JPS55165643A - Device for bonding pellet - Google Patents

Device for bonding pellet

Info

Publication number
JPS55165643A
JPS55165643A JP7371979A JP7371979A JPS55165643A JP S55165643 A JPS55165643 A JP S55165643A JP 7371979 A JP7371979 A JP 7371979A JP 7371979 A JP7371979 A JP 7371979A JP S55165643 A JPS55165643 A JP S55165643A
Authority
JP
Japan
Prior art keywords
pellet
pedestal
reference position
relaying
picture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7371979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318326B2 (enExample
Inventor
Kyohei Tamaki
Naoki Sugao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7371979A priority Critical patent/JPS55165643A/ja
Priority to GB8018970A priority patent/GB2056766B/en
Priority to IE1200/80A priority patent/IE49684B1/en
Publication of JPS55165643A publication Critical patent/JPS55165643A/ja
Publication of JPS6318326B2 publication Critical patent/JPS6318326B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • H10P72/741—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Die Bonding (AREA)
JP7371979A 1979-06-12 1979-06-12 Device for bonding pellet Granted JPS55165643A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet
GB8018970A GB2056766B (en) 1979-06-12 1980-06-10 Systems for bonding pellets for exaple semiconductor chips to supports
IE1200/80A IE49684B1 (en) 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Publications (2)

Publication Number Publication Date
JPS55165643A true JPS55165643A (en) 1980-12-24
JPS6318326B2 JPS6318326B2 (enExample) 1988-04-18

Family

ID=13526306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7371979A Granted JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Country Status (3)

Country Link
JP (1) JPS55165643A (enExample)
GB (1) GB2056766B (enExample)
IE (1) IE49684B1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (ja) * 1981-12-04 1983-06-08 Toshiba Seiki Kk 半導体ペレツトのハイプリツドボンデイング方法
JPS59210647A (ja) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd ペレツトボンデイング装置
JPS61112336A (ja) * 1984-11-07 1986-05-30 Nec Corp ダイボンダ−
JPS625639U (enExample) * 1985-06-26 1987-01-14
JPS6237942A (ja) * 1985-08-13 1987-02-18 Matsushita Electronics Corp ペレツト位置決め装置
JPS62162335A (ja) * 1986-11-07 1987-07-18 Toshiba Seiki Kk 半導体ペレツトのボンデイング装置
JPH02239637A (ja) * 1989-03-14 1990-09-21 Nec Corp 半導体装置の製造装置
JP2007158102A (ja) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd ボンディング装置
JP2009246285A (ja) * 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd 部品実装装置
CN116387209A (zh) * 2023-06-06 2023-07-04 北京中科同志科技股份有限公司 芯片封装系统及芯片封装方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS6362241A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンデイング方法
KR910006367B1 (ko) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 칩고정테이프
CH676695A5 (enExample) * 1988-05-19 1991-02-28 Bobst Sa
JPH027992A (ja) * 1988-06-27 1990-01-11 Brother Ind Ltd 柄合わせ加工機械
NL8900388A (nl) * 1989-02-17 1990-09-17 Philips Nv Werkwijze voor het verbinden van twee voorwerpen.
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH0450517U (enExample) * 1990-09-05 1992-04-28
JPH0521544A (ja) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd バンプ付き半導体素子の測定方法および測定装置
DE4228012C2 (de) * 1992-08-24 1996-08-22 Siemens Ag Verfahren zum Beabstanden zweier Bauteile
WO2009072659A1 (en) * 2007-12-03 2009-06-11 Panasonic Corporation Chip mounting system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (enExample) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (enExample) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (ja) * 1981-12-04 1983-06-08 Toshiba Seiki Kk 半導体ペレツトのハイプリツドボンデイング方法
JPS59210647A (ja) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd ペレツトボンデイング装置
JPS61112336A (ja) * 1984-11-07 1986-05-30 Nec Corp ダイボンダ−
JPS625639U (enExample) * 1985-06-26 1987-01-14
JPS6237942A (ja) * 1985-08-13 1987-02-18 Matsushita Electronics Corp ペレツト位置決め装置
JPS62162335A (ja) * 1986-11-07 1987-07-18 Toshiba Seiki Kk 半導体ペレツトのボンデイング装置
JPH02239637A (ja) * 1989-03-14 1990-09-21 Nec Corp 半導体装置の製造装置
JP2007158102A (ja) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd ボンディング装置
JP2009246285A (ja) * 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd 部品実装装置
CN116387209A (zh) * 2023-06-06 2023-07-04 北京中科同志科技股份有限公司 芯片封装系统及芯片封装方法
CN116387209B (zh) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 芯片封装系统及芯片封装方法

Also Published As

Publication number Publication date
JPS6318326B2 (enExample) 1988-04-18
IE49684B1 (en) 1985-11-27
GB2056766A (en) 1981-03-18
GB2056766B (en) 1984-04-26
IE801200L (en) 1980-12-12

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