simultaneous multiple angle/multiple wavelength ellipsometer and method |
US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
JP2928331B2 (ja) * | 1990-05-14 | 1999-08-03 | 東京エレクトロン株式会社 | プローバのアライメント装置及び方法 |
JP2927934B2 (ja) * | 1990-11-16 | 1999-07-28 | 株式会社リコー | 薄膜測定方法および装置 |
IL96483A (en) * | 1990-11-27 | 1995-07-31 | Orbotech Ltd | Optical inspection method and apparatus |
US5159412A (en) * | 1991-03-15 | 1992-10-27 | Therma-Wave, Inc. | Optical measurement device with enhanced sensitivity |
US5181080A (en) * | 1991-12-23 | 1993-01-19 | Therma-Wave, Inc. | Method and apparatus for evaluating the thickness of thin films |
JP2760918B2 (ja) * | 1992-02-03 | 1998-06-04 | 大日本スクリーン製造株式会社 | ノッチ付ウエハの位置検出装置 |
DE69226511T2 (de) * | 1992-03-05 | 1999-01-28 | Micronic Laser Systems Ab, Taeby | Verfahren und Vorrichtung zur Belichtung von Substraten |
US5438413A (en) * | 1993-03-03 | 1995-08-01 | Kla Instruments Corporation | Process for measuring overlay misregistration during semiconductor wafer fabrication |
IL111229A (en) * | 1994-10-10 | 1998-06-15 | Nova Measuring Instr Ltd | Autofocusing microscope |
IL112313A (en) * | 1995-01-11 | 1999-08-17 | Nova Measuring Instr Ltd | Method and apparatus for determining a location on a surface of an object |
US5648854A (en) * | 1995-04-19 | 1997-07-15 | Nikon Corporation | Alignment system with large area search for wafer edge and global marks |
US5825913A (en) * | 1995-07-18 | 1998-10-20 | Cognex Corporation | System for finding the orientation of a wafer |
JPH09306977A (ja) * | 1996-05-14 | 1997-11-28 | Komatsu Ltd | ウエハ検査装置等におけるウエハの位置決め方法 |
-
1998
- 1998-03-05 IL IL12357598A patent/IL123575A/xx not_active IP Right Cessation
- 1998-06-12 US US09/097,298 patent/US6038029A/en not_active Expired - Lifetime
-
1999
- 1999-03-02 DE DE19908980A patent/DE19908980A1/de not_active Withdrawn
- 1999-03-03 FR FR9902623A patent/FR2776421A1/fr active Pending
- 1999-03-05 JP JP11058504A patent/JP2000068361A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2776421A1 (fr) | 1999-09-24 |
US6038029A (en) | 2000-03-14 |
DE19908980A1 (de) | 1999-11-25 |
JP2000068361A (ja) | 2000-03-03 |
IL123575A0 (en) | 1998-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
KB | Patent renewed | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees | ||
MM9K | Patent not in force due to non-payment of renewal fees |