IL123409A - Imaging system and method - Google Patents
Imaging system and methodInfo
- Publication number
- IL123409A IL123409A IL12340996A IL12340996A IL123409A IL 123409 A IL123409 A IL 123409A IL 12340996 A IL12340996 A IL 12340996A IL 12340996 A IL12340996 A IL 12340996A IL 123409 A IL123409 A IL 123409A
- Authority
- IL
- Israel
- Prior art keywords
- imaging
- imaging device
- support
- tile
- mounting
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 414
- 238000000034 method Methods 0.000 title claims description 15
- 230000001066 destructive effect Effects 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009659 non-destructive testing Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 210000000038 chest Anatomy 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000009607 mammography Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000003325 tomography Methods 0.000 description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 1
- KKQWHYGECTYFIA-UHFFFAOYSA-N 2,5-dichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1 KKQWHYGECTYFIA-UHFFFAOYSA-N 0.000 description 1
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011976 chest X-ray Methods 0.000 description 1
- 238000002591 computed tomography Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009206 nuclear medicine Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14661—X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Measurement Of Radiation (AREA)
- Traffic Control Systems (AREA)
- Closed-Circuit Television Systems (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Air Bags (AREA)
- Vehicle Body Suspensions (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9517608A GB2305095A (en) | 1995-08-29 | 1995-08-29 | Imaging system with support for imaging devices |
| GB9605978A GB2305096B (en) | 1995-08-29 | 1996-03-21 | Imaging system and method |
| PCT/EP1996/003559 WO1997008751A1 (en) | 1995-08-29 | 1996-08-08 | Imaging system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL123409A0 IL123409A0 (en) | 1998-09-24 |
| IL123409A true IL123409A (en) | 2001-11-25 |
Family
ID=26307642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL12340996A IL123409A (en) | 1995-08-29 | 1996-08-08 | Imaging system and method |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US5955733A (ja) |
| EP (1) | EP0847596B1 (ja) |
| JP (1) | JP3912797B2 (ja) |
| CN (1) | CN1139124C (ja) |
| AT (1) | ATE258718T1 (ja) |
| AU (1) | AU698261B2 (ja) |
| DE (1) | DE69631426T2 (ja) |
| GB (1) | GB2305096B (ja) |
| IL (1) | IL123409A (ja) |
| NO (1) | NO980490L (ja) |
| WO (1) | WO1997008751A1 (ja) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045411A1 (en) * | 1997-02-18 | 1999-09-10 | Simage Oy | Semiconductor imaging device |
| GB2332608B (en) * | 1997-12-18 | 2000-09-06 | Simage Oy | Modular imaging apparatus |
| GB2332562B (en) * | 1997-12-18 | 2000-01-12 | Simage Oy | Hybrid semiconductor imaging device |
| GB2374726A (en) * | 2001-04-20 | 2002-10-23 | Kingpak Tech Inc | Stacked structure of an image sensor having image sensing chip located above integrated circuit |
| US7189971B2 (en) * | 2002-02-15 | 2007-03-13 | Oy Ajat Ltd | Radiation imaging device and system |
| US7223981B1 (en) | 2002-12-04 | 2007-05-29 | Aguila Technologies Inc. | Gamma ray detector modules |
| US7492857B2 (en) * | 2002-12-19 | 2009-02-17 | General Electric Company | Self-aligning scintillator-collimator assembly |
| US7177387B2 (en) * | 2003-11-29 | 2007-02-13 | General Electric Company | Self-aligning scintillator-collimator assembly |
| US7190759B2 (en) * | 2002-12-19 | 2007-03-13 | General Electric Company | Support structure for Z-extensible CT detectors and methods of making same |
| JP2007506961A (ja) | 2003-09-24 | 2007-03-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 画素化した検出器のための位置合わせ方法及び装置 |
| US7235790B2 (en) * | 2004-02-17 | 2007-06-26 | Ge Medical Systems Global Technology Company, Llc | Methods and apparatus for radiation detection |
| DE102004044901A1 (de) * | 2004-09-14 | 2006-03-30 | Siemens Ag | Detektor, aufweisend ein Detektorgehäuse und mehere Detektormodule und Computertomographiegerät mit einem solchen Detektor |
| JP4440749B2 (ja) * | 2004-11-02 | 2010-03-24 | ローム株式会社 | 画像読み取り装置 |
| DE102004057533B4 (de) | 2004-11-29 | 2007-12-27 | Siemens Ag | Detektor mit mehreren Detektorriegeln und Computertomographiegerät mit einem solchen Detektor |
| JP5128052B2 (ja) * | 2005-04-22 | 2013-01-23 | 浜松ホトニクス株式会社 | 光検出ユニット、光検出装置、及びｘ線断層撮像装置 |
| US9332950B2 (en) | 2005-05-02 | 2016-05-10 | Oy Ajat Ltd. | Radiation imaging device with irregular rectangular shape and extraoral dental imaging system therefrom |
| CN100559584C (zh) * | 2005-05-02 | 2009-11-11 | 日本先进系统株式会社 | 具有插口功能的半导体插件、半导体组件、电子电路组件以及带插口的电路基板 |
| US7742560B2 (en) | 2005-05-02 | 2010-06-22 | Oy Ajat Ltd. | Radiation imaging device with irregular rectangular shape and extraoral dental imaging system therefrom |
| CN101685072B (zh) * | 2008-09-28 | 2011-05-11 | 同方威视技术股份有限公司 | 用于辐射成像的探测器模块及具有其的辐射成像检查系统 |
| US7795573B2 (en) * | 2008-11-17 | 2010-09-14 | Teledyne Scientific & Imaging, Llc | Detector with mounting hub to isolate temperature induced strain and method of fabricating the same |
| CN102246057A (zh) * | 2008-12-10 | 2011-11-16 | 皇家飞利浦电子股份有限公司 | 用作可缩放pet和spect系统构建块的自主探测器模块 |
| US8117741B2 (en) * | 2009-04-07 | 2012-02-21 | Oy Ajat Ltd | Method for manufacturing a radiation imaging panel comprising imaging tiles |
| US9158369B2 (en) * | 2010-10-12 | 2015-10-13 | Tactonic Technologies, Llc | Sensors having a connecting frame and method for composite sensors |
| JP2014150087A (ja) * | 2013-01-31 | 2014-08-21 | Kyocer Slc Technologies Corp | 配線基板 |
| JP2015053418A (ja) * | 2013-09-09 | 2015-03-19 | 株式会社東芝 | 半導体製造装置 |
| DE102015115812A1 (de) * | 2015-09-18 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Bauelement sowie Verfahren zur Herstellung eines Bauelements |
| JP6776024B2 (ja) * | 2016-06-30 | 2020-10-28 | キヤノンメディカルシステムズ株式会社 | Ｘ線検出器、ｘ線検出器モジュール、支持部材及びｘ線ｃｔ装置 |
| US9953909B2 (en) * | 2016-07-18 | 2018-04-24 | Intel Corporation | Ball grid array (BGA) with anchoring pins |
| CN112951864B (zh) * | 2021-04-29 | 2022-08-02 | 中国科学院长春光学精密机械与物理研究所 | 一种拼接用图像传感器的窄边柔性封装结构及其封装方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3765431A (en) * | 1969-10-16 | 1973-10-16 | Western Electric Co | Apparatus for handling and maintaining the orientation of a matrix of miniature electrical devices |
| DE2840965C2 (de) * | 1978-09-20 | 1982-11-11 | Siemens AG, 1000 Berlin und 8000 München | Strahlendiagnostikgerät für die Erzeugung von Schichtbildern eines Aufnahmeobjekts |
| US4807000A (en) * | 1987-03-02 | 1989-02-21 | Honeywell Inc. | High density small element optical mosaic detector |
| US4891522A (en) * | 1988-10-11 | 1990-01-02 | Microtronics Associates, Inc. | Modular multi-element high energy particle detector |
| JPH03106528U (ja) * | 1990-02-16 | 1991-11-05 | ||
| US5065245A (en) * | 1990-04-30 | 1991-11-12 | Eastman Kodak Company | Modular image sensor array |
| FR2693033B1 (fr) * | 1992-06-30 | 1994-08-19 | Commissariat Energie Atomique | Dispositif d'imagerie de grande dimension. |
| US5436458A (en) * | 1993-12-06 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Solid state radiation detection panel having tiled photosensitive detectors arranged to minimize edge effects between tiles |
| US5635718A (en) * | 1996-01-16 | 1997-06-03 | Minnesota Mining And Manufacturing Company | Multi-module radiation detecting device and fabrication method |
-
1996
- 1996-03-21 GB GB9605978A patent/GB2305096B/en not_active Expired - Fee Related
- 1996-08-08 EP EP96929241A patent/EP0847596B1/en not_active Expired - Lifetime
- 1996-08-08 WO PCT/EP1996/003559 patent/WO1997008751A1/en active IP Right Grant
- 1996-08-08 AU AU68725/96A patent/AU698261B2/en not_active Ceased
- 1996-08-08 IL IL12340996A patent/IL123409A/en not_active IP Right Cessation
- 1996-08-08 DE DE69631426T patent/DE69631426T2/de not_active Expired - Lifetime
- 1996-08-08 AT AT96929241T patent/ATE258718T1/de not_active IP Right Cessation
- 1996-08-08 JP JP50977397A patent/JP3912797B2/ja not_active Expired - Lifetime
- 1996-08-08 CN CNB961966424A patent/CN1139124C/zh not_active Expired - Lifetime
- 1996-08-12 US US08/695,508 patent/US5955733A/en not_active Expired - Lifetime
-
1997
- 1997-11-19 US US08/974,390 patent/US6163028A/en not_active Expired - Lifetime
-
1998
- 1998-02-04 NO NO980490A patent/NO980490L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| NO980490L (no) | 1998-04-28 |
| EP0847596A1 (en) | 1998-06-17 |
| GB2305096A (en) | 1997-03-26 |
| ATE258718T1 (de) | 2004-02-15 |
| EP0847596B1 (en) | 2004-01-28 |
| IL123409A0 (en) | 1998-09-24 |
| CN1194725A (zh) | 1998-09-30 |
| GB9605978D0 (en) | 1996-05-22 |
| AU6872596A (en) | 1997-03-19 |
| JP2001507862A (ja) | 2001-06-12 |
| DE69631426D1 (de) | 2004-03-04 |
| GB2305096B (en) | 1997-09-10 |
| US5955733A (en) | 1999-09-21 |
| AU698261B2 (en) | 1998-10-29 |
| CN1139124C (zh) | 2004-02-18 |
| US6163028A (en) | 2000-12-19 |
| DE69631426T2 (de) | 2005-01-27 |
| WO1997008751A1 (en) | 1997-03-06 |
| JP3912797B2 (ja) | 2007-05-09 |
| NO980490D0 (no) | 1998-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| EXP | Patent expired |