FR2934083B1 - Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four - Google Patents
Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un fourInfo
- Publication number
- FR2934083B1 FR2934083B1 FR0804063A FR0804063A FR2934083B1 FR 2934083 B1 FR2934083 B1 FR 2934083B1 FR 0804063 A FR0804063 A FR 0804063A FR 0804063 A FR0804063 A FR 0804063A FR 2934083 B1 FR2934083 B1 FR 2934083B1
- Authority
- FR
- France
- Prior art keywords
- oven
- adjusting
- semiconductor wafer
- deposition position
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0804063A FR2934083B1 (fr) | 2008-07-17 | 2008-07-17 | Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four |
US12/504,361 US20100014749A1 (en) | 2008-07-17 | 2009-07-16 | Method and device for adjusting the deposit position of a semiconductor wafer in an oven |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0804063A FR2934083B1 (fr) | 2008-07-17 | 2008-07-17 | Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2934083A1 FR2934083A1 (fr) | 2010-01-22 |
FR2934083B1 true FR2934083B1 (fr) | 2010-09-10 |
Family
ID=39870111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0804063A Expired - Fee Related FR2934083B1 (fr) | 2008-07-17 | 2008-07-17 | Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100014749A1 (fr) |
FR (1) | FR2934083B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102362654B1 (ko) | 2015-07-03 | 2022-02-15 | 삼성전자주식회사 | 오븐 |
DE102018101010A1 (de) | 2017-09-25 | 2019-03-28 | X-Fab Semiconductor Foundries Ag | Echtzeit Monitoring eines Mehrzonen-Vertikalofens mit frühzeitiger Erkennung eines Ausfalls eines Heizzonen-Elements |
US11876036B2 (en) | 2020-06-18 | 2024-01-16 | The Research Foundation For The State University Of New York | Fluid cooling system including embedded channels and cold plates |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL123575A (en) * | 1998-03-05 | 2001-08-26 | Nova Measuring Instr Ltd | Method and apparatus for alignment of a wafer |
US7109483B2 (en) * | 2000-11-17 | 2006-09-19 | Ebara Corporation | Method for inspecting substrate, substrate inspecting system and electron beam apparatus |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US7054477B2 (en) * | 2002-11-13 | 2006-05-30 | Uni-Tek System, Inc. | Automatic accurate alignment method for a semiconductor wafer cutting apparatus |
KR100717282B1 (ko) * | 2006-02-06 | 2007-05-15 | 삼성전자주식회사 | 반송장치의 위치 교정 방법 및 툴 |
JP4887913B2 (ja) * | 2006-06-02 | 2012-02-29 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
-
2008
- 2008-07-17 FR FR0804063A patent/FR2934083B1/fr not_active Expired - Fee Related
-
2009
- 2009-07-16 US US12/504,361 patent/US20100014749A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20100014749A1 (en) | 2010-01-21 |
FR2934083A1 (fr) | 2010-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150331 |