IE49684B1 - Systems for bonding pellets,for example semiconductor chips,to supports - Google Patents

Systems for bonding pellets,for example semiconductor chips,to supports

Info

Publication number
IE49684B1
IE49684B1 IE1200/80A IE120080A IE49684B1 IE 49684 B1 IE49684 B1 IE 49684B1 IE 1200/80 A IE1200/80 A IE 1200/80A IE 120080 A IE120080 A IE 120080A IE 49684 B1 IE49684 B1 IE 49684B1
Authority
IE
Ireland
Prior art keywords
pellet
disposition
bonding
tbe
stage
Prior art date
Application number
IE1200/80A
Other languages
English (en)
Other versions
IE801200L (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE801200L publication Critical patent/IE801200L/xx
Publication of IE49684B1 publication Critical patent/IE49684B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
IE1200/80A 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports IE49684B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Publications (2)

Publication Number Publication Date
IE801200L IE801200L (en) 1980-12-12
IE49684B1 true IE49684B1 (en) 1985-11-27

Family

ID=13526306

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1200/80A IE49684B1 (en) 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports

Country Status (3)

Country Link
JP (1) JPS55165643A (enExample)
GB (1) GB2056766B (enExample)
IE (1) IE49684B1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5896739A (ja) * 1981-12-04 1983-06-08 Toshiba Seiki Kk 半導体ペレツトのハイプリツドボンデイング方法
JPS59210647A (ja) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd ペレツトボンデイング装置
JPS61112336A (ja) * 1984-11-07 1986-05-30 Nec Corp ダイボンダ−
JPH0519953Y2 (enExample) * 1985-06-26 1993-05-25
JPS6237942A (ja) * 1985-08-13 1987-02-18 Matsushita Electronics Corp ペレツト位置決め装置
JPS6362241A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンデイング方法
JPS62162335A (ja) * 1986-11-07 1987-07-18 Toshiba Seiki Kk 半導体ペレツトのボンデイング装置
KR910006367B1 (ko) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 칩고정테이프
CH676695A5 (enExample) * 1988-05-19 1991-02-28 Bobst Sa
JPH027992A (ja) * 1988-06-27 1990-01-11 Brother Ind Ltd 柄合わせ加工機械
NL8900388A (nl) * 1989-02-17 1990-09-17 Philips Nv Werkwijze voor het verbinden van twee voorwerpen.
JPH02239637A (ja) * 1989-03-14 1990-09-21 Nec Corp 半導体装置の製造装置
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH0450517U (enExample) * 1990-09-05 1992-04-28
JPH0521544A (ja) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd バンプ付き半導体素子の測定方法および測定装置
DE4228012C2 (de) * 1992-08-24 1996-08-22 Siemens Ag Verfahren zum Beabstanden zweier Bauteile
JP2007158102A (ja) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd ボンディング装置
WO2009072659A1 (en) * 2007-12-03 2009-06-11 Panasonic Corporation Chip mounting system
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
CN116387209B (zh) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 芯片封装系统及芯片封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (enExample) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Also Published As

Publication number Publication date
GB2056766A (en) 1981-03-18
GB2056766B (en) 1984-04-26
JPS6318326B2 (enExample) 1988-04-18
JPS55165643A (en) 1980-12-24
IE801200L (en) 1980-12-12

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Legal Events

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