NO944342L - Anordning og fremgangsmåte for styring av strömmen av halvlederskiver gjennom en halvlederskive-prosessinnretning - Google Patents

Anordning og fremgangsmåte for styring av strömmen av halvlederskiver gjennom en halvlederskive-prosessinnretning

Info

Publication number
NO944342L
NO944342L NO944342A NO944342A NO944342L NO 944342 L NO944342 L NO 944342L NO 944342 A NO944342 A NO 944342A NO 944342 A NO944342 A NO 944342A NO 944342 L NO944342 L NO 944342L
Authority
NO
Norway
Prior art keywords
controlling
flow
processing device
wafer processing
semiconductor
Prior art date
Application number
NO944342A
Other languages
English (en)
Norwegian (no)
Other versions
NO944342D0 (no
Inventor
Sherman K Poultney
Peter B Mumola
Joseph P Prusak
George J Gardopee
Thomas J Mchugh
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of NO944342D0 publication Critical patent/NO944342D0/no
Publication of NO944342L publication Critical patent/NO944342L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
NO944342A 1993-11-15 1994-11-14 Anordning og fremgangsmåte for styring av strömmen av halvlederskiver gjennom en halvlederskive-prosessinnretning NO944342L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/153,236 US5474647A (en) 1993-11-15 1993-11-15 Wafer flow architecture for production wafer processing

Publications (2)

Publication Number Publication Date
NO944342D0 NO944342D0 (no) 1994-11-14
NO944342L true NO944342L (no) 1995-05-16

Family

ID=22546338

Family Applications (1)

Application Number Title Priority Date Filing Date
NO944342A NO944342L (no) 1993-11-15 1994-11-14 Anordning og fremgangsmåte for styring av strömmen av halvlederskiver gjennom en halvlederskive-prosessinnretning

Country Status (5)

Country Link
US (1) US5474647A (ja)
EP (1) EP0653780A1 (ja)
JP (1) JPH07312388A (ja)
IL (1) IL111473A (ja)
NO (1) NO944342L (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169015B2 (en) * 1995-05-23 2007-01-30 Nova Measuring Instruments Ltd. Apparatus for optical inspection of wafers during processing
IL113829A (en) * 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
US20070123151A1 (en) * 1995-05-23 2007-05-31 Nova Measuring Instruments Ltd Apparatus for optical inspection of wafers during polishing
US5701013A (en) * 1996-06-07 1997-12-23 Mosel Viltelic, Inc. Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements
US5841661A (en) * 1996-08-26 1998-11-24 Seh America, Inc. Wafer image (ADS) vision system to automated dimensioning equipment (ADE) communication interface system
US6030887A (en) * 1998-02-26 2000-02-29 Memc Electronic Materials, Inc. Flattening process for epitaxial semiconductor wafers
JP3363375B2 (ja) * 1998-03-18 2003-01-08 東京エレクトロン株式会社 基板搬送装置および基板処理装置
US6320609B1 (en) * 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US7295314B1 (en) * 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US20020158197A1 (en) * 1999-01-12 2002-10-31 Applied Materials, Inc AFM-based lithography metrology tool
DE19921244A1 (de) * 1999-05-07 2000-11-16 Siemens Ag Anlage zur Bearbeitung von Wafern
US6294469B1 (en) 1999-05-21 2001-09-25 Plasmasil, Llc Silicon wafering process flow
US6200908B1 (en) 1999-08-04 2001-03-13 Memc Electronic Materials, Inc. Process for reducing waviness in semiconductor wafers
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
IL132314A0 (en) * 1999-10-11 2001-03-19 Nova Measuring Instr Ltd An apparatus for in-cassette monitoring of semiconductor wafers
DE19952194A1 (de) * 1999-10-29 2001-05-17 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6133132A (en) * 2000-01-20 2000-10-17 Advanced Micro Devices, Inc. Method for controlling transistor spacer width
US6560506B2 (en) * 2000-12-04 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for control for semiconductor processing for reducing effects of environmental effects
US6641746B2 (en) * 2001-09-28 2003-11-04 Agere Systems, Inc. Control of semiconductor processing
JP3971603B2 (ja) * 2001-12-04 2007-09-05 キヤノンアネルバ株式会社 絶縁膜エッチング装置及び絶縁膜エッチング方法
TWI290901B (en) * 2003-06-23 2007-12-11 Au Optronics Corp Warehousing conveyor system
US20050098264A1 (en) * 2003-10-14 2005-05-12 Rudolph Technologies, Inc. Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method
US20100138566A1 (en) * 2008-11-30 2010-06-03 Rite Track Equipment Services, Inc. Control System for Legacy Computers Using Peripheral Devices
JP6150490B2 (ja) * 2012-10-19 2017-06-21 キヤノン株式会社 検出装置、露光装置、それを用いたデバイスの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2210996A (en) * 1987-10-09 1989-06-21 Plessey Co Plc Contents verification apparatus
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
JPH0810686B2 (ja) * 1990-09-14 1996-01-31 株式会社東芝 半導体基板エッチング処理装置
US5254830A (en) * 1991-05-07 1993-10-19 Hughes Aircraft Company System for removing material from semiconductor wafers using a contained plasma
US5179440A (en) * 1991-05-13 1993-01-12 Hughes Aircraft Company Rear projection facetted dome
US5291415A (en) * 1991-12-13 1994-03-01 Hughes Aircraft Company Method to determine tool paths for thinning and correcting errors in thickness profiles of films

Also Published As

Publication number Publication date
IL111473A (en) 1996-09-12
US5474647A (en) 1995-12-12
IL111473A0 (en) 1994-12-29
JPH07312388A (ja) 1995-11-28
EP0653780A1 (en) 1995-05-17
NO944342D0 (no) 1994-11-14

Similar Documents

Publication Publication Date Title
NO944342D0 (no) Anordning og fremgangsmåte for styring av strömmen av halvlederskiver gjennom en halvlederskive-prosessinnretning
EP0673545A4 (en) METHOD AND DEVICE FOR ETCHING SEMICONDUCTOR THROWERS.
DE69228020D1 (de) Einrichtung und Verfahren zur Kontrolle und Durchführung der Ätzung eines Wafers
EP0560617A3 (en) Method of manufacturing insulating film on semiconductor device and apparatus for carrying out the same
DE69213548T2 (de) Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen
AU7262596A (en) Method and apparatus for chemical processing semiconductor wafers
SG63637A1 (en) Apparatus and method for cleaning semiconductor wafers
KR950702144A (ko) 웨이퍼 연마 방법 및 장치(Wafer polishing method and apparatus)
EP0616360A3 (en) Device and method for cooling semiconductor wafers.
EP0408216A3 (en) Method for processing wafers and producing semiconductor devices and apparatus for producing the same
EP0704895A3 (en) Method of manufacturing a semiconductor device and a semiconductor substrate
EP0562127A4 (en) Method for fabrication of semiconductor device
EP0451471A3 (en) Method and apparatus for polishing a semiconductor wafer
DE69607547T2 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
EP0494311A4 (en) Method of inspecting semiconductor device, apparatus for inspecting the same, and method of manufacturing the same
FI935854A0 (fi) Puolijohteen, kuten piikiekon, prosessoinnissa käytettävä laitteisto ja menetelmä
GB2319633B (en) Developing device for semiconductor device fabrication and its controlling method
DE69119367T2 (de) Befestigungsmethode und -einrichtung für Wafer
EP0758941A4 (en) METHOD AND DEVICE FOR POLISHING A SEMICONDUCTOR DISC
SG49948A1 (en) Apparatus and method for semiconductor wafer edge inspection
EP0386447A3 (en) Apparatus and method for processing a semiconductor wafer
SG74007A1 (en) Apparatus and method for dicing semiconductor wafers
DE69217843T2 (de) Methode und Vorrichtung zum Ätzen des Randes einer Halbleiterscheibe
SG73498A1 (en) Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus
DE69403577T2 (de) Verfahren und Vorrichtung um sehr flache Wafer zu ätzen.