IL111473A - Architecture of flow of silicon wafers for process processing of silicon wafers - Google Patents

Architecture of flow of silicon wafers for process processing of silicon wafers

Info

Publication number
IL111473A
IL111473A IL11147394A IL11147394A IL111473A IL 111473 A IL111473 A IL 111473A IL 11147394 A IL11147394 A IL 11147394A IL 11147394 A IL11147394 A IL 11147394A IL 111473 A IL111473 A IL 111473A
Authority
IL
Israel
Prior art keywords
wafer
instrument
semiconductor wafers
metrology
master controller
Prior art date
Application number
IL11147394A
Other languages
English (en)
Hebrew (he)
Other versions
IL111473A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL111473A0 publication Critical patent/IL111473A0/xx
Publication of IL111473A publication Critical patent/IL111473A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
IL11147394A 1993-11-15 1994-10-31 Architecture of flow of silicon wafers for process processing of silicon wafers IL111473A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/153,236 US5474647A (en) 1993-11-15 1993-11-15 Wafer flow architecture for production wafer processing

Publications (2)

Publication Number Publication Date
IL111473A0 IL111473A0 (en) 1994-12-29
IL111473A true IL111473A (en) 1996-09-12

Family

ID=22546338

Family Applications (1)

Application Number Title Priority Date Filing Date
IL11147394A IL111473A (en) 1993-11-15 1994-10-31 Architecture of flow of silicon wafers for process processing of silicon wafers

Country Status (5)

Country Link
US (1) US5474647A (ja)
EP (1) EP0653780A1 (ja)
JP (1) JPH07312388A (ja)
IL (1) IL111473A (ja)
NO (1) NO944342L (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169015B2 (en) * 1995-05-23 2007-01-30 Nova Measuring Instruments Ltd. Apparatus for optical inspection of wafers during processing
IL113829A (en) * 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
US20070123151A1 (en) * 1995-05-23 2007-05-31 Nova Measuring Instruments Ltd Apparatus for optical inspection of wafers during polishing
US5701013A (en) * 1996-06-07 1997-12-23 Mosel Viltelic, Inc. Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements
US5841661A (en) * 1996-08-26 1998-11-24 Seh America, Inc. Wafer image (ADS) vision system to automated dimensioning equipment (ADE) communication interface system
US6030887A (en) * 1998-02-26 2000-02-29 Memc Electronic Materials, Inc. Flattening process for epitaxial semiconductor wafers
JP3363375B2 (ja) * 1998-03-18 2003-01-08 東京エレクトロン株式会社 基板搬送装置および基板処理装置
US6320609B1 (en) * 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US7295314B1 (en) * 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US20020158197A1 (en) * 1999-01-12 2002-10-31 Applied Materials, Inc AFM-based lithography metrology tool
DE19921244A1 (de) * 1999-05-07 2000-11-16 Siemens Ag Anlage zur Bearbeitung von Wafern
US6294469B1 (en) 1999-05-21 2001-09-25 Plasmasil, Llc Silicon wafering process flow
US6200908B1 (en) 1999-08-04 2001-03-13 Memc Electronic Materials, Inc. Process for reducing waviness in semiconductor wafers
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
IL132314A0 (en) * 1999-10-11 2001-03-19 Nova Measuring Instr Ltd An apparatus for in-cassette monitoring of semiconductor wafers
DE19952194A1 (de) * 1999-10-29 2001-05-17 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6133132A (en) * 2000-01-20 2000-10-17 Advanced Micro Devices, Inc. Method for controlling transistor spacer width
US6560506B2 (en) * 2000-12-04 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for control for semiconductor processing for reducing effects of environmental effects
US6641746B2 (en) * 2001-09-28 2003-11-04 Agere Systems, Inc. Control of semiconductor processing
JP3971603B2 (ja) * 2001-12-04 2007-09-05 キヤノンアネルバ株式会社 絶縁膜エッチング装置及び絶縁膜エッチング方法
TWI290901B (en) * 2003-06-23 2007-12-11 Au Optronics Corp Warehousing conveyor system
US20050098264A1 (en) * 2003-10-14 2005-05-12 Rudolph Technologies, Inc. Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method
US20100138566A1 (en) * 2008-11-30 2010-06-03 Rite Track Equipment Services, Inc. Control System for Legacy Computers Using Peripheral Devices
JP6150490B2 (ja) * 2012-10-19 2017-06-21 キヤノン株式会社 検出装置、露光装置、それを用いたデバイスの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2210996A (en) * 1987-10-09 1989-06-21 Plessey Co Plc Contents verification apparatus
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
JPH0810686B2 (ja) * 1990-09-14 1996-01-31 株式会社東芝 半導体基板エッチング処理装置
US5254830A (en) * 1991-05-07 1993-10-19 Hughes Aircraft Company System for removing material from semiconductor wafers using a contained plasma
US5179440A (en) * 1991-05-13 1993-01-12 Hughes Aircraft Company Rear projection facetted dome
US5291415A (en) * 1991-12-13 1994-03-01 Hughes Aircraft Company Method to determine tool paths for thinning and correcting errors in thickness profiles of films

Also Published As

Publication number Publication date
US5474647A (en) 1995-12-12
IL111473A0 (en) 1994-12-29
JPH07312388A (ja) 1995-11-28
NO944342L (no) 1995-05-16
EP0653780A1 (en) 1995-05-17
NO944342D0 (no) 1994-11-14

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Legal Events

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FF Patent granted
RH Patent void
MM9K Patent not in force due to non-payment of renewal fees