IE51961B1 - Process for producing a semiconductor structure - Google Patents

Process for producing a semiconductor structure

Info

Publication number
IE51961B1
IE51961B1 IE1591/80A IE159180A IE51961B1 IE 51961 B1 IE51961 B1 IE 51961B1 IE 1591/80 A IE1591/80 A IE 1591/80A IE 159180 A IE159180 A IE 159180A IE 51961 B1 IE51961 B1 IE 51961B1
Authority
IE
Ireland
Prior art keywords
silicon nitride
silicon
nitride film
film
producing
Prior art date
Application number
IE1591/80A
Other languages
English (en)
Other versions
IE801591L (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE801591L publication Critical patent/IE801591L/xx
Publication of IE51961B1 publication Critical patent/IE51961B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6316—Formation by nitridation, e.g. nitridation of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6518—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer
    • H10P14/6519—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer the substance being oxygen
    • H10P14/6522—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer the substance being oxygen introduced into a nitride material, e.g. changing SiN to SiON
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
IE1591/80A 1979-07-31 1980-07-30 Process for producing a semiconductor structure IE51961B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9765979A JPS5621372A (en) 1979-07-31 1979-07-31 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
IE801591L IE801591L (en) 1981-01-31
IE51961B1 true IE51961B1 (en) 1987-05-13

Family

ID=14198186

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1591/80A IE51961B1 (en) 1979-07-31 1980-07-30 Process for producing a semiconductor structure

Country Status (5)

Country Link
US (1) US4343657A (enFirst)
EP (1) EP0024125B1 (enFirst)
JP (1) JPS5621372A (enFirst)
DE (1) DE3071446D1 (enFirst)
IE (1) IE51961B1 (enFirst)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403394A (en) * 1980-12-17 1983-09-13 International Business Machines Corporation Formation of bit lines for ram device
JPS57113264A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Manufacture of mis type capacitor
US4397077A (en) * 1981-12-16 1983-08-09 Inmos Corporation Method of fabricating self-aligned MOS devices and independently formed gate dielectrics and insulating layers
US4486943A (en) * 1981-12-16 1984-12-11 Inmos Corporation Zero drain overlap and self aligned contact method for MOS devices
NL8202686A (nl) * 1982-07-05 1984-02-01 Philips Nv Werkwijze ter vervaardiging van een veldeffektinrichting met geisoleerde stuurelektrode, en inrichting vervaardigd volgens de werkwijze.
DE3329074A1 (de) * 1983-08-11 1985-02-28 Siemens AG, 1000 Berlin und 8000 München Verhinderung der oxidationsmitteldiffusion bei der herstellung von halbleiterschichtanordnungen
KR890004962B1 (ko) * 1985-02-08 1989-12-02 가부시끼가이샤 도오시바 반도체장치 및 그 제조방법
KR900000065B1 (ko) * 1985-08-13 1990-01-19 가부시끼가이샤 도오시바 독출전용 반도체기억장치와 그 제조방법
US5462767A (en) * 1985-09-21 1995-10-31 Semiconductor Energy Laboratory Co., Ltd. CVD of conformal coatings over a depression using alkylmetal precursors
JPS62198153A (ja) * 1986-02-26 1987-09-01 Nec Corp 半導体装置
GB2206994A (en) * 1987-06-08 1989-01-18 Philips Electronic Associated Semiconductor device
JPH01175260A (ja) * 1987-12-29 1989-07-11 Nec Corp 絶縁ゲート電界効果トランジスタの製造方法
US5874766A (en) * 1988-12-20 1999-02-23 Matsushita Electric Industrial Co., Ltd. Semiconductor device having an oxynitride film
US5291439A (en) * 1991-09-12 1994-03-01 International Business Machines Corporation Semiconductor memory cell and memory array with inversion layer
US5702967A (en) * 1996-07-22 1997-12-30 Vanguard International Semiconductor Corporation Method of fabricating a deep submicron MOSFET device using a recessed, narrow polysilicon gate structure
US5904523A (en) * 1996-10-03 1999-05-18 Lucent Technologies Inc. Process for device fabrication in which a layer of oxynitride is formed at low temperatures
US6995097B1 (en) * 1998-05-27 2006-02-07 Texas Instruments Incorporated Method for thermal nitridation and oxidation of semiconductor surface
US6177339B1 (en) 1998-08-27 2001-01-23 Micron Technology, Inc. Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
US6395623B1 (en) 1998-08-27 2002-05-28 Micron Technology, Inc. Semiconductor processing methods of forming a contact opening to a conductive line and methods of forming substrate active area source/drain regions
US6403442B1 (en) 1999-09-02 2002-06-11 Micron Technology, Inc. Methods of forming capacitors and resultant capacitor structures
WO2007136779A2 (en) * 2006-05-19 2007-11-29 New Jersey Institute Of Technology Aligned embossed diaphgragm based fiber optic sensor
US7561277B2 (en) * 2006-05-19 2009-07-14 New Jersey Institute Of Technology MEMS fiber optic microphone
WO2008100266A2 (en) * 2006-05-19 2008-08-21 New Jersey Institute Of Technology Mems fiber optic microphone

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621522U (de) 1950-02-12 1951-03-29 Siemens Ag Distanzstege fuer blechpakete elektrischer maschinen.
DE1644012B2 (de) * 1967-05-07 1976-08-12 Verfahren zum eindiffundieren von dotierungsstoff aus der gasphase in eine lokal mit einer siliciumnitridschicht maskierte halbleiteroberflaeche
DE1621522B2 (de) * 1967-05-13 1975-04-30 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Einbringen von nicht als Diffusionsmaske wirkenden Schichten oder von Öffnungen in eine, einen Halbleiterkörper bedeckende Siliziumnitridschicht
US3657030A (en) * 1970-07-31 1972-04-18 Bell Telephone Labor Inc Technique for masking silicon nitride during phosphoric acid etching
US3793090A (en) * 1972-11-21 1974-02-19 Ibm Method for stabilizing fet devices having silicon gates and composite nitride-oxide gate dielectrics
US3841918A (en) * 1972-12-01 1974-10-15 Bell Telephone Labor Inc Method of integrated circuit fabrication
US3867196A (en) * 1974-03-11 1975-02-18 Smc Microsystems Corp Method for selectively establishing regions of different surface charge densities in a silicon wafer
NL7506594A (nl) * 1975-06-04 1976-12-07 Philips Nv Werkwijze voor het vervaardigen van een halfge- leiderinrichting en halfgeleiderinrichting ver- vaardigd met behulp van de werkwijze.
US4105805A (en) * 1976-12-29 1978-08-08 The United States Of America As Represented By The Secretary Of The Army Formation of metal nitride oxide semiconductor (MNOS) by ion implantation of oxygen through a silicon nitride layer
US4158717A (en) * 1977-02-14 1979-06-19 Varian Associates, Inc. Silicon nitride film and method of deposition
US4217153A (en) * 1977-04-04 1980-08-12 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing semiconductor device
US4136434A (en) * 1977-06-10 1979-01-30 Bell Telephone Laboratories, Incorporated Fabrication of small contact openings in large-scale-integrated devices
GB2021863B (en) * 1978-05-26 1983-02-02 Rockwell International Corp Method of making integrated circuits
US4277881A (en) 1978-05-26 1981-07-14 Rockwell International Corporation Process for fabrication of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4221045A (en) 1978-06-06 1980-09-09 Rockwell International Corporation Self-aligned contacts in an ion implanted VLSI circuit
DE2967538D1 (en) * 1978-06-14 1985-12-05 Fujitsu Ltd Process for producing a semiconductor device having an insulating layer of silicon dioxide covered by a film of silicon oxynitride
DE2832388C2 (de) * 1978-07-24 1986-08-14 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von MNOS- und MOS-Transistoren in Silizium-Gate-Technologie auf einem Halbleitersubstrat
JPS5530846A (en) * 1978-08-28 1980-03-04 Hitachi Ltd Method for manufacturing fixed memory

Also Published As

Publication number Publication date
IE801591L (en) 1981-01-31
JPS6410107B2 (enFirst) 1989-02-21
DE3071446D1 (en) 1986-04-03
EP0024125A1 (en) 1981-02-25
JPS5621372A (en) 1981-02-27
US4343657A (en) 1982-08-10
EP0024125B1 (en) 1986-02-26

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